Cypress Semiconductor Corp S26KS256SDPBHM020
- Part No.:
- S26KS256SDPBHM020
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS256SDPBHM020.pdf
- Description:
- IC FLASH 256MBIT PAR 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:170
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Product details
Overview
S26KS256SDPBHM020 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sectors and optional 4-KB parameter sectors, and operates across –40°C to +105°C (Industrial Plus grade).
For engineers reviewing the S26KS256SDPBHM020 datasheet, S26KS256SDPBHM020 pinout, S26KS256SDPBHM020 application, or S26KS256SDPBHM020 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-synchronized DDR read latency (96 ns tACC), ECC 1-bit correction/2-bit detection, and FBGA-24 package compatibility with high-density embedded boot memory layouts.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfers, while Embedded Algorithm Controller (EAC) executes non-volatile programming/erase sequences autonomously. It uses MIRRORBIT™ technology for 16-bit word-wide addressing and page-aligned 32-byte random reads with configurable burst lengths (16/32/64 bytes).
HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers; RWDS output is edge-aligned to CK/CK# transitions during reads, and initial access latency ranges from 5–16 clock cycles depending on configuration. DCARS (DDR Center Aligned Read Strobe) ensures precise timing alignment between host and memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - supports full firmware image storage for mid-tier microcontrollers and SoCs. |
| Interface | HYPERTBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK#, RWDS, CS#, RSTO#, INT# - reduces pin count vs parallel NOR. |
| Max Read Throughput | 333 MBps - achieved at 166 MHz clock with 2× data per cycle on DQ[7:0], enabling fast boot and XIP execution. |
| Random Access Time | 96 ns tACC - defines minimum time from CS# assertion to first valid data, critical for low-latency code fetch. |
| ECC Support | 1-bit correction / 2-bit detection - hardware-implemented error handling for system-level data integrity without CPU overhead. |
| Operating Temperature | –40°C to +105°C (Industrial Plus) - qualified for extended thermal environments in industrial gateways and motor drives. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life requirements for field-deployed firmware storage. |
Pinout & Package
Package: 24-ball Fortified Ball Grid Array (FBGA), 5 mm × 5 mm × 1.0 mm (VAA024), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides timing reference for DDR data capture; CK# is true complement - required for 1.8 V operation. |
| CS# | Chip select (active-low) | Enables device communication; HIGH places device in standby or deep power-down mode. |
| RWDS | Read data strobe output | Indicates valid read data windows; edge-aligned to CK/CK# transitions - used only during reads. |
| DQ[7:0] | Bi-directional data bus | Transfers commands, addresses, and 8-bit data on both clock edges; supports 16-bit word accesses via DDR. |
| RSTO# | Reset output (open-drain) | Generates system-level power-on reset pulse; LOW period user-configurable via internal register. |
| INT# | Interrupt output (open-drain) | Signals Busy→Ready transition or ECC error detection - enables asynchronous host notification. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes sequential code fetch or data streaming. |
| Low-power modes | Deep power-down draws only 4 µA (typical); active clock stop during read consumes 12 mA - extends battery life in always-on systems. |
| Hardware data protection | Volatile and non-volatile sector protection plus 1024-byte one-time-programmable array - prevents accidental firmware overwrite. |
| HYPERBUS™ timing compliance | Meets strict setup/hold and skew requirements for CK/CK# and RWDS relative to DQ - ensures reliable high-speed signaling at 166 MHz. |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and safety-critical application code for radar processing units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to ARM Cortex-R5F-based SoC via HYPERBUS™ controller. Use Value: 333 MBps read speed enables sub-100 ms cold boot; ECC and sector protection ensure ASIL-B compliant firmware integrity. | Use Scenario: Holds field-upgradable control logic and HMI assets in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Standalone firmware repository accessed via FPGA-based HYPERBUS™ master with deterministic timing control. Use Value: 256-KB uniform erase sectors allow atomic firmware updates; –40°C to +105°C rating ensures reliability in uncooled enclosures. |
| 5G Baseband Unit Code Storage | Medical Imaging System Configuration Memory |
