Cypress Semiconductor Corp S29GL064N90FAI040
- Part No.:
- S29GL064N90FAI040
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL064N90FAI040.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:360
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL064N90FAI040 from Infineon Technologies (formerly Cypress) is a 64 Mbit, 3.0 V single-power-supply MirrorBit Flash memory organized as 4,194,304 words (16-bit bus), featuring 90 ns access time, 100,000 erase cycles per sector, and 20-year data retention. It supports uniform sector architecture with 128 × 64 KB sectors and operates across VIO = 1.65–3.6 V for flexible I/O voltage control - deployed in industrial embedded boot code storage and firmware update systems.
For engineers reviewing the S29GL064N90FAI040 datasheet, S29GL064N90FAI040 pinout, S29GL064N90FAI040 application, or S29GL064N90FAI040 equivalent, key selection criteria include sector protection granularity (128-word Secured Silicon Sector), CFI compliance for host auto-configuration, Erase/Program Suspend capability, and TSOP-48 package compatibility with legacy PCB footprints.
Technical Context
This device implements a command-set-compatible JEDEC-standard Flash interface with hardware reset (RESET#), Ready/Busy# status signaling, and dual-mode write protection via WP#/ACC input. Its 110 nm MirrorBit process enables hot-hole erase and hot-electron programming, supporting both byte/word configuration (via BYTE#) and page-mode reads (8-word buffer).
It integrates Advanced Sector Protection with Persistent and Password-based modes, plus CFI-compliant identification registers. The VIO-referenced VersatileI/O™ allows independent I/O voltage scaling down to 1.65 V while maintaining full functionality at VCC = 2.7–3.6 V - critical for mixed-voltage system integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 × 16-bit words); enables full boot firmware + parameter storage in single device |
| Access Time | 90 ns at VCC = 2.7–3.6 V; meets real-time boot latency requirements in industrial controllers |
| Erase Endurance | 100,000 cycles per sector; supports field firmware updates over 10+ years of operation |
| Data Retention | 20 years at 125°C; validated for automotive under-hood and industrial high-temp environments |
| Supply Voltage | VCC = 2.7–3.6 V, VIO = 1.65–3.6 V; decouples I/O logic from core voltage for mixed-signal SoC interfacing |
| Page Read Buffer | 8-word (16-byte); reduces sequential read latency by eliminating address setup overhead per word |
| Write Buffer Size | 16-word (32-byte); cuts multi-word programming time by >40% vs. single-word writes |
Pinout & Package
Package: 48-pin TSOP (Standard Thin Small Outline Package), 12 × 20 mm body, lead pitch 0.5 mm - compatible with JEDEC MO-142AC standard and automated SMT assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4M-word addressing; A-1 used for DQ15 multiplexing in x16 mode |
| DQ0–DQ15 | Data I/O Bus | 16-bit bidirectional data path; DQ15 doubles as A-1 for x16 configuration; supports BYTE#-controlled x8 mode |
| CE#, OE#, WE# | Chip/Output/Write Enable | Independent control enables interleaved read/write operations and eliminates bus contention during memory access |
| WP#/ACC | Write Protect / Accelerated Program | Logic-low assertion protects first/last sector; high-voltage mode (VHH) reduces programming time by ~50% in production |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicates active erase/program cycle completion - eliminates polling overhead |
| RESET# | Hardware Reset Input | Asynchronous reset terminates ongoing operations and restores device to known state; ties directly to system reset rail |
| VIO | I/O Supply Reference | Defines logic threshold for all address/control/data pins; enables interoperability with 1.8 V or 3.3 V host interfaces |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory- or customer-lockable region with 8-word ESN; provides immutable device identity for secure boot verification |
| Erase Suspend/Resume | Pauses background sector erase to allow immediate read/program of other sectors - essential for real-time firmware patching |
| Unlock Bypass Mode | Reduces multi-word programming command overhead from 4 to 2 write cycles; improves throughput by ~35% in mass production |
| CFI Compliance | Standardized query structure enables automatic detection and configuration by host BIOS/bootloader without hard-coded drivers |
| Persistent Sector Protection | Non-volatile lock bits disable program/erase in selected sectors without requiring external voltage; replaces obsolete 12 V protection schemes |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing certified firmware images and calibration tables in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped to CPU address space; accessed during cold start and runtime firmware updates. Use Value: 20-year data retention ensures firmware integrity across extended maintenance cycles; 100K erase cycles support quarterly security patches. |
Use Scenario: Hosting boot code and display assets for digital instrument clusters requiring ASIL-B compliant memory behavior. IC Role / Device Role / Timing Role: Primary boot device executing from reset vector; supports secure boot via Secured Silicon Sector ESN binding. Use Value: 90 ns access time meets <100 µs boot deadline; RY/BY# signal enables deterministic interrupt-driven status handling. |
| Medical Diagnostic Equipment Configuration | Telecom Base Station Field Upgrade Module |
|
