Cypress Semiconductor Corp S26KS128SDABHM030
- Part No.:
- S26KS128SDABHM030
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS128SDABHM030.pdf
- Description:
- IC FLASH 128MBIT PAR 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:878
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Product details
Overview
S26KS128SDABHM030 from Infineon is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and read-data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used in automotive ADAS domain controllers for fast boot code execution.
For engineers reviewing the S26KS128SDABHM030 datasheet, S26KS128SDABHM030 pinout, S26KS128SDABHM030 application, or S26KS128SDABHM030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 Grade 3 qualification status.
Technical Context
This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with CK/CK# enabling edge-aligned capture and RWDS providing read-data timing reference. Internal MIRRORBIT™ architecture enables dual-plane page access, supporting 32-byte aligned random reads with 5–16 clock-cycle initial latency.
The embedded algorithm controller (EAC) autonomously executes program/erase sequences-including 512-byte buffer programming (475 µs) and 256-KB sector erase (930 ms)-while the host interface controller (HIC) handles real-time signal synchronization, burst type selection (wrapped/linear/hybrid), and low-power mode transitions without wake-up overhead in active clock stop or standby modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - fixed capacity for boot firmware storage in resource-constrained embedded systems |
| Interface Protocol | HYPERRBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe for precise read timing |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1-byte bus width, enabling sub-50ms full-image boot load |
| Random Access Time | 96 ns - initial latency bound for first-word retrieval, critical for deterministic interrupt vector fetch |
| Power Modes | Deep Power-Down: 4 µA (typical) - enables ultra-low static current during system sleep without retention loss |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-implemented error handling for single-event upset resilience in automotive environments |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life requirements for telematics and gateway ECUs |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Defines DDR sampling edges; CK rising/falling edges align command/address writes, RWDS edges align read data output |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby (25 µA) or deep power-down (4 µA) |
| RWDS | Read data strobe output | Source-synchronous timing reference for host to latch DQ[7:0] during read bursts; not used in write operations |
| DQ[7:0] | Bi-directional DDR data bus | Carries commands, addresses, and 16-bit data on both clock edges; requires matched trace length for signal integrity |
| INT# | Interrupt output | Asserts on Busy→Ready transition or ECC error detection, enabling asynchronous host notification without polling |
| RSTO# | Reset output | Drives system-level POR signal; user-configurable LOW pulse duration supports custom power-rail sequencing |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces pin count vs. parallel NOR while sustaining 333 MBps read speed-enabling high-density flash in space-constrained PCB layouts |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte), linear, or hybrid bursts-allowing optimization of cache line fill efficiency and prefetch behavior per SoC architecture |
| 512-Byte Program Buffer | Enables 1 MBps effective write speed (vs. 4 KBps single-word), reducing firmware update time by >95% in OTA scenarios |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 256-KB sector-preventing accidental overwrite of bootloader or safety-critical configuration data |
| AEC-Q100 Grade 3 | Qualified for –40°C to +85°C operation with ISO/TS16949 manufacturing control-meeting functional safety requirements for ASIL-B systems |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and sensor fusion algorithms in centralized ADAS ECU with strict <100 ms cold-boot requirement. IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed via HYPERBUS™ interface; RWDS-synchronized DDR reads ensure deterministic instruction fetch timing. Use Value: 96 ns random access + 333 MBps sustained throughput enables full 8 MB boot image load in <25 ms, meeting ASIL-B startup timing budgets. | Use Scenario: Holding firmware and configuration data in modular PLC backplane modules requiring field-upgradable logic programs. IC Role / Device Role / Timing Role: Field-programmable flash memory with sector protection; INT# signals completion of 256-KB sector erase (930 ms) to host controller. Use Value: 100,000 erase cycles and 20-year retention support 15+ year product lifecycle with quarterly firmware updates. |
| Medical Imaging System Boot Memory | Avionics Display Unit Code Storage |
