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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL01GS12FHIV20

Name: S29GL01GS12FHIV20
Brand: Cypress Semiconductor Corp
SKU: S29GL01GS12FHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS12FHIV20

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS12FHIV20.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GS12FHIV20 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V single-supply operation (2.7–3.6 V), 16-bit data bus, and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL01GS12FHIV20 datasheet, S29GL01GS12FHIV20 pinout, S29GL01GS12FHIV20 application, or S29GL01GS12FHIV20 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, sector-level erase granularity (128 kB), OTP array security, CFI compliance, and Versatile I/O voltage support (1.65 V to VCC).

Technical Context

This device implements an asynchronous parallel interface with dedicated CE#, OE#, and WE# control lines, supporting both standard word programming and buffer-based 512-byte page programming. Its embedded algorithm controller (EAC) manages autonomous sector erase and program operations without external timing control.

The internal architecture includes a 32-byte aligned page read mechanism, status register polling, RY/BY# pin signaling, and dual protection modes (volatile/non-volatile ASP) for sector lockdown. Hardware ECC operates transparently during read cycles and corrects single-bit errors in real time.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full firmware image storage for ARM Cortex-A/R-based controllers.
Access time (random)	90 ns at VCC = VIO - enables direct XIP execution from flash in real-time boot sequences.
Page access time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages.
Programming buffer	512 bytes - reduces effective programming time by >3× vs. single-word writes in firmware update routines.
ECC capability	Single-bit error correction via on-die hardware - eliminates need for external ECC logic in safety-critical boot loaders.
Sector size	128 kB uniform sectors - allows granular firmware partitioning (e.g., bootloader, OS, app) with independent protection.
Data retention	20 years - ensures long-term reliability in unattended industrial gateways and PLCs.
Endurance	100,000 program/erase cycles - supports field-upgradable firmware with frequent patch deployment.

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pin assignment validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address inputs	26-bit address bus supporting full 128 MB address space; A25 is MSB for 1 Gb density.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports word-aligned reads/writes only - no byte-lane control.
CE#	Chip enable	Active-low chip select; controls device power state and command latching - critical for multi-flash bus arbitration.
OE#	Output enable	Active-low read strobe; gates output drivers - used for timing-critical read handshaking in high-speed controllers.
WE#	Write enable	Active-low write strobe; initiates program/erase command sequences - must meet tWP and tWH timing relative to CE#.
RY/BY#	Ready/Busy indicator	Open-drain active-low status pin - signals ongoing embedded operations; replaces software polling in latency-sensitive systems.
RESET#	Hardware reset	Active-low asynchronous reset - forces device into known state after power-on or fault recovery.
VCC	Core supply	3.0 V ±0.3 V core voltage (2.7–3.6 V); powers logic, EAC, and memory array - requires low-noise regulation.
VIO	I/O supply	1.65 V to VCC versatile I/O voltage - enables interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.

Key Features

Feature	Design Value
Asynchronous page mode read	32-byte aligned access with 15 ns intra-page cycle time - cuts instruction fetch latency by 83% vs. random access in boot ROM scenarios.
512-byte write buffer	Enables burst programming of up to 512 bytes per command - reduces firmware update time from seconds to sub-100 ms in field-deployed devices.
Hardware ECC engine	On-die single-bit correction with no CPU overhead - meets IEC 61508 SIL-2 requirements for boot memory integrity without software intervention.
Advanced sector protection (ASP)	Volatile and non-volatile lock bits per 128 kB sector - allows runtime-locked bootloader regions and factory-locked secure silicon OTP zones.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables automatic driver detection and cross-platform firmware portability.
OTP array	1024-byte one-time-programmable region with two independently lockable blocks - stores cryptographic keys and calibration data with irreversible write protection.

Applications

Industrial HMI Boot Storage

Network Edge Router Firmware

Use Scenario: Storing boot loader, kernel, and root filesystem for ARM-based human-machine interface panels operating in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP-capable random access and deterministic 90 ns startup latency.

Use Value: Enables cold-start boot under 500 ms while maintaining sector-level firmware update isolation and ECC-protected integrity verification.

Use Scenario: Holding firmware images and configuration tables in carrier-grade Ethernet routers requiring field upgrades and fail-safe rollback.

IC Role / Device Role / Timing Role: Dual-bank firmware storage with independent 128 kB sector erase - supports A/B partitioning and atomic image switching.