Use Scenario: Retaining regulatory-cleared configuration profiles and sensor calibration data across power cycles in FDA-class II devices. IC Role / Device Role / Timing Role: Parameter storage with password-protected sector access; isolated from main application flash to prevent accidental overwrite. Use Value: Password Sector Protection enforces role-based access control; CFI interface simplifies bootloader compatibility across device generations. |
Use Scenario: Enabling zero-downtime firmware upgrades in carrier-grade baseband units via background sector erase and program. IC Role / Device Role / Timing Role: Dual-bank capable storage partitioned into active/inactive firmware banks; Erase Suspend allows service interruption recovery. Use Value: 16-word write buffer accelerates 2 MB firmware chunk writes; uniform 64 KB sectors simplify bank alignment and wear leveling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL064S90TFI010 | Same density and speed, but 56-pin TSOP package; lacks Secured Silicon Sector and Password Protection | Targeted at cost-sensitive consumer electronics where secure identity and sector-level password enforcement are not required | Select when board layout accommodates larger TSOP-56 footprint and security features are omitted from system architecture |
| MX29GL640EHTI-90G | 64 Mbit, 90 ns, but uses 130 nm process; no CFI support; only uniform sector architecture (no boot sectors) | Used in legacy telecom infrastructure where host firmware lacks CFI auto-detection and boot-sector flexibility is unnecessary | Choose only if existing design relies on non-CFI command sets and does not require suspend/resume or secured silicon functions |
Compared with S29GL064S90TFI010 and MX29GL640EHTI-90G, the S29GL064N90FAI040 uniquely combines CFI compliance, Erase/Program Suspend, and factory-programmable Secured Silicon Sector - making it the sole option for secure, upgradable boot memory in safety-critical industrial and automotive platforms.
Availability
S29GL064N90FAI040 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29GL064N90FAI040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive microcontrollers, and non-volatile memory solutions with ISO/TS 16949-certified manufacturing.
This device belongs to the S29GL-N MirrorBit Flash family, engineered for high-reliability embedded boot and firmware storage in harsh-temperature, long-lifecycle applications - emphasizing data integrity, secure identity, and field-upgradability.
FAQ
What package type is S29GL064N90FAI040?
S29GL064N90FAI040 uses a 48-pin TSOP (Thin Small Outline Package) with 12 × 20 mm body and 0.5 mm lead pitch, conforming to JEDEC MO-142AC. It is not pin-compatible with 56-pin or BGA variants of the same family - mechanical and thermal handling requires adherence to Cypress/Infineon special packaging guidelines for molded packages.
Does S29GL064N90FAI040 support 8-bit data bus operation?
Yes, it supports 8-bit operation via the BYTE# input: when BYTE# is asserted low, the device operates in x8 mode using DQ0–DQ7 only, with A0–A20 providing 21-bit addressing. This mode is fully supported in both read and write operations and maintains full command set compatibility including CFI queries and sector protection.
How is the Secured Silicon Sector programmed and locked?
The Secured Silicon Sector is programmed using the Enter Secured Silicon Sector command sequence (0x00 → 0x00 → 0x00 → 0x00), then written like normal flash. Locking is performed via the Lock Secured Silicon Sector command (0x00 → 0x00 → 0x00 → 0x29). Once locked, no further writes or erases are possible - even with VPP applied - and the 8-word ESN remains permanently readable.
Can Erase Suspend be used during Chip Erase?
No. Erase Suspend is supported only for Sector Erase operations, not Chip Erase. During a Chip Erase command sequence, the device does not respond to Erase Suspend commands; attempting to issue one has no effect. Host systems must complete chip erase before initiating any other operation - this is explicitly defined in the AC characteristics table and command definitions section of the datasheet.
S29GL064N90FAI040 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-N
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8, 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL064N90FAI040 FAQ
1.How can I place an order for S29GL064N90FAI040 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL064N90FAI040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL064N90FAI040 reliable?
The price and inventory of S29GL064N90FAI040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL064N90FAI040 is usually 5 days.
3.What payment methods are accepted for S29GL064N90FAI040?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL064N90FAI040 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL064N90FAI040?
S29GL064N90FAI040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL064N90FAI040 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL064N90FAI040?
For technical support, including S29GL064N90FAI040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL064N90FAI040 requirements.
6.How does Aetrix verify that S29GL064N90FAI040 is sourced from the original manufacturer or authorized distributors?
All S29GL064N90FAI040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL064N90FAI040 meets industry standards.
7.What is the process for return or replacement of S29GL064N90FAI040?
All S29GL064N90FAI040 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL064N90FAI040, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL064N90FAI040 part is unused and in its original packaging.
Return procedure for S29GL064N90FAI040:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL064N90FAI040 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

