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Cypress Semiconductor Corp S26KS128SDGBHN030

Part No.:
S26KS128SDGBHN030
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS128SDGBHN030.pdf
Description:
IC FLASH 128MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:752

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Product details

Overview

S26KS128SDGBHN030 from Infineon Technologies is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and read-data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.

For engineers reviewing the S26KS128SDGBHN030 datasheet, S26KS128SDGBHN030 pinout, S26KS128SDGBHN030 application, or S26KS128SDGBHN030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive infotainment boot storage.

Technical Context

This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with RWDS edge-aligned to data transitions during reads and CK/CK# used for capture timing. Internal MIRRORBIT™ architecture enables parallel half-page access and linear burst prefetching to sustain 333 MBps throughput.

The embedded algorithm controller (EAC) autonomously executes program/erase sequences upon host command write; no external timing control is required for sector erase (930 ms typical) or buffer programming (475 µs for 512 B). ECC and CRC support operate transparently during read operations without host intervention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - fixed capacity for boot code and firmware storage in resource-constrained systems
Interface ProtocolHYPERTBUS™ DDR - 8-bit bidirectional data bus with CK/CK# differential clock and RWDS strobe for precise read timing
Max Read Throughput333 MBps - achieved via dual-edge 8-bit transfers at 166 MHz, enabling fast application loading
Random Access Time96 ns - initial latency for first word retrieval, critical for real-time interrupt vector fetch
Operating Voltage1.8 V I/O, 3.0 V core - low-voltage signaling reduces EMI and power consumption in high-speed designs
Endurance & Retention100,000 program/erase cycles / 20-year data retention - validated for long-life industrial control firmware updates
Power ModesDeep Power-Down: 4 µA (typical) - enables ultra-low standby in always-on automotive modules

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputDefines DDR sampling edges; CK rising/falling edges align command/address writes; CK#/CK differential pair rejects common-mode noise
CS#Chip select (active low)Enables device communication; HIGH places device in standby (25 µA) or deep power-down (4 µA)
RWDSRead data strobe outputEdge-aligned with read data on DQ[7:0]; signals valid data windows during burst reads - no internal delay compensation needed
DQ[7:0]Bidirectional DDR data busCarries commands, addresses, and 16-bit data on both clock edges; requires matched trace lengths for signal integrity
INT#Interrupt outputAsserted on ECC error detection or busy-to-ready transition - enables asynchronous host response without polling
RSTO#Reset outputUser-configurable LOW pulse duration for system-level power-on reset coordination with SoC boot sequencer

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces pin count vs. parallel NOR while sustaining 333 MBps - cuts PCB layer count and routing complexity in automotive ADAS hosts
Configurable Burst ModeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for ARM Cortex-A/R cores
Embedded Algorithm Controller (EAC)Executes full sector erase (930 ms) and buffer programming (475 µs) autonomously - eliminates host firmware overhead for flash management
Hardware Data ProtectionVolatile/non-volatile sector locking plus 1024-byte OTP array - secures bootloader partitions against unauthorized overwrite in certified ECUs
AEC-Q100 Grade 3Qualified for –40°C to +85°C operation with ISO/TS16949 process control - meets functional safety requirements for instrument cluster firmware storage

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alert logic, and OTA update images in digital dashboards.

IC Role / Device Role / Timing Role: Boot-time NOR flash providing deterministic <96 ns vector fetch and 333 MBps firmware load to ARM Cortex-R5F.

Use Value: AEC-Q100 Grade 3 qualification ensures reliable operation across thermal cycling; ECC prevents silent corruption of safety-critical display assets.

Use Scenario: Holding ladder logic firmware, I/O configuration tables, and field-upgradable motion control algorithms.

IC Role / Device Role / Timing Role: Non-volatile code storage with hardware sector protection to prevent accidental overwrite during runtime reconfiguration.

Use Value: 256-KB uniform sectors enable atomic firmware swaps; deep power-down (4 µA) extends battery backup runtime during AC loss events.

Medical Imaging Boot LoaderAvionics Display System

Use Scenario: Hosting secure boot ROM and diagnostic self-test routines in portable ultrasound and MRI console controllers.

IC Role / Device Role / Timing Role: Trusted execution environment (TEE) root-of-trust storage with 1-bit ECC correction and CRC validation on every read.

