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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL128S10TFV010

Name: S29GL128S10TFV010
Brand: Cypress Semiconductor Corp
SKU: S29GL128S10TFV010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL128S10TFV010

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL128S10TFV010.pdf

Description:: NOR FLASH PARALLEL 3V 128M-BIT 8

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Product details

Overview

S29GL128S10TFV010 from Infineon is a 128 Mb (16 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and firmware updates in microcontroller-based systems.

For engineers reviewing the S29GL128S10TFV010 datasheet, S29GL128S10TFV010 pinout, S29GL128S10TFV010 application, or S29GL128S10TFV010 equivalent, this device supports XIP-capable boot code execution, asynchronous page-mode reads, sector-level protection, and AEC-Q100 Grade 3 automotive qualification-critical for industrial HMI, automotive ECUs, and secure firmware storage designs.

Technical Context

The S29GL128S10TFV010 implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting word-aligned 16-bit transfers and 32-byte page-aligned reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.

It features dual-voltage I/O (VIO = 1.65 V to VCC), enabling interoperability with mixed-voltage SoCs, and includes a dedicated 1024-byte OTP array with two lockable regions for secure boot keys or calibration data-managed independently from main array operations.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	128 Mb (16 MB), organized as 1,048,576 × 16-bit words
Random access time	90 ns at VCC = VIO, enabling fast instruction fetch in XIP applications
Page access time	15 ns for subsequent 32-byte aligned reads within same page
Write buffer size	512 bytes (256 words), reducing effective programming time vs. byte-by-byte writes
ECC capability	On-die hardware single-bit error correction, eliminating need for external ECC logic
Endurance & retention	100,000 program/erase cycles; 20-year data retention at 85°C
Operating voltage	VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC for flexible host interfacing
Temperature grade	Industrial (–40°C to +85°C), AEC-Q100 Grade 3 qualified

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit address bus supporting full 16 MB addressing (AMAX = A22)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports word-wide read/write transfers
CE#	Chip enable	Active-low chip select; controls device power state and command latching
OE#	Output enable	Active-low gate for data output drivers; enables read data assertion
WE#	Write enable	Active-low strobe for write operations; latches address/data during programming
RY/BY#	Ready/Busy indicator	Open-drain output signaling ongoing embedded operation (low = busy)
RESET#	Hardware reset	Active-low input forcing device into known reset state, clearing status registers
WP#	Write protect	Hardware sector protection override; disables program/erase when asserted
VCC	Core supply	3.0 V nominal supply (2.7–3.6 V) powering core logic and memory array
VIO	I/O supply	Independent I/O voltage rail (1.65–VCC) enabling mixed-voltage system integration

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns cycle time improves sequential code fetch efficiency
512-byte write buffer	Enables burst programming of up to 256 words per command, cutting firmware update time by ~4× vs. single-word writes
Hardware ECC engine	Single-bit error correction performed transparently during read, ensuring data integrity without CPU overhead
Advanced sector protection (ASP)	Volatile and non-volatile locking per 128-kB sector prevents accidental firmware overwrite in field-deployed units
Secure OTP array	1024-byte one-time-programmable region with two independent lock bits for secure key or calibration storage
CFI-compliant interface	Standardized parameter table allows automatic detection and configuration by bootloader or flash utility software

Applications

Automotive ECU Boot Memory

Industrial PLC Firmware Storage

Use Scenario: Storing boot code and safety-critical firmware in engine control units requiring AEC-Q100 compliance and long-term reliability.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory with deterministic 90 ns read latency and hardware ECC for fault-tolerant startup.

Use Value: Eliminates external error-checking logic while meeting ISO 26262 ASIL-B requirements via on-die ECC and 100K-cycle endurance.

Use Scenario: Holding firmware images and configuration data in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: High-reliability parallel flash for field-upgradable firmware with sector-level write protection against corruption during power loss.

Use Value: ASP and suspend/resume commands prevent partial erase/program failure during brown-out events, ensuring firmware atomicity.

Medical Device Diagnostic Code

Networking Equipment Configuration

Use Scenario: Storing diagnostic algorithms and calibration tables in portable ultrasound or infusion pumps requiring data retention over 15+ years.

IC Role / Device Role / Timing Role: Secure, long-life flash with OTP-locked calibration data and ECC-protected runtime code.