Use Scenario: Stores DSP firmware and calibration tables in remote radio heads where thermal cycling and vibration tolerance are critical. IC Role / Device Role / Timing Role: High-bandwidth code memory supporting XIP execution from HYPERBUS™-enabled multi-core baseband processor. Use Value: 96 ns random access time minimizes instruction cache misses; 20-year retention guarantees long-term calibration stability. | Use Scenario: Retains device-specific calibration parameters and regulatory-compliant boot images in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store with hardware write protection and ECC-enabled read verification. Use Value: One-time-programmable 1024-byte array stores cryptographic keys; AEC-Q100 Grade 1 option supports –40°C to +125°C extended medical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S26KS256SDPBHI020 | Same density and interface, but rated for Industrial (–40°C to +85°C) instead of Industrial Plus (–40°C to +105°C); identical timing and package. | Not qualified for extended thermal environments; unsuitable for under-hood automotive or high-ambient industrial deployments. | Select when ambient temperature remains ≤85°C and cost optimization is prioritized over thermal margin. |
| S26KL256SDPBHM020 | 3.0 V I/O variant with single-ended clock (CK only), 100 MHz max clock (200 MBps), same 256 Mb density and FBGA-24 package. | Lacks differential clock and RWDS timing precision; lower bandwidth limits XIP performance in latency-sensitive systems. | Select only if host controller lacks HYPERBUS™ differential clock support or system design mandates 3.0 V signaling compatibility. |
Compared with S26KS256SDPBHI020 and S26KL256SDPBHM020, the S26KS256SDPBHM020 uniquely combines 166 MHz DDR performance, 105°C operation, and differential clock robustness-making it optimal for thermally demanding, high-throughput embedded boot applications where timing margin and longevity are critical.
Availability
S26KS256SDPBHM020 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, 5G baseband units, and medical imaging systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S26KS256SDPBHM020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.
This part belongs to the HYPERFLASH™ family - designed specifically to replace parallel NOR flash in high-performance embedded systems by delivering DDR-speed throughput with minimal pin count and robust reliability for mission-critical firmware storage.
FAQ
What is the purpose of the RWDS signal in S26KS256SDPBHM020?
RWDS (Read Data Strobe) is an output signal that indicates valid read data windows during HYPERBUS™ DDR read operations. It is edge-aligned to CK/CK# transitions and used exclusively for read timing synchronization - not for write operations. The host uses RWDS edges to sample DQ[7:0] data reliably at 166 MHz, ensuring accurate data capture despite signal skew.
Does S26KS256SDPBHM020 support in-system programming without external high voltage?
Yes. The device integrates an Embedded Algorithm Controller (EAC) that executes all program and erase operations autonomously using standard 1.8 V supply. No external VPP or high-voltage generator is required - commands are written to specific address locations, and the EAC handles voltage boosting, timing, and verification internally.
How does the 512-byte program buffer improve write efficiency?
The 512-byte write buffer allows up to 512 bytes of data to be loaded into an internal latch before initiating a single programming operation. This reduces per-byte overhead: buffer programming achieves ~1 MBps throughput versus 4 KBps for single-word writes, cutting total firmware update time by over 250× for typical 32 KB images.
Can S26KS256SDPBHM020 be used in place of legacy parallel NOR flash?
No direct drop-in replacement exists due to architectural differences: HYPERBUS™ uses multiplexed DDR signaling over 8 pins versus parallel NOR's 32+ pin wide bus. Successful migration requires host controller support for HYPERBUS™ protocol, RWDS timing, and command set - not just pin mapping. FPGA or SoC must implement HYPERBUS™ master logic.
S26KS256SDPBHM020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS256SDPBHM020 FAQ
1.How can I place an order for S26KS256SDPBHM020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS256SDPBHM020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS256SDPBHM020 reliable?
The price and inventory of S26KS256SDPBHM020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS256SDPBHM020 is usually 5 days.
3.What payment methods are accepted for S26KS256SDPBHM020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS256SDPBHM020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS256SDPBHM020?
S26KS256SDPBHM020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS256SDPBHM020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS256SDPBHM020?
For technical support, including S26KS256SDPBHM020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS256SDPBHM020 requirements.
6.How does Aetrix verify that S26KS256SDPBHM020 is sourced from the original manufacturer or authorized distributors?
All S26KS256SDPBHM020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS256SDPBHM020 meets industry standards.
7.What is the process for return or replacement of S26KS256SDPBHM020?
All S26KS256SDPBHM020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS256SDPBHM020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS256SDPBHM020 part is unused and in its original packaging.
Return procedure for S26KS256SDPBHM020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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