Use Value: 20-year data retention guarantees firmware integrity over equipment lifecycle; OTP array stores cryptographic keys immune to field reprogramming.

Use Scenario: Caching flight navigation maps, synthetic vision textures, and HUD symbology assets in certified cockpit displays.

IC Role / Device Role / Timing Role: High-bandwidth code/data repository interfaced to FPGA-based HYPERBUS™ master for sub-100 ns latency access.

Use Value: Linear burst prefetching sustains 333 MBps texture streaming; RSTO# output synchronizes display subsystem reset with aircraft power-up sequence.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KL128SDHBHI020Same density and HYPERBUS™ interface, but 3.0 V I/O only (no 1.8 V option); lacks AEC-Q100 grade 3 certificationRestricted to industrial temperature range only; not qualified for automotive ECU deploymentSelect when board-level voltage rails are fixed at 3.0 V and automotive qualification is unnecessary
Winbond W25Q128JVSIMQuad SPI interface (not HYPERBUS™ DDR); max 133 MHz clock, 66 MBps throughput; no RWDS or differential clockRequires host-side timing margining for QSPI; unsuitable for deterministic low-latency boot pathsChoose for cost-sensitive consumer IoT where pin count and bandwidth are secondary to BOM simplicity

Compared with S26KL128SDHBHI020 and W25Q128JVSIM, the S26KS128SDGBHN030 uniquely combines automotive-grade reliability, DDR-level throughput, and hardware ECC in a 24-ball footprint-making it the only option for safety-critical, high-bandwidth boot storage in modern vehicle platforms.

Availability

S26KS128SDGBHN030 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics display systems requiring stable component supply across extended product lifecycles.

Supply support for S26KS128SDGBHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and security applications.

The HYPERFLASH™ product line targets high-reliability embedded systems needing fast, deterministic boot and firmware storage with minimal pin count-specifically designed for next-generation automotive ECUs and industrial controllers demanding AEC-Q100 compliance and 20-year data retention.

FAQ

What is the minimum supported clock frequency for S26KS128SDGBHN030?

The device supports variable clock rates down to DC for command execution, but sustained DDR read operations require ≥1 MHz to maintain RWDS synchronization. The datasheet specifies timing parameters for 100 MHz (3.0 V) and 166 MHz (1.8 V) operation; lower frequencies are permitted with adjusted tACC and latency values derived from the AC characteristics table.

Does S26KS128SDGBHN030 support execute-in-place (XIP) operation?

Yes, it supports XIP directly from the HYPERBUS™ interface. The DDR protocol enables continuous instruction fetch without CPU intervention, and the 96 ns random access time ensures low-latency vector table reads. Host must configure burst mode and address alignment per the HYPERBUS™ protocol specification to avoid pipeline stalls.

How is the 512-byte program buffer utilized during write operations?

The buffer accepts up to 512 bytes of data in a single write transaction, then internally programs all data in one optimized operation taking ~475 µs. This reduces host overhead versus single-word programming (500 µs per 2 bytes) and improves effective write throughput to ~1 MBps, critical for firmware update efficiency.

Can INT# be used to detect ECC-correctable errors only, or also uncorrectable ones?

INT# asserts for both 1-bit correctable and 2-bit detectable ECC errors. The host reads the status register to determine error type: bit 1 (ECCERR) indicates correction occurred; bit 0 (ECCFAIL) indicates detection of uncorrectable error. No separate interrupt flag exists-software must decode the register after each INT# assertion.

S26KS128SDGBHN030 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS128SDGBHN030 FAQ

1.How can I place an order for S26KS128SDGBHN030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDGBHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDGBHN030 reliable?

The price and inventory of S26KS128SDGBHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDGBHN030 is usually 5 days.

3.What payment methods are accepted for S26KS128SDGBHN030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDGBHN030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS128SDGBHN030?

S26KS128SDGBHN030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDGBHN030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDGBHN030?

For technical support, including S26KS128SDGBHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDGBHN030 requirements.

6.How does Aetrix verify that S26KS128SDGBHN030 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDGBHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDGBHN030 meets industry standards.

7.What is the process for return or replacement of S26KS128SDGBHN030?

All S26KS128SDGBHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDGBHN030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDGBHN030 part is unused and in its original packaging.

Return procedure for S26KS128SDGBHN030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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