Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL128N10TFI010

Name: S29GL128N10TFI010
Brand: Cypress Semiconductor Corp
SKU: S29GL128N10TFI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL128N10TFI010

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL128N10TFI010.pdf

Description:: IC FLASH 128MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:778

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL128N10TFI010 from Cypress Semiconductor is a 128 Mbit (16 MB), 3.0 V single-power-supply NOR Flash memory using 110 nm MirrorBit technology, organized as 8,388,608 words × 16 bits, with 90 ns access time, 25 ns page read time, and 100,000 erase cycles per sector - deployed in boot code storage for industrial control firmware and FPGA configuration.

For engineers reviewing the S29GL128N10TFI010 datasheet, S29GL128N10TFI010 pinout, S29GL128N10TFI010 application, or S29GL128N10TFI010 equivalent, key selection criteria include JEDEC-compliant command set, Secured Silicon Sector with 128-word serial ID, Enhanced VersatileI/O™ (VIO = 1.65–3.6 V), and TSOP-56/BGA-64 package compatibility for legacy embedded systems.

Technical Context

This device implements a sector-erase architecture with 128 independent 64 Kword (128 Kbyte) sectors, supporting both chip- and sector-level erase commands. It uses hot-electron injection for programming and hot-hole assisted erase, with hardware reset (RESET#) and Ready/Busy# (RY/BY#) signaling for operation status.

Command execution relies on JEDEC-standard write sequences latched internally; features include Program Suspend/Resume and Erase Suspend/Resume, enabling concurrent read operations during active programming or erasure. CFI (Common Flash Interface) support enables automatic host identification and parameter retrieval.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	128 Mbit (16 MB), organized as 8,388,608 × 16-bit words - supports full firmware image storage for microcontroller boot loaders.
Access Time	90 ns (VCC = 3.0–3.6 V, VIO = 3.0–3.6 V) - enables direct XIP (eXecute-In-Place) execution from flash in real-time control applications.
Erase Endurance	100,000 cycles per sector - suitable for field-upgradable firmware with infrequent reprogramming.
Data Retention	20 years typical - ensures long-term reliability in unattended industrial equipment.
Supply Voltage	VCC = 2.7–3.6 V, VIO = 1.65–3.6 V - allows interoperability with 1.8 V or 3.3 V host buses via VIO pin control.
Page Read Buffer	8-word (16-byte) buffer with 25 ns page access - reduces sequential read latency in configuration data fetches.
Write Buffer	16-word (32-byte) buffer - cuts multi-word programming time by minimizing command overhead.

Pinout & Package

Available in 56-pin TSOP (standard thin small outline package) and 64-ball Fortified BGA (LAA064). Pin functions are identical across packages except for NC assignments: Ball C8 is no-connect on S29GL128N; Ball F8 is no-connect on S29GL128N and S29GL256N.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	23-bit address bus supporting full 128 Mbit addressing (A22 = MSB); BYTE# selects 8- or 16-bit mode.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; toggles DQ6/DQ2 and polls DQ7 for status during program/erase.
CE#, OE#, WE#	Chip/Output/Write Enable	Independent controls allow interleaved access and eliminate bus contention in multi-device systems.
WP#/ACC	Write Protect / Accelerated Program	Pull-low protects first/last sector; high-voltage assertion reduces programming time in production test environments.
VIO	I/O Voltage Reference	Sets input threshold and output drive level for all address/control/data pins - enables mixed-voltage system integration.
RY/BY#	Ready/Busy Output	Active-low open-drain signal indicates ongoing program/erase; used for hardware flow control without polling.
RESET#	Hardware Reset Input	Aborts current operation and returns device to read mode - synchronizes boot sequence with system power-on reset.

Key Features

Feature	Design Value
Secured Silicon Sector	128-word (256-byte) factory- or customer-lockable region with 8-word electronic serial number - enables secure device authentication and immutable firmware signing keys.
Password Sector Protection	User-defined 64-bit password prevents unauthorized erase/write of selected sectors - enforces firmware integrity in field-deployed devices.
Enhanced VersatileI/O™	VIO pin configures all I/O voltage thresholds dynamically - eliminates level-shifters when interfacing with 1.8 V SoCs or 3.3 V FPGAs.
Program/Erase Suspend	Pause active programming or erasure to read/program other sectors - enables real-time logging while updating application code.
CFI Compliance	Standardized query table at address 0x0055/0x002A enables automatic detection and configuration by bootloader or flash utility software.

Applications

Industrial PLC Firmware Storage

FPGA Configuration Memory

Use Scenario: Storing boot firmware and runtime logic for programmable logic controllers operating in harsh temperature environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Non-volatile boot memory mapped directly into MCU address space; provides deterministic 90 ns read latency for fast startup.

Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity over 10+ year product lifecycles without field replacement.