Use Value: Guarantees zero-downtime firmware updates via background programming and verified sector swap, backed by hardware ECC on every read.

Automotive ADAS Camera Module

Smart Grid RTU Code Storage

Use Scenario: Storing camera ISP firmware and calibration parameters in AEC-Q100 Grade 2 (–40°C to +105°C) automotive vision systems.

IC Role / Device Role / Timing Role: Automotive-qualified boot memory with OTP-secured calibration data and hardware reset recovery.

Use Value: Meets ASIL-B functional safety requirements through 20-year data retention, 100K-cycle endurance, and on-die ECC for sensor fusion code integrity.

Use Scenario: Hosting firmware and protocol stacks (IEC 61850, DNP3) in remote terminal units deployed across utility substations.

IC Role / Device Role / Timing Role: Long-life code storage with CFI-compliant driver abstraction and sector protection against accidental overwrite.

Use Value: Ensures 15+ year field operation without firmware corruption, leveraging non-volatile ASP and 128 kB sector granularity for modular updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS11FHIV10	Same 1 Gb density and 65 nm process, but rated for Industrial Plus (–40°C to +105°C) and uses 56-pin TSOP package.	Lacks LAE BGA footprint compatibility; higher thermal resistance limits use in compact, high-power-density modules.	Select when board layout requires TSOP-56 or extended temperature range is mandatory, and PCB space permits larger package.
MX29GL128FHI-90G	128 Mb (16 MB) density, 90 ns access, 48-pin TSOP; no integrated ECC or OTP array; CFI-compliant but lacks Versatile I/O.	Insufficient capacity for full firmware images; requires external ECC logic and voltage translation for mixed-voltage systems.	Only suitable for legacy designs with strict cost targets and smaller code footprints where ECC and OTP are handled externally.

Compared with S29GL01GS12FHIV20, the S29GL01GS11FHIV10 offers identical functionality in a different package and temperature grade, while the MX29GL128FHI-90G provides lower density and no on-die ECC - making it unsuitable for new designs requiring firmware integrity or compact BGA integration.

Availability

S29GL01GS12FHIV20 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, automotive ADAS camera modules, and smart grid RTU code storage requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GS12FHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for industrial and automotive markets.

The GL-S family targets embedded systems requiring robust, high-density parallel NOR flash with XIP capability, ECC, and automotive qualification - designed specifically for boot code, firmware, and secure configuration storage.

FAQ

Does S29GL01GS12FHIV20 support byte-level writes?

No. This device operates exclusively on 16-bit word boundaries due to its ×16 data bus architecture. All write operations - whether single-word or buffer-based - require aligned 16-bit data transfers. Byte-level addressing or partial-word writes are not supported and will result in undefined behavior or bus contention.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL01GS12FHIV20. It appears only on earlier S29GLxxxP series devices. This GL-S generation uses standard CE#/OE#/WE# control signals and does not implement STB - confirmed in Section 8.2 of datasheet 001-98285 Rev. *U.

Can VIO be set to 1.8 V while VCC is at 3.0 V?

Yes. The Versatile I/O feature explicitly supports VIO from 1.65 V to VCC. At VCC = 3.0 V, VIO may be independently set to 1.8 V to interface directly with 1.8 V host processors - eliminating level shifters and reducing BOM count and signal integrity risk.

How is the 1024-byte OTP array accessed and protected?

The OTP array resides at a fixed address offset and is accessed using standard CFI-compliant read commands. Protection is enforced via two independent lock bits: one volatile (cleared on power cycle) and one non-volatile (permanently fused). Once the non-volatile bit is set, that OTP region becomes permanently read-only.

S29GL01GS12FHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 120 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL01GS12FHIV20 FAQ

1.How can I place an order for S29GL01GS12FHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS12FHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS12FHIV20 reliable?

The price and inventory of S29GL01GS12FHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12FHIV20 is usually 5 days.

3.What payment methods are accepted for S29GL01GS12FHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12FHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS12FHIV20?

S29GL01GS12FHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS12FHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS12FHIV20?

For technical support, including S29GL01GS12FHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12FHIV20 requirements.

6.How does Aetrix verify that S29GL01GS12FHIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS12FHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12FHIV20 meets industry standards.

7.What is the process for return or replacement of S29GL01GS12FHIV20?

All S29GL01GS12FHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12FHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS12FHIV20 part is unused and in its original packaging.

Return procedure for S29GL01GS12FHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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