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Cypress Semiconductor Corp S26KS128SDABHN030

Part No.:
S26KS128SDABHN030
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS128SDABHN030.pdf
Description:
IC FLASH 128MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,148

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Product details

Overview

S26KS128SDABHN030 from Infineon Technologies is a 128 Mb (16 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive-grade AEC-Q100 Grade 2 compliance.

For engineers reviewing the S26KS128SDABHN030 datasheet, S26KS128SDABHN030 pinout, S26KS128SDABHN030 application, or S26KS128SDABHN030 equivalent, this page provides verified technical context for high-speed boot code storage, real-time firmware execution, and ECC-protected embedded memory systems requiring deterministic latency and low-power deep power-down modes.

Technical Context

The device implements a DDR center-aligned read strobe (DCARS) architecture where command/address and data are transferred over the same 8-bit DQ bus using double-data-rate timing referenced to CK/CK#. Read transactions use either wrapped (16/32/64-byte) or linear burst modes, with initial random access latency of 5–16 clock cycles and 96 ns tACC.

Internally, it separates host interface control (HIC) from embedded algorithm control (EAC), enabling autonomous program/erase execution without host intervention. ECC provides 1-bit correction and 2-bit detection, while CRC supports integrity verification during configuration and data transfers.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - fixed capacity for compact boot image and firmware storage
Interface StandardHYPERRBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe
Max Read Throughput333 MBps - achieved at 166 MHz clock with 2× DDR on DQ[7:0]
Random Access Time96 ns tACC - enables fast instruction fetch in real-time MCU boot sequences
Erase Granularity256-KB uniform sectors + optional eight 4-KB parameter sectors - supports secure firmware update partitioning
Data IntegrityECC 1-bit correction / 2-bit detection + CRC - ensures reliability in safety-critical automotive applications
Power ModesDeep Power-Down: 4 µA (typical); Standby: 25 µA; Active Clock Stop Read: 12 mA - reduces system idle power without wake-up latency

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for DDR timing; enables precise edge-aligned sampling of DQ and RWDS
CS#Chip select (active-low)Enables device communication; must be asserted for all command, address, and data transfers
RWDSRead data strobe outputIndicates valid read data on DQ; synchronized to CK edges during read bursts
DQ[7:0]Bi-directional data busCarries commands, addresses, and 16-bit data in DDR fashion (2 transfers/clock cycle)
INT#Interrupt outputSignals Busy-to-Ready transition or ECC error detection event to host controller
RSTO#Reset outputGenerates system-level power-on reset pulse; duration user-configurable via register

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces signal count vs. parallel NOR while sustaining >300 MBps read - ideal for space-constrained SoC boot interfaces
Configurable Burst ModeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line alignment and prefetch efficiency
512-byte Program BufferEnables 1 MBps effective write speed via buffer programming - cuts firmware update time by ~20× vs. single-word writes
AEC-Q100 Grade 2 QualificationValidated for –40°C to +105°C operation with ISO/TS16949 process control - meets functional safety requirements for ADAS ECUs
Volatile & Non-volatile Sector ProtectionPrevents accidental overwrite of boot code or calibration data via hardware-locked or software-configurable sector locks

Applications

Automotive ADAS ECU Boot MemoryIndustrial PLC Firmware Storage

Use Scenario: Storing boot loader and safety-critical firmware in radar processing units requiring <100 ns read latency and AEC-Q100 Grade 2 compliance.

IC Role / Device Role / Timing Role: Primary non-volatile code execution memory interfaced directly to ARM Cortex-R5F core via HYPERBUS™ master.

Use Value: 333 MBps read throughput eliminates wait states during real-time instruction fetch; ECC ensures ASIL-B fault containment.

Use Scenario: Holding field-upgradable firmware and configuration data in modular programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: High-reliability flash storage with sector protection and 20-year data retention for mission-critical control logic.

Use Value: Deep power-down mode (4 µA) extends battery backup runtime; 100,000 program/erase cycles support frequent firmware updates.

Medical Imaging System Code StorageAvionics Display Controller Memory

Use Scenario: Hosting diagnostic boot images and real-time image processing microcode in portable ultrasound devices with strict thermal and power budgets.

