Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL01GS12FHIV10

Name: S29GL01GS12FHIV10
Brand: Cypress Semiconductor Corp
SKU: S29GL01GS12FHIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL01GS12FHIV10

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS12FHIV10.pdf

Description:: FLASH - NOR MEMORY IC 1GB (64M X

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:739

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL01GS12FHIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial and automotive systems, it supports asynchronous read, 512-byte buffer programming, and uniform 128-kbyte sector erase.

For engineers reviewing the S29GL01GS12FHIV10 datasheet, S29GL01GS12FHIV10 pinout, S29GL01GS12FHIV10 application, or S29GL01GS12FHIV10 equivalent, key selection criteria include its 1 Gb density, 2.7–3.6 V single-supply operation, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and support for suspend/resume during program/erase.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), 32-byte page reads, and hardware-managed ECC on all program/erase operations. Its embedded algorithm controller (EAC) executes autonomous sector erase and buffer programming without host CPU intervention.

The GL-S architecture separates address decoding (X/Y-decoder), voltage generation (PGM/erase), and status monitoring (RY/BY#, status register, data polling) into dedicated logic blocks. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, and includes a dedicated 1024-byte OTP array with two lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB); enables full boot image + firmware storage in single device
Interface	Parallel ×16 asynchronous; supports direct XIP execution without external buffering
Access Time	90 ns random / 15 ns page; meets real-time boot latency requirements for microcontrollers
Programming Buffer	512 bytes; reduces effective write time by >3× vs. single-word programming
ECC	On-the-fly single-bit correction; eliminates need for external error-handling firmware
Endurance & Retention	100,000 program/erase cycles / 20-year data retention; qualified for long-life industrial deployments
Operating Temp	–40°C to +105°C (AEC-Q100 Grade 2); validated for under-hood automotive ECUs
Supply Range	VCC = 2.7–3.6 V, VIO = 1.65–VCC; allows mixed-voltage system integration with 1.8 V/3.3 V logic

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout conforms to standard parallel NOR flash mapping with dedicated CE#, OE#, WE#, RY/BY#, RESET#, WP#, and DQ0–DQ15 signals.

Pin/Terminal	Circuit Role	Design Meaning
CE#	Chip Enable	Active-low device select; enables internal state machine only when asserted
OE#	Output Enable	Controls output drivers during read; decouples data bus contention from address setup
WE#	Write Enable	Initiates command latching or data write; must be synchronized with address/data valid windows
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded erase/program, high otherwise
RESET#	Hardware Reset	Aborts ongoing operations and returns device to read mode; required for power-on initialization
WP#	Write Protect	Hardware lock for top/bottom sectors; prevents accidental program/erase during power transients
DQ0–DQ15	Data Bus	Bi-directional ×16 interface; transfers 16-bit words on every cycle, no byte-enable pins
A0–A25	Address Bus	26-bit word-aligned address; A0 is LSB, supports 128-MB linear space (2²⁶ × 2 bytes)

Key Features

Feature	Design Value
Page Mode Read	32-byte aligned access with 15 ns subsequent reads; cuts boot code fetch latency by >60% vs. random access
Buffer Programming	Up to 512 bytes per command; achieves 1.5 MBps effective write rate, critical for firmware updates
Hardware ECC	Single-bit correction with no software overhead; maintains data integrity across 20-year field life
Suspend/Resume	Pauses erase/program mid-operation to service high-priority reads; essential for real-time OS environments
Advanced Sector Protection	Volatile and non-volatile locking per 128-kB sector; prevents corruption of bootloader or calibration data
OTP Array	1024-byte one-time-programmable region with dual lock bits; stores security keys or device-specific calibration

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader, safety-critical control algorithms, and calibration maps in engine management systems.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and AEC-Q100 Grade 2 qualification.

Use Value: 90 ns random access ensures deterministic boot timing; hardware ECC prevents silent corruption of torque control parameters.

Use Scenario: Holding firmware, configuration tables, and HMI assets in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: High-reliability firmware repository supporting field updates via buffered programming.

Use Value: 512-byte buffer programming reduces update time by 3.2× vs. legacy NOR; 100K-cycle endurance supports 10+ years of patch cycles.

