Cypress Semiconductor Corp S26KS512SDGBHB030
- Part No.:
- S26KS512SDGBHB030
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS512SDGBHB030.pdf
- Description:
- IC FLASH 512MBIT PAR 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:735
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Product details
Overview
S26KS512SDGBHB030 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used for high-speed boot code storage in automotive ADAS controllers.
For engineers reviewing the S26KS512SDGBHB030 datasheet, S26KS512SDGBHB030 pinout, S26KS512SDGBHB030 application, or S26KS512SDGBHB030 equivalent, key selection criteria include DDR HYPERBUS™ timing compliance, RWDS-synchronized read latency (96 ns tACC), sector protection granularity, deep power-down current (8 µA), and AEC-Q100 grade 3 qualification for automotive use.
Technical Context
This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with read data edge-aligned to RWDS transitions and clock edges referenced to CK/CK#. The embedded algorithm controller (EAC) manages all program/erase operations autonomously using internal command sequences-no external microcode required.
It uses MIRRORBIT™ architecture enabling 16-bit word-wide accesses on 16-byte-aligned boundaries, with initial random access requiring 5–16 clock cycles and burst modes configurable as wrapped (16/32/64 bytes) or linear. DCARS (DDR Center-Aligned Read Strobe) ensures precise timing alignment between host and memory during high-speed reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full boot image + firmware partitioning for complex automotive ECUs |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK#, RWDS strobe, CS#, and RSTO#/INT# control signals |
| Max Read Throughput | 333 MBps - achieved via dual-edge 8-bit transfers at 166 MHz (1.8 V), enabling sub-200 ms boot time for 64 MB images |
| Random Access Time | 96 ns tACC - defines minimum delay from CS# assertion to first valid data on DQ, critical for real-time interrupt response |
| Erase/Program Endurance | 100,000 cycles - validated for over-the-air (OTA) update logging in telematics gateways |
| Data Retention | 20 years - guaranteed at +85°C, ensuring long-term reliability in engine bay-mounted modules |
| Power Modes | Deep Power-Down: 8 µA (typical); Standby: 25 µA - enables ultra-low quiescent current in always-on vehicle networks |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR sampling of command/address/data; enables jitter-tolerant 166 MHz operation |
| CS# | Chip select (active low) | Enables device communication; must be asserted before any transaction and held stable during burst |
| RWDS | Read data strobe output | Source-synchronous timing signal for DQ read data; edge-aligned to data transitions, not clock |
| DQ[7:0] | Bi-directional data bus | Carries commands, addresses, and 8-bit data on both clock edges; requires matched trace lengths for DDR integrity |
| INT# | Interrupt output | Asserted on ECC error detection or busy-to-ready transition; used for asynchronous host notification |
| RSTO# | Reset output | User-configurable active-low reset pulse for system power-on initialization; driven after VCC stabilization |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces signal count to 12 pins (vs. 40+ for parallel NOR), simplifying PCB routing and improving EMI performance in dense automotive layouts |
| Configurable Burst Mode | Supports wrapped (16/32/64 byte) or linear bursts per transaction-enables optimal cache-line alignment for ARM Cortex-R5/R7 boot fetchers |
| Embedded Algorithm Controller (EAC) | Executes autonomous erase/program without host CPU intervention-reduces firmware overhead and eliminates timing-critical software drivers |
| Hardware ECC & CRC | 1-bit correction / 2-bit detection on read, plus CRC for command integrity-meets ISO 26262 ASIL-B requirements for safety-critical storage |
| Volatile/Non-volatile Sector Protection | Per-sector lock bits programmable in-system or via OTP-prevents accidental overwrite of bootloader or calibration data in field-deployed ECUs |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code, sensor fusion algorithms, and real-time OS for front-camera-based lane departure warning systems. IC Role / Device Role / Timing Role: High-speed non-volatile code execution memory interfaced directly to ARM Cortex-A72 application processor via HYPERBUS™. Use Value: 333 MBps read throughput reduces boot latency by >40% vs. QSPI NOR, enabling <150 ms cold start for ASIL-B compliant systems. | Use Scenario: Holds firmware, configuration tables, and runtime logs in modular I/O controllers deployed in factory automation cells. IC Role / Device Role / Timing Role: Primary firmware storage with hardware ECC and sector-level write protection for deterministic field updates. Use Value: 100,000 program/erase cycles and 20-year retention ensure 15+ year service life without degradation in unattended operation. |
| Telematics Control Unit (TCU) | Medical Imaging System Boot Memory |
