Cypress Semiconductor Corp S29GL01GT10GHI020
- Part No.:
- S29GL01GT10GHI020
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 56-VFBGA
- Datasheet:
-
S29GL01GT10GHI020.pdf
- Description:
- FLASH - NOR MEMORY IC 1GB (128M
- Quantity:
- Payment:

- Shipping:

Inventory:251
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GT10GHI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL01GT10GHI020 datasheet, S29GL01GT10GHI020 pinout, S29GL01GT10GHI020 application, or S29GL01GT10GHI020 equivalent, key selection criteria include asynchronous parallel interface timing, OTP array security configuration, sector protection volatility control, and AEC-Q100 grade compatibility verification.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously without host CPU intervention. Its CFI-compliant interface enables standardized driver initialization across toolchains, while the versatile I/O feature allows independent VIO supply (1.65 V to VCC) decoupled from core VCC.
The status register provides real-time visibility into operation completion and error flags, and the Ready/Busy# pin delivers hardware-level synchronization for high-throughput firmware updates. Sector protection is configurable per 128-KB block via volatile lock bits or non-volatile ASP settings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full boot image + firmware partitioning in resource-constrained embedded systems |
| Interface type | Asynchronous parallel ×16 - enables direct MPU bus connection without protocol translation logic |
| Random access time | 100 ns at –40°C to +85°C - meets hard real-time boot latency requirements for industrial PLCs |
| Write buffer size | 512 bytes - reduces effective programming time by 4× vs. single-word writes in OTA update scenarios |
| ECC capability | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical boot memory |
| Endurance | 100,000 program/erase cycles - qualifies for 15+ year field deployment in infrequently updated control firmware |
| Data retention | 20 years at +85°C - ensures integrity of calibration data and bootloader across product lifecycle |
Pinout & Package
Package: 56-pin TSOP (Type I, standard pitch), JEDEC MO-141AC compliant, body size 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×8 or ×16 mode via BYTE# control |
| CE# | Chip enable | Active-low chip select enabling memory-mapped access; tCE = 100 ns max at industrial temp |
| OE# | Output enable | Controls data bus output drivers during read; tOE = 25 ns max for timing-critical fetch cycles |
| WE# | Write enable | Initiates write/program command latching; synchronized with CE# and address setup |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; used for hardware flow control in burst programming |
| VCC | Core supply | 2.7–3.6 V single supply powering logic and array; decoupling required per JEDEC TSOP layout guidelines |
| VIO | I/O supply | 1.65–VCC independent voltage rail for interfacing with mixed-voltage host processors |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page read | 32-byte burst mode delivering 15 ns/page access - accelerates sequential instruction fetch in XIP applications |
| OTP array | 2048-byte one-time programmable space with four lockable regions (SSR0–SSR3), including factory-locked SSR0 - enables secure key storage and device identity binding |
| Advanced sector protection | Volatile and non-volatile lock bits per 128-KB sector - supports dynamic firmware update partitioning and permanent bootloader lockdown |
| Suspend/resume capability | Interruptible program/erase operations - allows high-priority read access during background flash maintenance |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables auto-detection and generic driver support across OS and bootloader stacks |
Applications
| Industrial PLC Boot Memory | Automotive ECU Firmware Storage |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic <100 ns latency. Use Value: Ensures reliable cold-start execution under wide temperature swings (–40°C to +85°C) and meets IEC 61131-3 runtime constraints. | Use Scenario: Holding calibrated engine control parameters and ASIL-B compliant firmware in automotive powertrain ECUs. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified flash storing immutable bootloader and signed application images. Use Value: Leverages internal ECC and 100K-cycle endurance to maintain functional safety integrity over 15-year vehicle lifetime. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Retaining device-specific calibration coefficients and regulatory compliance settings in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure OTP-backed configuration store with password-protected SSR3 region for HIPAA-aligned data governance. Use Value: Prevents unauthorized modification of diagnostic accuracy parameters using hardware-enforced lock bits and factory-verified SSR0. | Use Scenario: Storing reconfigurable FPGA bitstreams and firmware patches in 5G radio units requiring field-upgradable logic. IC Role / Device Role / Timing Role: High-reliability parallel flash enabling fast partial reconfiguration via buffered 512-byte writes. Use Value: Achieves 1.14 MBps effective programming rate to minimize service downtime during remote FPGA updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10TFI020 | Same die, 64-ball LAE BGA (9 mm × 9 mm) package - no TSOP footprint compatibility | Targeted for space-constrained telecom modules where board area > thermal dissipation priority | Select when PCB real estate is constrained and BGA assembly capability exists. |
| S29GL512T10TFI020 | 512 Mb density, identical timing and feature set - half capacity, same 45-nm MIRRORBIT™ process | Used where boot image size < 64 MB and cost-per-bit optimization is critical | Select when firmware footprint fits within 64 MB and BOM cost reduction is primary objective. |
Compared with S29GL01GT10GHI020, the TSOP-packaged variant offers drop-in replacement in legacy industrial designs, while the 512 Mb alternative trades density for lower unit cost in less memory-intensive applications - both retain identical ECC, OTP, and sector protection architecture.
Availability
S29GL01GT10GHI020 is available at Aetrix Electronics and suitable for industrial PLC boot memory, automotive ECU firmware storage, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GT10GHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing deterministic XIP performance, robust data integrity, and long-term firmware storage - designed specifically for mission-critical boot and configuration memory roles.
FAQ
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and reserved for device identity; SSR3 supports password-based read protection. These regions enable secure storage of cryptographic keys, calibration data, and device-specific credentials without risk of overwrite.
Does S29GL01GT10GHI020 support both ×8 and ×16 data bus modes?
Yes - the device automatically detects bus width via the BYTE# pin state at power-on reset. When BYTE# is low, it operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode with DQ0–DQ7 only, enabling flexible integration with 8-bit or 16-bit microprocessor buses.
How does the Versatile I/O (VIO) feature improve system design flexibility?
VIO allows independent supply voltage (1.65 V to VCC) for the I/O pins, decoupled from core VCC. This enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters - reducing BOM count and signal integrity complexity in mixed-voltage embedded systems.
Can sector protection be configured dynamically during runtime?
Yes - advanced sector protection (ASP) supports both volatile (cleared on power cycle) and non-volatile (persistent) lock bits per 128-KB sector. Volatile locking enables temporary firmware update windows; non-volatile locking secures bootloader regions permanently after production programming.
S29GL01GT10GHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-T
- Package/Case:
- 56-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-FBGA (9x7)
S29GL01GT10GHI020 FAQ
1.How can I place an order for S29GL01GT10GHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GT10GHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GT10GHI020 reliable?
The price and inventory of S29GL01GT10GHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT10GHI020 is usually 5 days.
3.What payment methods are accepted for S29GL01GT10GHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT10GHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GT10GHI020?
S29GL01GT10GHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GT10GHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GT10GHI020?
For technical support, including S29GL01GT10GHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT10GHI020 requirements.
6.How does Aetrix verify that S29GL01GT10GHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GT10GHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT10GHI020 meets industry standards.
7.What is the process for return or replacement of S29GL01GT10GHI020?
All S29GL01GT10GHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT10GHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GT10GHI020 part is unused and in its original packaging.
Return procedure for S29GL01GT10GHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GT10GHI020 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