IC Role / Device Role / Timing Role: Low-latency, low-power NOR flash used as XIP (eXecute-In-Place) memory for FPGA-based imaging pipeline initialization.

Use Value: 96 ns tACC and 12 mA active clock-stop read enable rapid cold start without DRAM warm-up delay.

Use Scenario: Storing certified display firmware and font assets in DO-178C-compliant cockpit display units requiring deterministic boot timing and radiation-tolerant data integrity.

IC Role / Device Role / Timing Role: Certified non-volatile memory with CRC and ECC for avionics boot ROM and configuration registers.

Use Value: CRC validation on power-up prevents corrupted firmware execution; RSTO# output synchronizes system reset with memory readiness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY15B104QN-PSOC4 Mb Quad SPI FRAM; no erase latency, unlimited endurance, but max 40 MBps read speedBest for frequent small-write logging; unsuitable for XIP or high-throughput boot codeSelect only when write-cycle endurance >1012 and zero write latency outweigh bandwidth needs
S26KL128SDABHN020Same 128 Mb density and package, but 3.0 V I/O (not 1.8 V), single-ended clock, 200 MBps max readCompatible with legacy 3.0 V HYPERBUS™ masters lacking differential clock supportChoose when interfacing with older MCU platforms or cost-sensitive industrial designs without 1.8 V I/O capability

Compared with CY15B104QN-PSOC, S26KS128SDABHN030 delivers 8× higher read bandwidth and true XIP capability but requires erase cycles. Against S26KL128SDABHN020, it enables higher performance and lower power at 1.8 V while demanding differential clock routing.

Availability

S26KS128SDABHN030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging systems, and avionics display controllers requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for S26KS128SDABHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS16949.

This device belongs to Infineon's HYPERFLASH™ family - engineered specifically for high-speed, low-pin-count boot memory in safety-critical embedded systems where DDR throughput, ECC integrity, and AEC-Q100 compliance are mandatory.

FAQ

What is the minimum supported clock frequency for S26KS128SDABHN030?

The device supports clock frequencies down to DC (0 Hz) in standby and deep power-down modes. For active read/write operations, the minimum operational clock rate is 1 MHz, as specified in the AC characteristics table of the official datasheet (Rev. *Q, Section 12.2). This allows flexible timing adaptation in low-power or variable-frequency host systems.

Does S26KS128SDABHN030 support XIP (eXecute-In-Place) operation?

Yes - the device supports true XIP via its synchronous HYPERBUS™ DDR interface and deterministic 96 ns random access time. Host processors with integrated HYPERBUS™ masters (e.g., certain NXP S32K/S32G or Infineon AURIX™ MCUs) can execute code directly from the flash array without copying to RAM, reducing boot latency and memory footprint.

How is the RSTO# output configured for different reset pulse widths?

RSTO# pulse duration is set via the Configuration Register (CR) bits [11:8], allowing user-selectable LOW periods from 1 ms to 128 ms in powers of two. The setting persists across power cycles and is non-volatile. Configuration occurs through standard HYPERFLASH™ command sequences (e.g., Write to Configuration Register command 60h).

Can S26KS128SDABHN030 operate with a single-ended clock instead of differential CK/CK#?

No - this specific variant (S26KS128SDABHN030) is designated for 1.8 V I/O operation and requires differential CK/CK# signaling per the HYPERBUS™ specification. Single-ended clock support is only available in the 3.0 V variants (e.g., S26KL128S series), which use CK only and lack CK#.

S26KS128SDABHN030 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS128SDABHN030 FAQ

1.How can I place an order for S26KS128SDABHN030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDABHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDABHN030 reliable?

The price and inventory of S26KS128SDABHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDABHN030 is usually 5 days.

3.What payment methods are accepted for S26KS128SDABHN030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDABHN030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS128SDABHN030?

S26KS128SDABHN030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDABHN030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDABHN030?

For technical support, including S26KS128SDABHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDABHN030 requirements.

6.How does Aetrix verify that S26KS128SDABHN030 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDABHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDABHN030 meets industry standards.

7.What is the process for return or replacement of S26KS128SDABHN030?

All S26KS128SDABHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDABHN030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDABHN030 part is unused and in its original packaging.

Return procedure for S26KS128SDABHN030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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