Medical Imaging System Boot Memory

Avionics Display Processor Code Storage

Use Scenario: Hosting boot ROM and diagnostic firmware in MRI/CT scanner mainboards requiring certified reliability.

IC Role / Device Role / Timing Role: Certified non-volatile memory with 20-year data retention and ECC for Class II/III medical devices.

Use Value: Industrial temperature grade (–40°C to +85°C) and 100 µA standby current enable fanless thermal design.

Use Scenario: Storing display controller firmware and graphics assets in DO-178C-compliant cockpit displays.

IC Role / Device Role / Timing Role: Secure, high-speed code memory with OTP region for cryptographic key binding.

Use Value: Dual-lock OTP array protects RSA keys; suspend/resume avoids display freeze during firmware validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS11FHIV10	Same density and package, but rated for Industrial (–40°C to +85°C) not Automotive Grade 2	Lacks AEC-Q100 qualification; unsuitable for under-hood ECU use	Select only for cost-sensitive industrial control where extended temperature is unnecessary
MX29GL128FHT2I-90G	128 Mb (not 1 Gb), 90 ns access, 3.0 V, TSOP-56; no built-in ECC or suspend/resume	Lower density limits use to smaller firmware images; requires external ECC handling	Choose for legacy board refreshes with footprint compatibility but lower performance/reliability requirements

Compared with S29GL01GS12FHIV10, the S29GL01GS11FHIV10 sacrifices automotive qualification for lower cost, while MX29GL128FHT2I-90G trades density, ECC, and advanced features for TSOP-56 footprint compatibility - neither matches the full feature set for new AEC-Q100 Grade 2 designs.

Availability

S29GL01GS12FHIV10 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GS12FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical applications.

The GL-S family targets high-performance embedded boot memory, combining XIP speed with data-storage density and automotive-grade robustness - optimized for ECU, industrial controller, and avionics firmware storage.

FAQ

What is the maximum operating frequency supported by S29GL01GS12FHIV10?

S29GL01GS12FHIV10 is an asynchronous parallel NOR flash and does not use a clock signal. Its performance is defined by access times: 90 ns random access and 15 ns page access under VCC = VIO conditions. These timings correspond to effective throughput up to ~11 MBps for sequential reads and 1.5 MBps for buffered programming, independent of system clock frequency.

Does S29GL01GS12FHIV10 require external ECC circuitry?

No. The device integrates hardware-based ECC that automatically detects and corrects single-bit errors during every read operation. This eliminates the need for external error-correction logic or software overhead, and is enabled by default without configuration. The ECC engine operates transparently and does not affect timing or bus protocol.

Can S29GL01GS12FHIV10 be used in a 1.8 V I/O system?

Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO can be set to 1.8 V, allowing direct interfacing with 1.8 V microcontrollers or FPGAs without level shifters. Signal thresholds and timing parameters are guaranteed across this range per datasheet Section 10.5 and Table 11.4.

How is sector protection configured on S29GL01GS12FHIV10?

Sector protection is implemented via Advanced Sector Protection (ASP), which supports both volatile (lock bits cleared on power cycle) and non-volatile (permanent until unlocked via command sequence) modes. Protection is controlled per 128-kB sector using CFI commands or hardware WP# pin assertion. Configuration is retained through power loss when non-volatile mode is selected.

S29GL01GS12FHIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 120 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL01GS12FHIV10 FAQ

1.How can I place an order for S29GL01GS12FHIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS12FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS12FHIV10 reliable?

The price and inventory of S29GL01GS12FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12FHIV10 is usually 5 days.

3.What payment methods are accepted for S29GL01GS12FHIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12FHIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS12FHIV10?

S29GL01GS12FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS12FHIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS12FHIV10?

For technical support, including S29GL01GS12FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12FHIV10 requirements.

6.How does Aetrix verify that S29GL01GS12FHIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS12FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12FHIV10 meets industry standards.

7.What is the process for return or replacement of S29GL01GS12FHIV10?

All S29GL01GS12FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12FHIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS12FHIV10 part is unused and in its original packaging.

Return procedure for S29GL01GS12FHIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…