Use Scenario: Hosts secure boot ROM, OTA update staging area, and cryptographic key storage in cellular-connected vehicle gateways. IC Role / Device Role / Timing Role: Dual-role memory supporting fast sequential reads (boot) and robust small-block writes (firmware patches). Use Value: Deep power-down mode (8 µA) extends battery backup runtime during ignition-off periods while preserving update state. | Use Scenario: Stores certified boot loader and diagnostic firmware in FDA-cleared MRI subsystem controllers requiring zero-field failure tolerance. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified (–40°C to +105°C) flash providing deterministic startup under thermal stress conditions. Use Value: RSTO# output synchronizes system reset with VCC ramp, eliminating race conditions during medical-grade power sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KL512SDHBHI10 | Same die, identical electrical specs, but packaged in 24-ball FBGA with industrial temp (–40°C to +85°C) only-no AEC-Q100 grade | Lacks automotive qualification; unsuitable for safety-critical vehicle networks requiring ASIL-B evidence | Select only for cost-sensitive industrial designs where AEC-Q100 is not mandated |
| Macronix MX25L51245GZC | Quad SPI interface (4-wire), max 133 MHz, 50 MBps read speed; no DDR, no RWDS, no differential clock | Lower pin count but significantly slower throughput; requires host-side command translation and lacks hardware ECC | Choose only when board space is extremely constrained and boot performance <200 MBps is acceptable |
Compared with S26KL512SDHBHI10, this part adds AEC-Q100 Grade 3 qualification and extended temperature support; versus MX25L51245GZC, it delivers 6.6× higher read bandwidth and integrated ECC-critical for functional safety and real-time boot in automotive and medical systems.
Availability
S26KS512SDGBHB030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for S26KS512SDGBHB030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and quality certifications including ISO/TS 16949.
This device belongs to the HYPERFLASH™ family-designed specifically for high-bandwidth, low-pin-count boot memory in automotive and industrial real-time systems requiring deterministic startup and long-term data integrity.
FAQ
What is the purpose of the RWDS signal in S26KS512SDGBHB030?
RWDS (Read Data Strobe) is an output signal synchronized to read data transitions on DQ[7:0]. Unlike a clock, it pulses only during active read bursts and aligns data edges-not clock edges-ensuring reliable capture under variable propagation delays. It is not used during write operations and cannot be disabled.
Does S26KS512SDGBHB030 support both 1.8 V and 3.0 V I/O operation?
No-S26KS512SDGBHB030 is a 1.8 V I/O variant only, indicated by the "S" suffix and differential CK/CK# signaling. The 3.0 V version (e.g., S26KS512SDGBHA030) uses single-ended CK and different timing parameters; mixing voltage variants risks interface failure.
How does the Embedded Algorithm Controller (EAC) affect firmware development?
The EAC executes erase and program operations autonomously after receiving host commands, eliminating the need for polling loops or timing-critical delay routines in driver code. Developers issue standard HYPERBUS™ commands and wait for INT# assertion or status register flags-reducing driver complexity and improving update reliability.
Can S26KS512SDGBHB030 be used in linear burst mode for continuous streaming applications?
Yes-linear burst mode enables uninterrupted sequential reads across page boundaries, with automatic prefetch of the next page during current burst output. This sustains 333 MBps throughput for large contiguous data blocks such as firmware images or video buffer loading in imaging subsystems.
S26KS512SDGBHB030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS512SDGBHB030 FAQ
1.How can I place an order for S26KS512SDGBHB030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS512SDGBHB030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS512SDGBHB030 reliable?
The price and inventory of S26KS512SDGBHB030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDGBHB030 is usually 5 days.
3.What payment methods are accepted for S26KS512SDGBHB030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDGBHB030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS512SDGBHB030?
S26KS512SDGBHB030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS512SDGBHB030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS512SDGBHB030?
For technical support, including S26KS512SDGBHB030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDGBHB030 requirements.
6.How does Aetrix verify that S26KS512SDGBHB030 is sourced from the original manufacturer or authorized distributors?
All S26KS512SDGBHB030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDGBHB030 meets industry standards.
7.What is the process for return or replacement of S26KS512SDGBHB030?
All S26KS512SDGBHB030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDGBHB030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS512SDGBHB030 part is unused and in its original packaging.
Return procedure for S26KS512SDGBHB030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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