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Cypress Semiconductor Corp S29GL01GT11DHV010

Part No.:
S29GL01GT11DHV010
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GT11DHV010.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:477

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Product details

Overview

S29GL01GT11DHV010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.

For engineers reviewing the S29GL01GT11DHV010 datasheet, S29GL01GT11DHV010 pinout, S29GL01GT11DHV010 application, or S29GL01GT11DHV010 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant command set, and support for suspend/resume during embedded operations.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external microcontroller intervention.

The internal hardware ECC engine performs real-time single-bit error correction during read operations, and the status register provides flag-based status reporting alongside RY/BY# pin signaling and data polling methods for operation completion detection.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density1 Gb (128 MB) - sufficient for full firmware images and configuration tables in resource-constrained embedded systems
Access time (tACC)100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache in real-time control applications
Page access time (tPACC)15 ns - accelerates sequential instruction fetch during burst reads in boot loader routines
Write buffer size512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput
ECC capabilitySingle-bit error correction - ensures data integrity over 20-year retention without software-level error handling overhead
Endurance100,000 program/erase cycles - supports field-upgradable firmware in industrial gateways with multi-year service life
Operating voltageVCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with mixed-voltage SoC interfaces including 1.8 V I/O domains
Temperature gradeIndustrial (–40°C to +85°C) - qualified for deployment in factory automation PLCs and motor drives without thermal derating

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil), JEDEC standard, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address inputs22-bit address bus supporting full 128 MB linear addressing with byte/word boundary alignment
DQ0–DQ15Data I/O16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# signal
CE#Chip enableActive-low chip select enabling device access; tCE = 100 ns max defines minimum CS assertion window
OE#Output enableActive-low control for data output gating; tOE = 25 ns max determines read setup timing margin
WE#Write enableActive-low control for write operations; initiates command latching and embedded algorithms
RY/BY#Ready/Busy indicatorOpen-drain output signaling active program/erase; used for hardware flow control in time-critical firmware updates
RESET#Hardware resetAsynchronous active-low input that halts all operations and returns device to read mode upon deassertion
BYTE#Bus width selectConfigures data bus as ×8 (BYTE# = low) or ×16 (BYTE# = high); determines DQ0–DQ7 vs. DQ0–DQ15 usage

Key Features

FeatureDesign Value
Versatile I/O voltageVIO range 1.65 V to VCC enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters
OTP array with SSR locking2048-byte one-time-programmable region with four independently lockable sectors (SSR0–SSR3), including factory-locked SSR0 and password-protected SSR3
Suspend/resume capabilityAllows interrupting ongoing program or erase operations to service higher-priority read requests, critical for real-time OS environments
CFI parameter tableStandardized JEDEC CFI structure enables automatic detection and configuration by bootloader firmware across multiple flash vendors
Advanced sector protectionVolatile and non-volatile lock bits per 128-KB sector prevent accidental writes during power transitions or debug sessions

Applications

Industrial PLC Boot MemoryAutomotive ADAS Camera Module

Use Scenario: Stores boot firmware and real-time control logic for programmable logic controllers deployed in manufacturing lines.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency.

Use Value: Eliminates need for external SRAM copy during boot, reducing BOM count and power-on initialization time by >30%.

Use Scenario: Holds calibration data and image processing firmware in rear-view camera modules operating under AEC-Q100 Grade 2 conditions.

IC Role / Device Role / Timing Role: High-reliability data storage with ECC and 100,000-cycle endurance for frequent OTA updates.

Use Value: Ensures bit-error-free operation over 15-year vehicle lifetime despite thermal cycling between –40°C and +105°C.

Medical Imaging Control BoardEnergy Meter Firmware Storage

Use Scenario: Stores FPGA configuration bitstreams and safety-critical diagnostic firmware in portable ultrasound devices.

IC Role / Device Role / Timing Role: Secure, OTP-protected firmware repository with hardware-based sector locking for regulatory compliance (IEC 62304).

Use Value: Prevents unauthorized firmware modification via SSR3 password protection and non-volatile sector locks.

