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Infineon Technologies S29GL01GS11FAIV23
- Part No.:
- S29GL01GS11FAIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11FAIV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,772
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Product details
Overview
S29GL01GS11FAIV23 from Spansion is a 1 Gbit (128 MByte) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 110 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection with lowest-address sector protected configuration and DYB power-up in unprotected state under Read Password Mode, targeting boot code storage in industrial control systems.
For engineers reviewing the S29GL01GS11FAIV23 datasheet, S29GL01GS11FAIV23 pinout, S29GL01GS11FAIV23 application, or S29GL01GS11FAIV23 equivalent, key selection criteria include verified 110 ns read timing, VIO/VCC flexibility (1.65–3.6 V I/O, 2.7–3.6 V core), sector-locking behavior, password-protected read access, and industrial-grade BGA reliability for embedded firmware storage.
Technical Context
This device implements a parallel asynchronous interface with x16 data bus width and standard JEDEC-compatible command set for program/erase operations. It integrates embedded algorithms for automatic write and erase sequencing, including sector erase, chip erase, and byte/word programming with built-in error detection and status polling support.
The memory array is organized as 8,388,608 words × 16 bits, partitioned into 256 uniform sectors of 64 KWord each. Sector protection is implemented via hardware lock bits and software-controlled Data Protection Bits (DYB), with configurable power-up state and password-enabled read access per ordering option V23.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gbit (128 MByte), enabling full boot image + firmware storage in single-package solution |
| Access Time | 110 ns max, defining worst-case CPU wait-state requirement for 80 MHz bus operation |
| Supply Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC, supporting mixed-voltage system interfacing |
| Operating Temp | –40°C to +85°C industrial grade, qualifying for factory automation and outdoor edge nodes |
| Package | LAA064 Fortified BGA (11 mm × 13 mm), providing mechanical robustness and thermal performance for reflow-soldered PCBs |
| Sector Protection | Lowest-address sector protected + DYB power-up unprotected + Read Password Mode, enforcing secure firmware read access control |
| Bus Width | x16 parallel interface, matching common microcontroller external memory bus architectures |
Pinout & Package
Package: Fortified Ball-Grid Array (LAA064), 64-ball, 11 mm × 13 mm body, 0.8 mm pitch, RoHS-compliant Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit address bus supporting full 1 Gbit addressing (A0–A22 valid; A23–A24 unused) |
| DQ0–DQ15 | Data Input/Output | x16 bidirectional data bus compatible with Intel-style or AMD-style command sets |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory subsystems |
| OE# | Output Enable | Active-low control for data bus tristate; required for read cycle timing compliance |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithm execution |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling completion of embedded operations |
| VCC | Core Power Supply | 2.7–3.6 V supply powering memory array and logic; decoupling required per JEDEC layout guidelines |
| VIO | I/O Power Supply | 1.65–VCC supply setting I/O voltage level independently from core, enabling mixed-voltage interfacing |
Key Features
| Feature | Design Value |
|---|---|
| MirrorBit Eclipse Technology | 65 nm process enabling 1 Gbit density in compact BGA with reduced power consumption vs prior generations |
| Hardware Sector Protection | Dedicated lock bits per sector prevent accidental overwrite of critical boot code without explicit unlock sequence |
| Data Protection Bits (DYB) | Software-configurable bits allowing dynamic sector locking/unlocking with power-up state defined by V23 option |
| Read Password Mode | Two-byte password verification required before reading protected sectors, enforcing firmware IP confidentiality |
| JEDEC Standard Commands | Compatible with industry-standard CFI query and command sets, simplifying driver porting across NOR platforms |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Loader |
|---|---|
Use Scenario: Storing certified boot firmware and real-time control logic in programmable logic controllers deployed in factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory mapped to processor's external bus, delivering deterministic 110 ns read latency during cold start and firmware updates. Use Value: Industrial temperature rating and sector-locking ensure firmware integrity across 10+ year deployments without field corruption. | Use Scenario: Hosting FDA-cleared boot loader and diagnostic self-test routines in portable ultrasound and infusion pumps requiring tamper-resistant firmware access. IC Role / Device Role / Timing Role: Secure read-only memory with password-enforced access, preventing unauthorized firmware extraction while maintaining fast boot response. Use Value: Read Password Mode and DYB configuration (V23) enforce regulatory compliance for firmware confidentiality and version control. |
| Ruggedized Network Edge Router | Avionics Ground Support Equipment |
