Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL032N11DFIV20

Name: S29GL032N11DFIV20
Brand: Cypress Semiconductor Corp
SKU: S29GL032N11DFIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL032N11DFIV20

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL032N11DFIV20.pdf

Description:: IC FLASH 32MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,169

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL032N11DFIV20 from Infineon Technologies (formerly Cypress) is a 32-Mbit, 16-bit-wide single-power-supply MirrorBit Flash memory organized as 2,097,152 words (4,194,304 bytes), featuring 90 ns access time, 25 ns page read time, and 100,000 erase cycles per sector. It supports uniform sector architecture with sixty-four 32 Kword (64 KB) sectors and operates across VCC = 2.7–3.6 V and VIO = 1.65–3.6 V - deployed in industrial control firmware storage and boot code retention.

For engineers reviewing the S29GL032N11DFIV20 datasheet, S29GL032N11DFIV20 pinout, S29GL032N11DFIV20 application, or S29GL032N11DFIV20 equivalent, key selection criteria include JEDEC software compatibility, Secured Silicon Sector with factory-programmed 128-word ESN, Advanced Sector Protection (Persistent and Password modes), and hardware reset (RESET#) integration for reliable boot recovery.

Technical Context

This device implements a command-set-compatible, single-supply NOR Flash architecture using 110 nm MirrorBit process technology. It features dual voltage domain operation: VCC powers core logic and array, while VIO sets I/O voltage level (1.65–3.6 V), enabling interoperability with mixed-voltage host systems.

It supports flexible word/byte configuration via BYTE# input, full CFI compliance for automatic device identification, and concurrent operations including Program Suspend/Resume and Erase Suspend/Resume - allowing background reads during active programming or erasure of other sectors.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	32 Mbit (2,097,152 × 16-bit words); enables compact firmware image storage without external expansion.
Access Time	90 ns at VCC = 2.7–3.6 V; meets real-time boot latency requirements in embedded controllers.
Page Read Time	25 ns; supports high-throughput sequential instruction fetch from 8-word buffer.
Erase Endurance	100,000 cycles per sector; ensures field-upgradable firmware over 10+ years of maintenance cycles.
Data Retention	20 years typical; guarantees long-term integrity of calibration data and security keys.
Supply Voltage	VCC = 2.7–3.6 V, VIO = 1.65–3.6 V; allows direct interface to 1.8 V, 2.5 V, or 3.3 V microcontrollers.
Operating Temp	–40°C to +85°C; qualified for industrial temperature range deployment.

Pinout & Package

Package: 48-pin TSOP (Standard Thin Small Outline Package), 12 × 20 mm body, JEDEC MO-142AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address Inputs	22-bit address bus supporting full 32 Mbit addressing; A-1 used as DQ15 in x16 mode.
DQ0–DQ15	Data I/O Bus	16-bit bidirectional data path; supports byte-wide access when BYTE# = low.
CE#	Chip Enable	Active-low chip select; enables device for read/write/erase only when asserted.
OE#	Output Enable	Controls output buffer; allows shared bus operation with other peripherals.
WE#	Write Enable	Initiates write command latching and internal program/erase sequencing.
WP#/ACC	Write Protect / Accelerated Program	Protects first/last sector when low; enables high-voltage accelerated programming when driven high.
RESET#	Hardware Reset	Aborts ongoing operation and returns device to read mode; synchronizes boot sequence with system reset.
RY/BY#	Ready/Busy Output	Open-drain status signal indicating active program/erase; eliminates need for polling overhead.
BYTE#	Bus Width Select	Selects x16 (high) or x8 (low) data bus mode; enables compatibility with 8-bit microcontrollers.
VIO	I/O Supply Voltage	Sets input threshold and output drive level independently of VCC; enables mixed-voltage interfacing.

Key Features

Feature	Design Value
Secured Silicon Sector	128-word (256-byte) factory-lockable region with 8-word ESN; provides immutable device identity and secure key storage.
Advanced Sector Protection	Persistent and Password modes - prevents accidental or unauthorized firmware overwrite without explicit unlock sequence.
Concurrent Operations	Program/Erase Suspend & Resume allows interruptible writes; enables responsive UI updates during background firmware patching.
CFI Compliance	Standardized parameter table accessible via command; enables auto-configuration in bootloader without hard-coded timing tables.
Unlock Bypass Mode	Reduces multi-word programming overhead from 4 to 2 write cycles; improves production line flash programming throughput.

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Storing firmware and configuration parameters in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic startup and field-upgradable application code.

Use Value: 20-year data retention and –40°C to +85°C operation ensure firmware integrity across extended service life without battery backup.

Use Scenario: Holding boot loader and gauge graphics assets in digital instrument clusters requiring ASIL-B aware storage.

