Cypress Semiconductor Corp S29GL01GT10FAI030
- Part No.:
- S29GL01GT10FAI030
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GT10FAI030.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:506
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Product details
Overview
S29GL01GT10FAI030 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, and uniform 128-KB sector erase-designed for boot code storage in industrial microcontroller-based systems requiring deterministic read latency and long-term data retention.
For engineers reviewing the S29GL01GT10FAI030 datasheet, S29GL01GT10FAI030 pinout, S29GL01GT10FAI030 application, or S29GL01GT10FAI030 equivalent, key selection criteria include asynchronous parallel interface timing compliance, OTP array security configuration (SSR0–SSR3), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant software initialization support.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously without host CPU intervention, supporting suspend/resume during both programming and sector erase. Its versatile I/O architecture allows independent VIO supply (1.65 V to VCC), enabling direct interfacing with 1.8 V or 3.3 V logic while maintaining full 3.0 V core operation.
The flash array is organized into uniform 128-KB sectors with advanced sector protection (ASP), including volatile and non-volatile lock bits per sector, plus a dedicated 2048-byte one-time-programmable (OTP) array segmented into four lockable regions-SSR0 factory-locked, SSR3 password-read-protected-enabling secure boot code and calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) organized as 128-KB uniform sectors |
| Read Access Time | 100 ns max at –40°C to +85°C; enables real-time XIP execution in MCU boot loaders |
| Page Access Time | 15 ns max; accelerates sequential instruction fetch in burst-mode applications |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical firmware storage |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention at +85°C |
| Operating Temp | AEC-Q100 Grade 2 (–40°C to +105°C); qualified for under-hood automotive control modules |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet Rev. *M, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 128-MB linear addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable for ×8 or ×16 operation via BYTE# pin |
| CE#, OE#, WE# | Chip Enable / Output Enable / Write Enable | Asynchronous control signals defining read/write cycle timing windows per JEDEC standards |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling active embedded operations (program/erase) |
| VCC, VIO, GND | Power Supplies | Separate 3.0 V core (VCC) and flexible I/O (VIO = 1.65 V to VCC) enable mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Algorithm Controller (EAC) | Autonomous program/erase execution with suspend/resume-reduces host CPU overhead and improves system responsiveness |
| Common Flash Interface (CFI) | Standardized parameter table enabling OS-agnostic flash initialization and geometry detection in bootloader firmware |
| Advanced Sector Protection (ASP) | Volatile/non-volatile lock bits per 128-KB sector prevent accidental firmware overwrite during field updates |
| OTP Array with SSR Locking | 2048-byte factory-programmed region with four independently lockable segments (SSR0–SSR3) for secure key storage and calibration data |
| Versatile I/O Voltage Range | VIO supports 1.65 V to VCC-allows direct connection to 1.8 V FPGA I/O banks or 3.3 V MCU buses without level shifters |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated lookup tables in AEC-Q100 Grade 2 ECU modules operating at +105°C ambient. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing deterministic 100 ns read access for real-time startup and fail-safe recovery. Use Value: Guaranteed 20-year data retention and 100,000-cycle endurance ensure firmware integrity over vehicle lifetime without refresh. | Use Scenario: Holding firmware images and configuration parameters in DIN-rail mounted programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Parallel NOR flash serving as XIP-capable code storage, eliminating need for external RAM copy during execution. Use Value: 15 ns page access time accelerates instruction fetch in cyclic scan routines, reducing PLC scan cycle jitter. |
| Medical Imaging System Boot ROM | Ruggedized Network Router Boot Loader |
Use Scenario: Secure boot image storage in FDA-cleared diagnostic imaging equipment requiring tamper-resistant firmware validation. IC Role / Device Role / Timing Role: OTP-secured boot ROM with SSR3 password protection preventing unauthorized firmware modification. Use Value: Factory-locked SSR0 and password-protected SSR3 enforce chain-of-trust from power-on reset through secure boot verification. | Use Scenario: Storing dual-image bootloaders and recovery firmware in telecom-grade routers operating continuously in temperature-controlled cabinets. IC Role / Device Role / Timing Role: High-reliability parallel flash with ECC-enabled reads ensuring bit-error-free boot code execution after years of thermal cycling. Use Value: Internal hardware ECC corrects single-bit errors on-the-fly, eliminating uncorrectable read failures during critical boot sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10TFI020 | Same die, 64-ball LAE BGA (9 mm × 9 mm); no TSOP option; identical timing and feature set | Targeted at space-constrained PCB layouts where 56-pin TSOP footprint is prohibitive | Select when board area optimization outweighs ease of prototyping with TSOP sockets |
| MX29GL128FPTI-90G | 128-MB density (1 Gb), 90 ns max tACC, no OTP array or SSR locking; lacks CFI support | Lower-cost alternative for non-security-critical applications without secure boot requirements | Choose only if OTP security, CFI compatibility, and AEC-Q100 qualification are not required |
Compared with S29GL01GT10FAI030, the TSOP-packaged variant offers superior prototyping flexibility and thermal performance in convection-cooled industrial enclosures, while the MX29GL128F lacks OTP security and automotive qualification-making it unsuitable for safety-critical firmware storage.
Availability
S29GL01GT10FAI030 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging systems, and ruggedized network infrastructure requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GT10FAI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The GL-T family delivers high-density, high-reliability parallel NOR flash optimized for deterministic boot code execution, secure firmware storage, and extended-temperature operation in mission-critical embedded systems.
FAQ
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independently lockable 512-byte segments within the 2048-byte OTP array. SSR0 is permanently locked at factory shipment and typically holds immutable device identifiers or cryptographic keys. SSR3 supports password-based read protection, enabling secure storage of calibration data or license keys that must remain inaccessible to unauthorized firmware reads.
Does S29GL01GT10FAI030 support x8 and x16 data bus configurations?
Yes. The device supports both ×8 and ×16 operation via the BYTE# pin: when BYTE# is low, DQ0–DQ7 function as an 8-bit data bus; when high, DQ0–DQ15 operate as a 16-bit bus. Address lines A0–A21 remain unchanged in both modes, with byte/word alignment enforced by hardware.
How does the Versatile I/O (VIO) feature impact system design?
VIO allows independent supply voltage (1.65 V to VCC) for the I/O pins while maintaining 3.0 V core operation. This eliminates external level shifters when interfacing with 1.8 V FPGAs or 3.3 V MCUs, simplifies power sequencing, and reduces board-level component count-particularly valuable in mixed-voltage industrial and automotive designs.
Is hardware reset supported, and what is its behavior?
Yes. Hardware reset (RESET# pin) forces the device into a known initial state, aborting any ongoing program or erase operation and clearing internal status registers. After reset release, the device enters standby mode and requires reinitialization via CFI query or command sequence before subsequent read/write operations.
S29GL01GT10FAI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GT10FAI030 FAQ
1.How can I place an order for S29GL01GT10FAI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10FAI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10FAI030 reliable?
The price and inventory of S29GL01GT10FAI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10FAI030 is usually 5 days.
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S29GL01GT10FAI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10FAI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10FAI030?
For technical support, including S29GL01GT10FAI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10FAI030 requirements.
6.How does Aetrix verify that S29GL01GT10FAI030 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10FAI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10FAI030 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10FAI030?
All S29GL01GT10FAI030 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10FAI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10FAI030 part is unused and in its original packaging.
Return procedure for S29GL01GT10FAI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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