Use Value: 20-year data retention at 85°C and hardware-locked OTP region ensure regulatory compliance (IEC 62304 Class C) without battery backup.

Use Scenario: Holding boot images, FPGA bitstreams, and configuration profiles in enterprise switches and routers with frequent firmware updates.

IC Role / Device Role / Timing Role: High-speed parallel flash supporting rapid field upgrades via 512-byte buffered programming and CFI auto-detection.

Use Value: 1.5 MBps buffer programming rate reduces upgrade window by >60% compared to legacy NOR devices, minimizing network downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL128S11TFV010	Same die, faster 110 ns random access (vs. 90 ns), higher VCC min (3.0 V), no VIO versatility	Requires stable 3.0 V I/O; unsuitable for mixed-voltage hosts with 1.8 V logic	Select only if system uses fixed 3.0 V I/O and prioritizes marginally faster worst-case access over voltage flexibility
MX29GL128FPTI-90G	Macronix 128 Mb parallel NOR; 90 ns access, but no on-die ECC or OTP array	Lacks hardware error correction and secure key storage-requires external ECC or SW mitigation	Choose when cost sensitivity outweighs need for built-in ECC and secure OTP, and system can absorb added software complexity

Compared with S29GL128S10TFV010, the S29GL128S11TFV010 trades I/O voltage flexibility for slightly relaxed timing margins, while MX29GL128FPTI-90G omits ECC and OTP-making the Infineon part uniquely suited for safety-critical or secure firmware applications where hardware-level data integrity and key isolation are mandatory.

Availability

S29GL128S10TFV010 is available at Aetrix Electronics and suitable for automotive ECU boot memory, industrial PLC firmware storage, and medical diagnostic code storage requiring stable component supply across extended product lifecycles.

Supply support for S29GL128S10TFV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949.

The GL-S family targets embedded systems needing robust, high-density parallel NOR flash with XIP capability, ECC, and automotive qualification-designed specifically for mission-critical boot and firmware storage where data integrity and long-term availability are non-negotiable.

FAQ

Does S29GL128S10TFV010 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 90 ns random access time and 15 ns page-mode read latency, allowing microcontrollers to execute code directly from flash without copying to RAM. Its asynchronous interface and deterministic timing meet real-time interrupt response requirements in automotive and industrial control applications.

What is the function of the VIO pin, and how does it differ from VCC?

VIO supplies power to the input/output buffers independently from VCC, which powers the core memory array and logic. VIO accepts 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters-while VCC remains fixed at 2.7–3.6 V for stable core operation and memory retention.

How is sector protection implemented, and can it be changed in-system?

Sector protection uses Advanced Sector Protection (ASP) with both volatile (lock-down via command) and non-volatile (permanent lock via dedicated command) modes per 128-kB sector. Volatile locks reset on power cycle; non-volatile locks persist until explicitly cleared using unlock sequences-providing flexible, field-upgrade-safe firmware partitioning.

Is the 512-byte write buffer usable for partial-page programming?

No. The write buffer requires programming in exact multiples of 32-byte pages (minimum 32 bytes, maximum 512 bytes). Partial-page writes are not supported; attempting to program fewer than 32 bytes triggers a write error. Buffer programming must align to 32-byte boundaries and use valid page addresses per the device's address map.

S29GL128S10TFV010 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 8M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL128S10TFV010 FAQ

1.How can I place an order for S29GL128S10TFV010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL128S10TFV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL128S10TFV010 reliable?

The price and inventory of S29GL128S10TFV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL128S10TFV010 is usually 5 days.

3.What payment methods are accepted for S29GL128S10TFV010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL128S10TFV010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL128S10TFV010?

S29GL128S10TFV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL128S10TFV010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL128S10TFV010?

For technical support, including S29GL128S10TFV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL128S10TFV010 requirements.

6.How does Aetrix verify that S29GL128S10TFV010 is sourced from the original manufacturer or authorized distributors?

All S29GL128S10TFV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL128S10TFV010 meets industry standards.

7.What is the process for return or replacement of S29GL128S10TFV010?

All S29GL128S10TFV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL128S10TFV010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL128S10TFV010 part is unused and in its original packaging.

Return procedure for S29GL128S10TFV010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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