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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL01GT11TFIV40

Name: S29GL01GT11TFIV40
Brand: Cypress Semiconductor Corp
SKU: S29GL01GT11TFIV40
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GT11TFIV40

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL01GT11TFIV40.pdf

Description:: IC FLASH 1GBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GT11TFIV40 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, operating at 3.0 V core supply (2.7–3.6 V), featuring 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It supports ×8/×16 data bus, 512-byte programming buffer, and uniform 128-KB sector erase - deployed in automotive infotainment boot code storage requiring fast XIP execution and long-term data retention.

For engineers reviewing the S29GL01GT11TFIV40 datasheet, S29GL01GT11TFIV40 pinout, S29GL01GT11TFIV40 application, or S29GL01GT11TFIV40 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), TSOP-56 package compatibility, Versatile I/O (1.65 V to VCC), CFI compliance, and OTP array with SSR lockability for secure firmware partitioning.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and executes embedded algorithms (program/erase) via command sequences. Its architecture includes dedicated address space overlays for Device ID/CFI, Status Register, Data Polling, SSR (OTP), and ECC status - enabling deterministic status monitoring without host CPU polling overhead.

The embedded algorithm controller (EAC) manages buffer programming (up to 512 bytes), suspend/resume of program/erase operations, and automatic ECC generation/correction during read. Sector protection uses volatile/non-volatile ASP methods per 128-KB sector, while the 2048-byte OTP array provides four lockable regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-read-protected.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	1 Gb (128 MB) - supports full boot image + firmware + configuration storage in single-package embedded systems
Access time (tACC)	100 ns (–40°C to +85°C) - enables direct XIP execution from flash without external cache penalty
Page access time (tPACC)	15 ns - accelerates sequential instruction fetch in burst-mode applications
Programming buffer	512 bytes - reduces effective programming time by 3.2× vs. single-word writes for firmware updates
ECC capability	Single-bit correction (hardware) - eliminates need for external ECC logic in safety-critical boot paths
Operating voltage	VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows interoperability with 1.8 V/3.3 V I/O domains without level shifters
Endurance & retention	100,000 program/erase cycles, 20-year data retention - meets automotive AEC-Q100 Grade 2 lifecycle requirements

Pinout & Package

Package: 56-pin TSOP (Type I, standard thickness). Pinout validated per Infineon datasheet Rev. *M, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address inputs	22-bit address bus supporting full 128 MB linear addressing (byte/word aligned)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration
CE#	Chip enable	Active-low chip select; tCE = 100 ns max - defines minimum cycle time in multi-device systems
OE#	Output enable	Active-low output control; tOE = 25 ns max - critical for timing-critical read handshaking
WE#	Write enable	Active-low write strobe; initiates command latching and embedded operations
RY/BY#	Ready/Busy output	Open-drain status indicator; asserts low during program/erase - enables non-polling interrupt-driven flow control
RESET#	Hardware reset	Active-low asynchronous reset; restores device to read mode and clears internal state

Key Features

Feature	Design Value
Versatile I/O (VIO)	VIO range 1.65 V to VCC enables direct interfacing with mixed-voltage SoCs without external level translation
512-byte programming buffer	Reduces average programming time to 447 μs per 512-byte block (1.14 MBps), improving OTA update efficiency
Uniform 128-KB sectors	Enables granular firmware partitioning (e.g., bootloader, OS, app) with independent erase control
Four-lockable OTP regions (SSR0–SSR3)	SSR0 factory-locked + SSR3 password-protected - secures cryptographic keys and calibration data against field overwrite
Common Flash Interface (CFI)	Standardized parameter table allows auto-detection and driver portability across flash vendors in Linux/U-Boot environments

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, real-time CAN message handlers, and fail-safe boot loader in dashboard MCU.

IC Role / Device Role / Timing Role: Primary XIP-capable boot memory with deterministic 100 ns read latency and AEC-Q100 Grade 2 qualification.

Use Value: Eliminates external SRAM copy step during boot; 20-year retention ensures calibration integrity over vehicle lifetime.

Use Scenario: Holding ladder logic firmware, I/O mapping tables, and firmware update images in modular control cabinets.

IC Role / Device Role / Timing Role: Non-volatile program storage with sector-level erase isolation for safe field updates without runtime interruption.

Use Value: 128-KB uniform sectors allow atomic firmware swap; suspend/resume prevents process disruption during power fluctuation.