Use Scenario: Retains tariff tables, communication stack binaries, and metering calibration parameters in smart electricity meters.

IC Role / Device Role / Timing Role: Long-term data retention (20 years) flash memory with low standby current (100 μA) for battery-backed operation.

Use Value: Extends backup battery life beyond 10 years while maintaining data integrity through hardware ECC and sector protection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GP11DHV010Same density and package but lacks OTP array and SSR locking; no password-protected SSR3Not suitable for applications requiring secure firmware storage or regulatory-grade tamper resistanceSelect when cost sensitivity outweighs need for OTP-based security features
MX29GL128FPTI-90G128 MB ×16, 90 ns access, no hardware ECC, no OTP array, different command set (non-CFI)Requires custom driver adaptation; unsuitable for CFI-autoconfiguring bootloadersSelect only for legacy designs already committed to Macronix command architecture

Compared with S29GL01GP11DHV010 and MX29GL128FPTI-90G, the S29GL01GT11DHV010 uniquely combines CFI compatibility, hardware ECC, and OTP-based security-making it optimal for new industrial and automotive designs requiring firmware integrity, long-term reliability, and bootloader interoperability.

Availability

S29GL01GT11DHV010 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging control boards, and smart energy meters requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GT11DHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.

The GL-T family targets high-reliability embedded systems needing fast XIP execution, robust data retention, and secure firmware storage-designed specifically for industrial control, automotive infotainment, and medical equipment where functional safety and long-term availability are critical.

FAQ

What is the maximum operating temperature range for S29GL01GT11DHV010?

The S29GL01GT11DHV010 is rated for the industrial temperature range of –40°C to +85°C. This is confirmed in the datasheet's "Temperature range / grade" section and applies to all electrical and timing specifications unless otherwise noted. It does not support the extended (–40°C to +125°C) or automotive Grade 2 (–40°C to +105°C) variants-those require different orderable part numbers with suffixes indicating the grade.

Does this device support both ×8 and ×16 data bus widths?

Yes, S29GL01GT11DHV010 supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, the device operates in ×8 mode using DQ0–DQ7; when high, it uses DQ0–DQ15 in ×16 mode. This is defined in Section 8.3 ("Word/Byte configuration") and verified in the pin description table, enabling flexible integration with diverse host processor buses.

Is hardware ECC enabled by default, and can it be disabled?

Hardware ECC is always active during read operations and cannot be disabled-it is implemented in dedicated silicon logic. The device automatically detects and corrects single-bit errors transparently, with no software configuration required. ECC status is reported in the Status Register (bit 7), and uncorrectable multi-bit errors trigger status flag assertion, as specified in Section 5.3 ("Automatic ECC") of the datasheet.

How many sectors does the S29GL01GT11DHV010 have, and what is their size?

The S29GL01GT11DHV010 contains 1024 uniform sectors, each 128 KB in size, totaling 128 MB (1 Gb). This is explicitly stated in the "Sector erase" feature bullet and confirmed in Section 2.1 ("Flash memory array"). Sector boundaries align to 128-KB offsets, and each sector has independent protection bits accessible via the Advanced Sector Protection (ASP) mechanism.

S29GL01GT11DHV010 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
GL-T
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GT11DHV010 FAQ

1.How can I place an order for S29GL01GT11DHV010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT11DHV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT11DHV010 reliable?

The price and inventory of S29GL01GT11DHV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11DHV010 is usually 5 days.

3.What payment methods are accepted for S29GL01GT11DHV010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11DHV010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT11DHV010?

S29GL01GT11DHV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT11DHV010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT11DHV010?

For technical support, including S29GL01GT11DHV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11DHV010 requirements.

6.How does Aetrix verify that S29GL01GT11DHV010 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT11DHV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11DHV010 meets industry standards.

7.What is the process for return or replacement of S29GL01GT11DHV010?

All S29GL01GT11DHV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11DHV010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT11DHV010 part is unused and in its original packaging.

Return procedure for S29GL01GT11DHV010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL01GT11DHV010 Tags

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