Cypress Semiconductor Corp S26KS512SDGBHV030
- Part No.:
- S26KS512SDGBHV030
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KS512SDGBHV030.pdf
- Description:
- FLASH - NOR MEMORY IC 512MB (64M
- Quantity:
- Payment:

- Shipping:

Inventory:257
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S26KS512SDGBHV030 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase and 4-KB parameter sectors, and operates across –40°C to +105°C (Industrial Plus grade). Used in high-performance boot code storage for automotive ADAS controllers.
For engineers reviewing the S26KS512SDGBHV030 datasheet, S26KS512SDGBHV030 pinout, S26KS512SDGBHV030 application, or S26KS512SDGBHV030 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-synchronized DDR read latency (96 ns tACC), ECC 1-bit correction/2-bit detection capability, and FBGA-24 package compatibility with high-density PCB routing constraints.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes non-volatile program/erase operations autonomously. All command/address/data transfers occur over the same 8-bit DQ bus using DDR edge-aligned protocol.
It supports configurable burst modes-wrapped (16/32/64 bytes) or linear-with initial random access latency of 5–16 clock cycles and 96 ns tACC. RWDS output is strictly used as read-data strobe (not for write), synchronized to CK/CK# transitions during read bursts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full boot image + firmware partitioning for complex microcontrollers |
| Interface Standard | HYPERTBUS™ DDR - 8-bit DQ bus with differential CK/CK#, enabling 2× data rate per clock cycle |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte = sustained linear burst performance |
| Random Access Time | 96 ns tACC - defines minimum delay from CS# assertion to first valid data on DQ under worst-case conditions |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-implemented error handling without host CPU overhead |
| Operating Temp Range | –40°C to +105°C (Industrial Plus) - qualified for engine bay and ADAS ECU environments |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-life automotive firmware update requirements |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR sampling of command/address/data; enables precise timing margin control in high-speed layouts |
| CS# | Chip select (active low) | Enables device communication; must be asserted before any transaction and held stable during burst |
| RWDS | Read data strobe output | Indicates valid DQ data windows during reads only; edge-aligned to CK/CK# transitions |
| DQ[7:0] | Bi-directional DDR data bus | Carries commands, addresses, and 8-bit data on both clock edges; requires matched trace length for signal integrity |
| INT# | Interrupt output | Asserts on ECC detection or busy-to-ready transition; enables asynchronous host notification without polling |
| RSTO# | Reset output | Generates system-level power-on reset pulse; duration configurable via non-volatile register |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Reduces pin count vs. parallel NOR while sustaining >300 MBps read - critical for space-constrained automotive modules |
| Configurable burst mode | Supports wrapped (cache-friendly) or linear (streaming) bursts - selectable per transaction for optimal host DMA alignment |
| 512-byte program buffer | Enables 1 MBps effective programming rate - cuts firmware update time by ~2× vs. single-word writes |
| Hardware ECC & CRC | Eliminates need for external error-checking logic or software overhead in safety-critical boot paths |
| Multiple power-down modes | Deep power-down draws only 8 µA (typical) - extends battery life in always-on vehicle subsystems |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, safety monitor, and sensor fusion firmware in radar/EPS ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary non-volatile code execution memory interfaced directly to ARM Cortex-R5F MCU via HYPERBUS™ controller. Use Value: 333 MBps read speed enables sub-100 ms boot time; ECC ensures ASIL-B compliance without software mitigation. | Use Scenario: Holds field-upgradable control logic and HMI assets in modular automation controllers operating continuously at 70°C ambient. IC Role / Device Role / Timing Role: High-reliability firmware repository with sector protection preventing accidental overwrite during remote updates. Use Value: 100,000-cycle endurance and 20-year retention guarantee firmware integrity over 15+ year product lifecycle. |
| 5G Baseband Radio Unit | Medical Imaging System Boot Memory |