Use Scenario: Holding bitstream configuration for Xilinx Spartan or Intel MAX 10 FPGAs in automated test equipment.

IC Role / Device Role / Timing Role: Standalone configuration source loaded at power-up; supports parallel x16 mode for sub-100 ms FPGA initialization.

Use Value: Page read buffer and 25 ns page access reduce configuration time by >35% versus standard SPI flash alternatives.

Medical Diagnostic Boot Loader

Avionics Data Recorder

Use Scenario: Hosting certified boot loader and safety-critical diagnostic routines in portable ultrasound and ECG devices.

IC Role / Device Role / Timing Role: Secure boot memory with Secured Silicon Sector storing cryptographic keys; accessed via locked CFI interface.

Use Value: Password protection and persistent sector lock prevent tampering with FDA/IEC 62304-compliant firmware images.

Use Scenario: Capturing flight telemetry and sensor logs in black-box recorders requiring radiation-tolerant non-volatility.

IC Role / Device Role / Timing Role: High-reliability storage with hardware RESET# synchronization to aircraft power sequencing and RY/BY# status monitoring.

Use Value: 1 µA standby current extends battery-backed operation during ground maintenance; 2.7–3.6 V VCC range accommodates aging avionics power rails.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S10TFI010	Successor part; 90 ns access, same density, 65 nm MirrorBit process, improved 1.8 V VIO support down to 1.65 V	Drop-in compatible pinout and command set; enhanced low-voltage margin for newer SoC interfaces	Select for new designs requiring extended voltage tolerance and longer lifecycle availability
MX29GL128FHT2I-90G	Macronix equivalent; 90 ns access, 128 Mbit, TSOP-56, JEDEC-compatible but lacks Secured Silicon Sector and password protection	Lower cost alternative where cryptographic security and permanent ID are not required	Choose when budget constraints outweigh need for secure silicon features and 20-year retention is secondary

Compared with S29GL128N10TFI010, the S29GL128S10TFI010 offers tighter VIO tolerance and longer manufacturer support, while the MX29GL128FHT2I-90G sacrifices security features for cost - making the original optimal only for legacy system repair or exact form-fit-function replacement.

Availability

S29GL128N10TFI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, FPGA configuration memory, and medical diagnostic boot loader applications requiring stable component supply amid end-of-life transitions.

Supply support for S29GL128N10TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.

The S29GL-N family was designed for high-reliability, pin-compatible NOR flash replacement in legacy embedded systems requiring deterministic timing, secure boot, and long-term data retention - before migration paths like S29GL-S were introduced.

FAQ

Is S29GL128N10TFI010 still recommended for new designs?

No. Cypress explicitly states this part is "Not Recommended for New Design" and designates S29GL128S10TFI010 as the factory-recommended migration path. The S29GL128N remains viable only for legacy repair, obsolescence mitigation, or exact replacement in existing production - with no future roadmap support or wafer fab allocation.

What is the function of the WP#/ACC pin?

The WP#/ACC pin serves dual roles: when pulled low, it protects the first or last sector from accidental writes; when driven to VCC + 2.5 V (via external charge pump), it accelerates programming throughput by increasing internal current - a feature intended for high-volume manufacturing test, not field operation.

Does S29GL128N10TFI010 support 1.8 V I/O operation?

Yes. With VIO = 1.65–3.6 V, the device fully supports 1.8 V I/O signaling when VIO is tied to 1.8 V, enabling direct interface with low-voltage SoCs and FPGAs without level shifters - confirmed in the VersatileI/O™ section and AC characteristics tables.

How is the Secured Silicon Sector programmed and locked?

It is programmed via a specific command sequence (enter secured silicon sector → write 128-word data → exit), then permanently locked using the Persistent Protection Bit Lock (PPB Lock Bit). Once locked, no further writes or erases are possible - even with power cycling - ensuring cryptographic keys or serial IDs remain immutable.

S29GL128N10TFI010 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-N

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 16M x 8, 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 100ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL128N10TFI010 FAQ

1.How can I place an order for S29GL128N10TFI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128N10TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128N10TFI010 reliable?

The price and inventory of S29GL128N10TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128N10TFI010 is usually 5 days.

3.What payment methods are accepted for S29GL128N10TFI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128N10TFI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128N10TFI010?

S29GL128N10TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128N10TFI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128N10TFI010?

For technical support, including S29GL128N10TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128N10TFI010 requirements.

6.How does Aetrix verify that S29GL128N10TFI010 is sourced from the original manufacturer or authorized distributors?

All S29GL128N10TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128N10TFI010 meets industry standards.

7.What is the process for return or replacement of S29GL128N10TFI010?

All S29GL128N10TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128N10TFI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128N10TFI010 part is unused and in its original packaging.

Return procedure for S29GL128N10TFI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…