Use Scenario: Holding bootloader, OS kernel, and configuration tables in outdoor telecom edge routers exposed to thermal cycling and vibration. IC Role / Device Role / Timing Role: High-reliability NOR Flash providing error-free instruction fetch during power-on reset and field firmware upgrades over serial interface. Use Value: Fortified BGA package withstands mechanical stress; 110 ns access enables sub-100 ms boot time for rapid service restoration. | Use Scenario: Storing calibration data, test scripts, and safety-critical diagnostics in ground-based avionics maintenance tools used in hangar environments. IC Role / Device Role / Timing Role: Nonvolatile configuration store with hardware-locked sectors protecting calibration constants from accidental overwrite. Use Value: Lowest-address sector protection (V23) safeguards factory-set parameters while permitting field-updatable application logic in upper sectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S29GL01GP11FAIV23 | Same density and package, but uses older 90 nm MirrorBit process; 110 ns access time identical, but higher active current (30 mA vs 25 mA typical) | Lower thermal dissipation requirement in dense PCB layouts | Select when legacy qualification or cost sensitivity outweighs power efficiency needs |
| Infineon HYF010G01S11F | 1 Gbit, 110 ns, same LAA064 BGA, but lacks Read Password Mode and DYB; uses standard sector protection only | No firmware confidentiality enforcement; requires external security controller for IP protection | Select for cost-optimized designs where firmware IP is managed at system level, not device level |
Compared with S29GL01GS11FAIV23, the Cypress alternative offers proven maturity but higher power draw, while the Infineon part reduces bill-of-materials complexity but removes on-die password security-making S29GL01GS11FAIV23 optimal for applications requiring integrated, hardware-enforced firmware confidentiality.
Availability
S29GL01GS11FAIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot loader implementation, and ruggedized network edge router design requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS11FAIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion Inc. was a leading semiconductor company specializing in flash memory solutions, later acquired by Cypress Semiconductor in 2015 and integrated into Infineon Technologies' memory portfolio.
The S29GL-S family was designed specifically for high-reliability embedded boot code storage, emphasizing sector-level data protection, industrial temperature resilience, and JEDEC-standard interoperability in space-constrained applications.
FAQ
What does the 'V23' suffix indicate in S29GL01GS11FAIV23?
The 'V23' suffix specifies three configuration attributes: VIO/VCC voltage range (VIO = 1.65–VCC, VCC = 2.7–3.6 V), lowest-address sector hardware protection, and Data Protection Bits (DYB) initialized to unprotected state at power-up with Read Password Mode enabled. This combination ensures secure, flexible firmware access control out-of-reset.
Is S29GL01GS11FAIV23 pin-compatible with earlier S29GL01GS variants?
Yes, all S29GL01GS devices in LAA064 BGA share identical pinout and footprint. The '11' speed grade and 'V23' option affect only internal configuration and timing-not physical connectivity-enabling drop-in replacement where 110 ns access and V23 security features are required.
Does this device support both Intel and AMD command sets?
Yes, S29GL01GS11FAIV23 supports both command sets via CFI (Common Flash Interface) query table identification. The device auto-detects host command protocol during initialization, allowing seamless integration with processors using either Intel Extended or AMD/Fujitsu command sets without hardware modification.
What is the maximum endurance and data retention specification?
Per Spansion documentation, S29GL01GS11FAIV23 guarantees 100,000 program/erase cycles per sector and 20-year data retention at 85°C, validated under JEDEC JESD22-A117 conditions. These values apply to all sectors when operated within specified VCC, temperature, and timing limits.
S29GL01GS11FAIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS11FAIV23 FAQ
1.How can I place an order for S29GL01GS11FAIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11FAIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11FAIV23 reliable?
The price and inventory of S29GL01GS11FAIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11FAIV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11FAIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11FAIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11FAIV23?
S29GL01GS11FAIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11FAIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11FAIV23?
For technical support, including S29GL01GS11FAIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11FAIV23 requirements.
6.How does Aetrix verify that S29GL01GS11FAIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11FAIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11FAIV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11FAIV23?
All S29GL01GS11FAIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11FAIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11FAIV23 part is unused and in its original packaging.
Return procedure for S29GL01GS11FAIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS11FAIV23 Tags
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