Medical Imaging Boot Loader

Avionics Display System

Use Scenario: Hosting certified boot firmware and DICOM protocol stack in portable ultrasound devices.

IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with OTP-locked cryptographic keys for regulatory compliance (IEC 62304).

Use Value: Hardware ECC satisfies Class C software safety requirements; SSR3 password protection prevents unauthorized key extraction.

Use Scenario: Storing flight-critical display firmware, font assets, and redundancy checksums in cockpit multifunction displays.

IC Role / Device Role / Timing Role: High-reliability parallel flash with extended temperature support (–40°C to +125°C) and 100K-cycle endurance.

Use Value: Extended grade operation ensures functionality during thermal soak; 20-year retention avoids recalibration in sealed avionics enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GT11TFIV10	Same die, TSOP-56 package, but rated for –40°C to +85°C (industrial grade) instead of +105°C	Lacks extended temperature margin required for under-hood automotive or high-ambient industrial use	Select when cost sensitivity outweighs thermal margin needs and AEC-Q100 Grade 2 is not mandated
S29GL01GT12TFIV40	Identical specs except CE# access time = 110 ns (vs. 100 ns) and tACC = 110 ns at +105°C	Marginally slower timing limits maximum bus clock in high-speed XIP configurations	Choose only if board layout constraints require LAE BGA (9 mm × 9 mm) over TSOP-56 footprint

Compared with S29GL01GT11TFIV10, this part adds 20°C higher thermal margin and AEC-Q100 Grade 2 compliance; versus S29GL01GT12TFIV40, it delivers tighter 100 ns tACC for deterministic real-time boot timing - making it optimal for safety-critical automotive and avionics where both reliability and timing predictability are mandatory.

Availability

S29GL01GT11TFIV40 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL01GT11TFIV40 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.

The GL-T family targets high-reliability embedded systems needing XIP-capable flash with robust data integrity, extended temperature operation, and secure firmware storage - especially in automotive, industrial, and aerospace domains.

FAQ

Is S29GL01GT11TFIV40 pin-compatible with earlier S29GL01GP or S29GL01GS series?

No. S29GL01GT uses a revised command set, enhanced ECC architecture, and updated CFI parameter table compared to GP/GS generations. While physical pinout matches TSOP-56, register mapping and status reporting differ - requiring firmware driver updates for migration.

Does this device support synchronous read or DDR interface modes?

No. S29GL01GT11TFIV40 is strictly asynchronous parallel NOR flash. It does not support clocked read protocols, DDR toggling, or QSPI interfaces. All timing is defined by CE#, OE#, and WE# setup/hold relationships per datasheet AC specifications.

Can the OTP array (SSR) be reprogrammed after initial lock?

No. Once SSR0–SSR3 are locked (including factory lock on SSR0), they cannot be unlocked or rewritten. SSR3 supports password-based read protection, but write access is permanently disabled after lock - ensuring immutable storage of keys or calibration data.

What is the impact of Versatile I/O (VIO) on system-level signal integrity?

VIO allows independent VIO supply (1.65–VCC) decoupled from VCC, reducing simultaneous switching noise on shared power rails. This separation improves noise margin for high-speed reads and simplifies PCB routing when interfacing with mixed-voltage processors - no external level shifters needed.

S29GL01GT11TFIV40 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-T

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 128M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL01GT11TFIV40 FAQ

1.How can I place an order for S29GL01GT11TFIV40 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GT11TFIV40 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GT11TFIV40 reliable?

The price and inventory of S29GL01GT11TFIV40 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GT11TFIV40 is usually 5 days.

3.What payment methods are accepted for S29GL01GT11TFIV40?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GT11TFIV40 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GT11TFIV40?

S29GL01GT11TFIV40 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GT11TFIV40 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GT11TFIV40?

For technical support, including S29GL01GT11TFIV40 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GT11TFIV40 requirements.

6.How does Aetrix verify that S29GL01GT11TFIV40 is sourced from the original manufacturer or authorized distributors?

All S29GL01GT11TFIV40 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GT11TFIV40 meets industry standards.

7.What is the process for return or replacement of S29GL01GT11TFIV40?

All S29GL01GT11TFIV40 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GT11TFIV40, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GT11TFIV40 part is unused and in its original packaging.

Return procedure for S29GL01GT11TFIV40:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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