IC Role / Device Role / Timing Role: Primary NOR Flash for safe boot execution and runtime asset retrieval.

Use Value: Secured Silicon Sector stores unique vehicle ID and calibration checksums, preventing unauthorized reprogramming.

Medical Diagnostic Equipment BIOS

Network Router Boot Image Storage

Use Scenario: Hosting boot firmware and safety-critical diagnostic routines in FDA-regulated imaging devices.

IC Role / Device Role / Timing Role: Trusted boot source verified at power-on reset before loading application processor firmware.

Use Value: Persistent Sector Protection blocks runtime corruption of boot code, satisfying IEC 62304 software lifecycle requirements.

Use Scenario: Storing primary and fallback boot images in enterprise-grade routers requiring zero-downtime firmware upgrades.

IC Role / Device Role / Timing Role: Dual-image Flash supporting atomic swap between active and update partitions.

Use Value: Erase Suspend capability enables simultaneous read of active image while updating standby partition - eliminating service interruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL032N10TFIV20	100 ns access time (vs. 90 ns); same package, voltage, and feature set.	Suitable where timing margin >10 ns exists; lower cost in non-latency-critical designs.	Select when system clock budget permits relaxed access timing without sacrificing reliability or protection features.
MX29GL32EHXFI-90G	Macronix part; identical 32 Mbit density, 90 ns access, TSOP-48, but lacks Secured Silicon Sector and Password Protection.	Acceptable for cost-sensitive consumer applications without security or traceability requirements.	Choose only if ESN, persistent lock, and password-based sector protection are not required in the design.

Compared with S29GL032N11DFIV20, the -10TFIV20 trades 10 ns speed for cost savings in stable timing environments, while the MX29GL32EHXFI-90G omits critical security features - making the Infineon part uniquely suited for regulated, upgradable, and identity-aware embedded systems.

Availability

S29GL032N11DFIV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment BIOS requiring stable component supply, long-lifecycle support, and guaranteed obsolescence management.

Supply support for S29GL032N11DFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.

This device belongs to the S29GL-N family of MirrorBit NOR Flash memories, designed specifically for reliable, secure, and field-upgradable firmware storage in mission-critical embedded systems demanding JEDEC-compliant command sets and hardware-level data protection.

FAQ

What is the function of the WP#/ACC pin on S29GL032N11DFIV20?

The WP#/ACC pin serves dual roles: when pulled low, it hardware-protects the first or last sector against accidental erase or program; when driven high during programming, it enables accelerated programming via elevated internal voltage, reducing write time by ~30% in production environments. Its behavior is model-dependent and documented in the "Write Protect (WP#/ACC)" section of the datasheet.

Does S29GL032N11DFIV20 support byte-wide data access?

Yes - when the BYTE# input is asserted low, the device operates in x8 mode, presenting DQ0–DQ7 as the data bus while DQ8–DQ15 are tri-stated. This enables direct connection to 8-bit microcontrollers without external data bus multiplexing, preserving pin count and simplifying PCB layout.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a dedicated 128-word (256-byte) region pre-programmed at the factory with a unique 8-word Electronic Serial Number (ESN). Once locked via command sequence, it becomes permanently read-only and immune to erase or program commands - unlike standard sectors, which remain fully reprogrammable throughout the device's lifetime.

Can S29GL032N11DFIV20 be used in a 1.8 V I/O system?

Yes - with VIO = 1.8 V and VCC = 3.0 V (within 2.7–3.6 V range), the device supports full read/write functionality while maintaining JEDEC-compatible signaling levels. Input thresholds and output drive strength are dynamically scaled to VIO, enabling seamless integration with 1.8 V FPGAs, ASICs, or microcontrollers without level-shifting circuitry.

S29GL032N11DFIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-N

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 32Mbit

Memory Organization:: 4M x 8, 2M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 110ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL032N11DFIV20 FAQ

1.How can I place an order for S29GL032N11DFIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL032N11DFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL032N11DFIV20 reliable?

The price and inventory of S29GL032N11DFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL032N11DFIV20 is usually 5 days.

3.What payment methods are accepted for S29GL032N11DFIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL032N11DFIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL032N11DFIV20?

S29GL032N11DFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL032N11DFIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL032N11DFIV20?

For technical support, including S29GL032N11DFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL032N11DFIV20 requirements.

6.How does Aetrix verify that S29GL032N11DFIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL032N11DFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL032N11DFIV20 meets industry standards.

7.What is the process for return or replacement of S29GL032N11DFIV20?

All S29GL032N11DFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL032N11DFIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL032N11DFIV20 part is unused and in its original packaging.

Return procedure for S29GL032N11DFIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…