Use Scenario: Stores FPGA configuration bitstreams and real-time DSP firmware in O-RAN RU units requiring rapid cold-start recovery. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth flash accessed via Xilinx Zynq UltraScale+ PS side HYPERBUS™ IP. Use Value: 96 ns tACC and 5–16 cycle latency enable deterministic boot sequence timing critical for 5G TDD synchronization. | Use Scenario: Hosts certified diagnostic firmware and calibration tables in FDA-cleared MRI/PET subsystems with strict data integrity mandates. IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with one-time-programmable (OTP) array for cryptographic keys. Use Value: Hardware ECC + CRC + OTP array satisfies IEC 62304 Class C software storage requirements without external security IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14X108L-BAI | 8-MB nvSRAM with 100-MHz parallel interface; no DDR or RWDS; volatile + backup capacitor | Used where fast write persistence is prioritized over density; unsuitable for boot code due to size limit | Select only when sub-100 ns write latency and instant write capability outweigh density and ECC needs |
| S26KL512SDHBV020 | Same 512 Mb density and FBGA-24 package but 3.0 V I/O (not 1.8 V); max 100 MHz clock; 200 MBps read | Compatible with legacy 3.0 V systems lacking 1.8 V I/O rails; lower bandwidth but broader voltage tolerance | Choose for cost-sensitive industrial designs where 200 MBps suffices and 3.0 V supply simplifies BOM |
Compared with CY14X108L-BAI and S26KL512SDHBV020, S26KS512SDGBHV030 uniquely combines 1.8 V DDR interface, 333 MBps throughput, and automotive-grade ECC - making it the only option for new ADAS platforms requiring both speed and functional safety.
Availability
S26KS512SDGBHV030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and 5G radio unit boot applications requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for S26KS512SDGBHV030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
This part belongs to Infineon's HYPERFLASH™ family - designed specifically for replacing parallel NOR flash in bandwidth-constrained, safety-critical embedded systems where DDR interface efficiency and hardware ECC are mandatory.
FAQ
What is the purpose of the RWDS signal in S26KS512SDGBHV030?
RWDS is a read-data strobe output that indicates valid data windows on the DQ[7:0] bus during read operations only. It is edge-aligned to CK/CK# transitions and used by the host to sample data accurately. RWDS is not active during write operations, and its timing is defined in the HYPERBUS™ specification to ensure setup/hold margin in high-speed layouts.
Does S26KS512SDGBHV030 support both 1.8 V and 3.0 V I/O operation?
No - S26KS512SDGBHV030 is a 1.8 V I/O variant only, with differential CK/CK# and 12-signal HYPERBUS™ interface. The 3.0 V I/O version is a separate part number (e.g., S26KL512SDHBV020) with single-ended clock and 11-signal interface. Mixing voltages risks damage and violates absolute maximum ratings.
How does the 512-byte program buffer improve firmware update performance?
The internal 512-byte buffer allows up to 512 bytes to be loaded into cache before initiating a write, reducing per-byte overhead. Measured performance shows ~1 MBps effective programming rate - approximately twice as fast as single-word programming - significantly cutting OTA update time in automotive and industrial gateways.
Is RSTO# output configurable, and what is its default behavior?
Yes - RSTO# duration is user-configurable via non-volatile register bits. By default, it asserts a 100-ms LOW pulse after power-on reset, meeting typical SoC reset timing requirements. The pulse width can be adjusted to 10 ms, 100 ms, or 1 s depending on host processor specifications, and settings persist across power cycles.
S26KS512SDGBHV030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- HYPERFLASH™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KS512SDGBHV030 FAQ
1.How can I place an order for S26KS512SDGBHV030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KS512SDGBHV030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KS512SDGBHV030 reliable?
The price and inventory of S26KS512SDGBHV030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS512SDGBHV030 is usually 5 days.
3.What payment methods are accepted for S26KS512SDGBHV030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS512SDGBHV030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KS512SDGBHV030?
S26KS512SDGBHV030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KS512SDGBHV030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KS512SDGBHV030?
For technical support, including S26KS512SDGBHV030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS512SDGBHV030 requirements.
6.How does Aetrix verify that S26KS512SDGBHV030 is sourced from the original manufacturer or authorized distributors?
All S26KS512SDGBHV030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS512SDGBHV030 meets industry standards.
7.What is the process for return or replacement of S26KS512SDGBHV030?
All S26KS512SDGBHV030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS512SDGBHV030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KS512SDGBHV030 part is unused and in its original packaging.
Return procedure for S26KS512SDGBHV030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S26KS512SDGBHV030 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

