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Cypress Semiconductor Corp S26KS256SDGBHM030

Part No.:
S26KS256SDGBHM030
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS256SDGBHM030.pdf
Description:
IC FLASH 256MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:948

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Product details

Overview

S26KS256SDGBHM030 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sectors and optional 4-KB parameter sectors, and operates across industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.

For engineers reviewing the S26KS256SDGBHM030 datasheet, S26KS256SDGBHM030 pinout, S26KS256SDGBHM030 application, or S26KS256SDGBHM030 equivalent, key selection criteria include DDR HYPERBUS™ timing compliance, RWDS-synchronized read latency (96 ns tACC), ECC 1-bit correction/2-bit detection, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive infotainment boot storage.

Technical Context

This device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. The MIRRORBIT™ memory array enables 16-bit word-wide addressing and page-based access with half-page alignment on 16-byte boundaries.

HYPERBUS™ protocol uses center-aligned command/address and edge-aligned read data relative to RWDS transitions. Burst modes-wrapped (16/32/64 bytes) or linear-are configurable per transaction, and DCARS (DDR Center Aligned Read Strobe) ensures precise timing alignment during high-speed reads at 166 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mb (32 MB) - supports full firmware image storage for mid-tier microcontrollers and SoCs.
InterfaceHYPERTBUS™ DDR with 8-bit DQ bus, CK/CK# differential clock, RWDS read strobe - reduces pin count vs. parallel NOR while sustaining 333 MBps read bandwidth.
Read Throughput333 MBps @ 166 MHz (1.8 V) - enables sub-100 ms boot time for 32 MB firmware images.
Access Time96 ns random read access - defines minimum latency for first-word retrieval after address setup.
ECC Support1-bit correction / 2-bit detection - protects against single-bit errors in critical boot code without external logic.
Power ModesDeep Power-Down: 4 µA (typical); Standby: 25 µA - extends battery life in always-on automotive modules.
Endurance & Retention100,000 program/erase cycles; 20-year data retention - meets long-life requirements for telematics and ADAS ECUs.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides timing reference for DDR command/address/data capture; enables jitter-tolerant 166 MHz operation.
CS#Chip select (active-low)Enables device communication; must be asserted before any transaction and held active during burst.
RWDSRead data strobe outputIndicates valid read data windows; edges align with DQ transitions during read bursts.
DQ[7:0]Bi-directional data busTransfers 8-bit DDR data on both clock edges; carries commands, addresses, and 16-bit words in byte-paired format.
INT#Interrupt outputAsserts on ECC error detection or busy-to-ready transition - enables host polling elimination.
RSTO#Reset outputGenerates system-level power-on reset pulse; duration user-configurable via register.

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 12 pins (vs. >40 for legacy parallel NOR), enabling compact PCB layout in space-constrained automotive modules.
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for ARM Cortex-A/R cores.
512-byte program bufferEnables 1 MBps write throughput via buffer programming - cuts firmware update time by 2× vs. single-word writes.
Advanced sector protectionVolatile and non-volatile locking per 256-KB sector - prevents accidental overwrite of bootloader or calibration data in field-deployed units.
AEC-Q100 Grade 3Qualified for –40°C to +85°C operation with ISO/TS16949 manufacturing - meets functional safety requirements for instrument cluster and body control units.

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Stores boot code, GUI assets, and configuration data for real-time display rendering in digital dashboards.

IC Role / Device Role / Timing Role: Primary non-volatile code execution memory interfaced directly to MCU's HYPERBUS™ controller.

Use Value: 333 MBps read speed ensures <80 ms boot-to-display; ECC prevents corrupted graphics rendering due to alpha particle strikes.

Use Scenario: Holds firmware, ladder logic, and I/O mapping tables for programmable logic controllers operating in factory automation environments.

IC Role / Device Role / Timing Role: High-reliability code storage with sector-level write protection to prevent unauthorized firmware modification.

Use Value: 100,000 erase cycles and 20-year retention ensure 15+ years of unattended operation without field replacement.

ADAS Camera Module Boot MemoryMedical Imaging System Configuration Store

Use Scenario: Stores boot loader and sensor initialization firmware for automotive surround-view camera systems requiring rapid startup.