Use Scenario: Hosting boot loader and FPGA configuration bitstreams in portable ultrasound devices with battery-powered operation. IC Role / Device Role / Timing Role: Low-power flash memory with deep power-down (4 µA); RSTO# coordinates sequenced power-up of imaging SoC and display driver. Use Value: Ultra-low standby current extends battery life between clinical sessions; ECC prevents corrupted boot due to cosmic ray events. | Use Scenario: Storing certified flight display software in DO-254-compliant cockpit display units requiring tamper-proof firmware integrity. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified (–40°C to +105°C) flash with CRC and ECC for DO-178C Level A software verification traceability. Use Value: Hardware CRC generation validates firmware image checksum before execution, satisfying RTCA/DO-178C data integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KL128SDABHM020 | Same density and package; rated for 3.0 V I/O only (no differential clock), max 100 MHz / 200 MBps | Lacks RWDS-synchronized DDR timing; unsuitable for systems requiring sub-100 ns random access or 333 MBps throughput | Select when legacy 3.0 V interface compatibility is required and bandwidth demand ≤200 MBps |
| Winbond W25Q128JVSIM | Quad SPI interface, 133 MHz clock, no DDR or RWDS; 128 Mb density in 8-pin SOIC/WSON | Higher pin count, lower throughput (≈40 MBps quad IO), no ECC or AEC-Q100 qualification | Select for cost-sensitive consumer applications where AEC-Q100 and HYPERBUS™ timing are not required |
Compared with S26KS128SDABHM030, the Cypress alternative trades bandwidth and timing precision for 3.0 V compatibility, while the Winbond part replaces HYPERBUS™ complexity with simpler SPI but sacrifices automotive qualification, ECC, and deterministic read latency-making S26KS128SDABHM030 the sole choice for AEC-Q100 Grade 3 systems needing 333 MBps DDR throughput.
Availability
S26KS128SDABHM030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, medical imaging system boot memory, and avionics display unit code storage requiring stable component supply across extended product lifecycles.
Supply support for S26KS128SDABHM030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS16949.
The HYPERFLASH™ product line targets automotive and industrial applications requiring high-speed, low-pin-count, AEC-Q100-qualified NOR flash for deterministic boot and firmware execution in safety-critical systems.
FAQ
What is the minimum supported clock frequency for S26KS128SDABHM030?
The device supports variable clock rates down to DC (0 Hz) in active clock stop mode, where it maintains data integrity and responds to CS# assertion without wake-up delay. Functional operation begins at 1 MHz for standard read/write transactions, with guaranteed timing compliance across the full 1–166 MHz range per datasheet Table 12.2.
Does S26KS128SDABHM030 require external termination resistors on CK/CK# or RWDS lines?
Yes. Per Infineon's layout guidelines (Datasheet Section 15.1), 50 Ω series termination is required on CK and CK# near the memory device, and 50 Ω parallel AC-coupled termination (100 nF capacitor + 50 Ω resistor to VDDQ) is mandatory on RWDS to meet HYPERBUS™ signal integrity requirements for 166 MHz DDR operation.
How is the 512-byte program buffer utilized during write operations?
The buffer operates as a write-through cache: host writes 512 bytes to consecutive addresses in the buffer region, then issues a single program command. The embedded algorithm controller (EAC) automatically executes the full 512-byte programming sequence in 475 µs, eliminating per-word command overhead and achieving ~1 MBps effective write speed versus 4 KBps for single-word writes.
Can S26KS128SDABHM030 be used in systems without a HYPERBUS™-capable memory controller?
No. The device requires a HYPERBUS™-compliant master that supports DDR signaling on DQ[7:0], differential clock (CK/CK#), RWDS synchronization, and HYPERFLASH™-specific command encoding (e.g., 0x02 for buffer program, 0x20 for sector erase). Standard SPI, QSPI, or parallel NOR controllers cannot interface with this device.
S26KS128SDABHM030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS128SDABHM030 FAQ
1.How can I place an order for S26KS128SDABHM030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS128SDABHM030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS128SDABHM030 reliable?
The price and inventory of S26KS128SDABHM030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDABHM030 is usually 5 days.
3.What payment methods are accepted for S26KS128SDABHM030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDABHM030 transactions.
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4.How is shipping managed for S26KS128SDABHM030?
S26KS128SDABHM030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS128SDABHM030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS128SDABHM030?
For technical support, including S26KS128SDABHM030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDABHM030 requirements.
6.How does Aetrix verify that S26KS128SDABHM030 is sourced from the original manufacturer or authorized distributors?
All S26KS128SDABHM030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDABHM030 meets industry standards.
7.What is the process for return or replacement of S26KS128SDABHM030?
All S26KS128SDABHM030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDABHM030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS128SDABHM030 part is unused and in its original packaging.
Return procedure for S26KS128SDABHM030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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