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Infineon Technologies S29GL01GS12FHIV13
- Part No.:
- S29GL01GS12FHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS12FHIV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,734
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Product details
Overview
S29GL01GS12FHIV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS12FHIV13 datasheet, S29GL01GS12FHIV13 pinout, S29GL01GS12FHIV13 application, or S29GL01GS12FHIV13 equivalent, key selection criteria include its 512-byte programming buffer, Versatile I/O (1.65–VCC), CFI compliance, ASP sector protection, and OTP array with two lockable regions.
Technical Context
This device implements asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via RY/BY#, data polling, or status register.
The MIRRORBIT™ Eclipse architecture on 65 nm process enables high endurance (100,000 cycles) and 20-year data retention. Internal hardware ECC operates transparently during read, correcting single-bit errors without software intervention or latency penalty.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for complex microcontrollers and SoCs |
| Interface | Parallel ×16 asynchronous - enables XIP execution without external buffering or translation logic |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements in industrial controllers |
| Programming Buffer | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC | Internal hardware single-bit correction - eliminates need for external ECC logic or software overhead |
| Endurance & Retention | 100,000 program/erase cycles / 20 years - qualified for long-life industrial and automotive control modules |
| Operating Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows interoperability with mixed-voltage SoC interfaces |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned address bus (26 bits); A25 active for 1 Gb density |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with Versatile I/O voltage tolerance (1.65–VCC) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low gate for data output drivers; enables read data sampling |
| WE# | Write enable | Active-low strobe for write cycles; initiates command or data loading |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation progress (low = busy) |
| WP# | Write protect | Hardware sector protection enable; disables program/erase when asserted |
| RESET# | Hardware reset | Asynchronous reset input that halts ongoing operations and clears status registers |
Key Features
| Feature | Design Value |
|---|---|
| Page-mode read (32-byte aligned) | 15 ns access within same page - accelerates sequential instruction fetch in XIP boot scenarios |
| Uniform 128-kbyte sector erase | No block-size variation - simplifies firmware update partitioning and wear leveling logic |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - enables secure bootloader and parameter storage isolation |
| 1024-byte OTP array | Two independently lockable regions - stores cryptographic keys or calibration data with irreversible write-once security |
| CFI-compliant parameter table | Standardized JEDEC ID-CFI structure - enables automatic detection and configuration by generic flash drivers |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration tables in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: 20-year data retention and 100,000-cycle endurance ensure field reliability over 15+ year product lifecycles without refresh. | Use Scenario: Holding safety-critical boot code and sensor calibration data in front-camera ECU meeting AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure, CFI-compliant flash with hardware ECC and OTP key storage for ASIL-B compliant boot integrity. Use Value: Integrated single-bit ECC and lockable OTP eliminate external error-handling logic and reduce BOM cost by one IC. |
| Medical Imaging System BIOS | Telecom Baseband Processor Storage |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring radiation-tolerant, low-power non-volatile storage. IC Role / Device Role / Timing Role: High-reliability parallel flash with standby current <100 µA and Versatile I/O compatibility with 1.8 V FPGA I/O banks. Use Value: 1.65–VCC I/O range allows direct interfacing to 1.8 V baseband processors without level shifters. | Use Scenario: Storing DSP firmware and protocol stacks in 5G small-cell baseband units with thermal cycling and vibration exposure. IC Role / Device Role / Timing Role: High-density (1 Gb), fast-programming flash supporting field-upgradable firmware with suspend/resume during system interrupts. Use Value: 512-byte buffer programming and suspend/resume commands enable zero-downtime updates during live traffic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12FHIV20 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package - no TSOP footprint compatibility | Targeted for space-constrained PCBs where board area is prioritized over socket-based prototyping | Select for production designs with tight layout constraints and automated BGA assembly capability |
| MX29GL128FDTI-90G | 128 Mb density, 90 ns access, no integrated ECC, no OTP array, different CFI signature | Limited to non-safety-critical applications where ECC and secure key storage are not required | Choose only when cost sensitivity outweighs reliability and security requirements |
Compared with S29GL01GS12FHIV13, the IV20 variant offers identical functionality in a smaller BGA package but sacrifices TSOP compatibility, while the MX29GL128F lacks ECC, OTP, and density-making it unsuitable for safety- or longevity-critical deployments.
Availability
S29GL01GS12FHIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GS12FHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-S family was designed specifically for embedded systems requiring robust, high-density, XIP-capable NOR flash with integrated data integrity features - targeting industrial automation, automotive control, and medical electronics.
FAQ
Is S29GL01GS12FHIV13 pin-compatible with earlier S29GLxxxS generations?
Yes - it shares identical 56-pin TSOP pinout and signal definitions with S29GL512S/256S/128S in the same package variant. Address bus width extends to A25 for 1 Gb density, but lower-order pins remain functionally and physically aligned, enabling drop-in replacement in existing layouts where density suffices.
Does this device support true XIP (execute-in-place) operation?
Yes - its 90 ns random access time and asynchronous parallel interface allow direct CPU instruction fetch without copying to RAM. The 32-byte page mode further accelerates sequential execution, and CFI compliance ensures standard driver support across ARM, PowerPC, and RISC-V toolchains.
How is the 1024-byte OTP array accessed and secured?
The OTP array resides at fixed address offset 0x0000_0000 in the secure silicon region. Two lockable regions are controlled via dedicated CFI commands; once locked, writes are permanently disabled. Access requires issuing unlock sequences through the command interface - no backdoor paths exist, and locking is irreversible per JEDEC JESD22-A117 standards.
What thermal derating applies above 85°C ambient?
No thermal derating is specified beyond the industrial grade (–40°C to +85°C) rating. This part is not qualified for continuous operation above +85°C. For +105°C operation, Infineon offers the automotive-grade S29GL01GS12FHIV23 (AEC-Q100 Grade 2), which undergoes extended burn-in and HTOL testing per JESD22-A108.
S29GL01GS12FHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS12FHIV13 FAQ
1.How can I place an order for S29GL01GS12FHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS12FHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS12FHIV13 reliable?
The price and inventory of S29GL01GS12FHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12FHIV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GS12FHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12FHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS12FHIV13?
S29GL01GS12FHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS12FHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS12FHIV13?
For technical support, including S29GL01GS12FHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12FHIV13 requirements.
6.How does Aetrix verify that S29GL01GS12FHIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS12FHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12FHIV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GS12FHIV13?
All S29GL01GS12FHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12FHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS12FHIV13 part is unused and in its original packaging.
Return procedure for S29GL01GS12FHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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