IC Role / Device Role / Timing Role: Low-latency (96 ns tACC), high-bandwidth memory enabling deterministic boot within 100 ms after power-on.

Use Value: Deep power-down mode (4 µA) minimizes standby drain in parked-vehicle monitoring scenarios.

Use Scenario: Retains calibration profiles, DICOM metadata templates, and regulatory compliance settings across power cycles in portable ultrasound devices.

IC Role / Device Role / Timing Role: Secure, tamper-resistant non-volatile storage with one-time-programmable (OTP) 1024-byte array for cryptographic keys.

Use Value: Sector protection and CRC integrity checks prevent accidental corruption of FDA-mandated calibration data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS256SDABHI020Same density and HYPERBUS™ interface but 3.0 V I/O (not 1.8 V); 100 MHz max clock; no AEC-Q100 grade 3 certification.Targeted at industrial control systems without automotive qualification needs.Select when 3.0 V I/O compatibility is required and AEC-Q100 is not mandated.
Winbond W25Q256JWSIQQuad SPI interface (not HYPERBUS™ DDR); 133 MHz clock; 50 MBps read; no RWDS or differential clock.Suitable for cost-sensitive consumer electronics where pin count and bandwidth are less critical.Select only if host lacks HYPERBUS™ controller and design can accept 6× lower read throughput.

Compared with S26KS256SDGBHM030, the Cypress alternative trades automotive qualification and 1.8 V low-power operation for broader voltage compatibility, while the Winbond part sacrifices HYPERBUS™ bandwidth and timing precision for SPI simplicity and lower BOM cost.

Availability

S26KS256SDGBHM030 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS camera modules, industrial PLCs, and medical imaging systems requiring stable component supply, AEC-Q100 compliance, and high-throughput non-volatile code storage.

Supply support for S26KS256SDGBHM030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to Infineon's HYPERFLASH™ product line, engineered specifically for high-speed, low-pin-count boot and code storage in automotive and industrial systems demanding deterministic timing and long-term reliability.

FAQ

What is the minimum wake-up time from Deep Power-Down mode?

The S26KS256SDGBHM030 requires 300 µs to exit Deep Power-Down mode and resume normal operation. During this period, CS# must remain HIGH and CK must be stable; no commands are accepted until the device signals readiness via INT# deassertion or internal status register polling.

Does this device support linear burst reads across page boundaries?

Yes - in linear burst mode, the device automatically fetches the next sequential page from the MIRRORBIT™ array while bursting out the current page, enabling continuous 333 MBps throughput without host intervention or address reprogramming between pages.

How is ECC handled during read operations?

ECC checking occurs transparently during every read access. If a 1-bit error is detected, it is corrected in real time and the corrected data is output; if a 2-bit error is detected, the INT# pin asserts and the status register flags the error - no data corruption occurs, but software must handle the unrecoverable condition.

Can RSTO# be disabled or repurposed?

No - RSTO# is a dedicated open-drain output that cannot be disabled or reassigned. Its LOW pulse duration is configurable via a non-volatile register (default 100 ms), and it asserts automatically after power-on reset or when triggered by specific command sequences, ensuring reliable system-level reset coordination.

S26KS256SDGBHM030 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS256SDGBHM030 FAQ

1.How can I place an order for S26KS256SDGBHM030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS256SDGBHM030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS256SDGBHM030 reliable?

The price and inventory of S26KS256SDGBHM030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDGBHM030 is usually 5 days.

3.What payment methods are accepted for S26KS256SDGBHM030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDGBHM030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS256SDGBHM030?

S26KS256SDGBHM030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS256SDGBHM030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS256SDGBHM030?

For technical support, including S26KS256SDGBHM030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDGBHM030 requirements.

6.How does Aetrix verify that S26KS256SDGBHM030 is sourced from the original manufacturer or authorized distributors?

All S26KS256SDGBHM030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDGBHM030 meets industry standards.

7.What is the process for return or replacement of S26KS256SDGBHM030?

All S26KS256SDGBHM030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDGBHM030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS256SDGBHM030 part is unused and in its original packaging.

Return procedure for S26KS256SDGBHM030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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