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Cypress Semiconductor Corp S29GL256S10DHV020
- Part No.:
- S29GL256S10DHV020
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHV020.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:7,196
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Product details
Overview
S29GL256S10DHV020 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) for read/program/erase - deployed in industrial-grade embedded boot code storage and firmware update applications.
For engineers reviewing the S29GL256S10DHV020 datasheet, S29GL256S10DHV020 pinout, S29GL256S10DHV020 application, or S29GL256S10DHV020 equivalent, key selection criteria include uniform 128-kbyte sector erase, hardware ECC (single-bit correction), 100,000 program/erase cycles, Versatile I/O (1.65–3.6 V), and CFI-compliant interface for BIOS/firmware compatibility.
Technical Context
This device implements an asynchronous parallel interface with ×16 data bus, word-aligned addressing, and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY#, and automatic ECC on read/write paths.
The architecture supports suspend/resume during programming or erasing, advanced sector protection (volatile/non-volatile), and a dedicated 1024-byte OTP array with dual lockable regions - enabling secure boot configuration and calibration data storage in automotive and industrial control systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full firmware images in microcontroller-based edge nodes. |
| Access time (random) | 90 ns at VCC = VIO - enables direct XIP execution without external cache in real-time control firmware. |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages during boot or ISR execution. |
| Programming buffer | 512 bytes (256 words) - reduces effective programming time by batching writes, critical for field firmware updates. |
| Erase granularity | Uniform 128-kbyte sectors - allows selective firmware partitioning (e.g., bootloader vs. application) with deterministic erase timing. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial PLCs and automotive ECUs. |
| Operating temperature | –40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments like factory-floor HMIs. |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with legacy flash socket designs and automated PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus (AMAX = A23); supports full 256 Mb addressing with no bank switching required. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO (1.65–3.6 V), enabling direct interfacing with 1.8 V or 3.3 V controllers. |
| CE# | Chip enable | Active-low chip select; tCE = 90 ns - defines minimum assertion time before valid read data appears. |
| OE# | Output enable | Active-low output control; tOE = 25 ns - determines maximum delay from OE# assertion to valid DQ output. |
| WE# | Write enable | Active-low write strobe; controls latching of command sequences and data into internal registers. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during embedded operations (program/erase), used for polling-based status detection. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state, clears status register, aborts ongoing operations. |
| VCC | Core supply | 3.0 V ±10% (2.7–3.6 V); powers core logic, EAC, and voltage generators - no separate VPP required. |
| VIO | I/O supply | Independent 1.65–3.6 V rail; decouples I/O signaling from core voltage, simplifying mixed-voltage system design. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with automatic detection - eliminates need for software-level CRC overhead in safety-critical firmware storage. |
| Versatile I/O | Independent VIO rail (1.65–3.6 V) - permits direct connection to 1.8 V FPGA I/O banks or 3.3 V MCU buses without level shifters. |
| Page-mode read | 32-byte aligned page access with 15 ns cycle time - improves instruction throughput during linear code execution from flash. |
| OTP array | 1024-byte one-time-programmable region with two lockable sectors - stores immutable keys, calibration constants, or device-unique identifiers. |
| CFI compliance | Standard Common Flash Interface parameter table - enables auto-detection and driver compatibility across BIOS, U-Boot, and RTOS flash abstractions. |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Code |
|---|---|
Use Scenario: Storing and executing boot firmware and ladder logic runtime in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 90 ns read latency for real-time task scheduling. Use Value: Eliminates external SRAM caching; 20-year data retention ensures firmware integrity over equipment lifetime without maintenance. |
Use Scenario: Holding certified boot loader and GUI assets in automotive digital instrument clusters requiring AEC-Q100 Grade 3 qualification. IC Role / Device Role / Timing Role: Secure, high-reliability firmware repository supporting safe boot verification and OTA update rollback. Use Value: Hardware ECC and sector protection prevent corruption from ESD or voltage transients during vehicle cranking events. |
| Medical Diagnostic Device Configuration | Telecom Base Station Control Software |
Use Scenario: Retaining calibrated sensor coefficients, regulatory compliance settings, and UI language packs in portable ultrasound and imaging systems. IC Role / Device Role / Timing Role: Parameter storage with OTP-locked calibration data and field-upgradable application binaries. Use Value: Dual-lock OTP regions ensure calibration data immutability while allowing application updates via 128-kbyte sector erase. |
Use Scenario: Hosting baseband control firmware and protocol stack images in outdoor telecom infrastructure with extended temperature operation. IC Role / Device Role / Timing Role: High-density, radiation-tolerant firmware storage supporting hot-swap and remote reprogramming. Use Value: 100,000-cycle endurance enables frequent field updates; Versatile I/O simplifies integration with 1.8 V FPGA control planes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFV020 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm) package - no TSOP footprint compatibility. | Targeted at space-constrained designs where board area is prioritized over socket-based serviceability. | Select when PCB layout requires BGA miniaturization and reflow-only assembly is acceptable. |
| MX29GL256FHT2I-90G | Macronix part with 90 ns access, but lacks hardware ECC and OTP array; CFI support limited to basic query mode. | Suitable for cost-sensitive consumer applications where ECC and secure storage are not mandated. | Choose only if firmware integrity is managed externally and long-term data retention is not mission-critical. |
Compared with S29GL256P10TFV020, this TSOP variant offers field-serviceable replacement and legacy board compatibility; versus MX29GL256FHT2I-90G, it delivers hardware-level ECC and OTP security essential for industrial and automotive use cases.
Availability
S29GL256S10DHV020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot code, and medical diagnostic device configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL256S10DHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in industrial and automotive-grade non-volatile memory solutions.
The GL-S family targets high-reliability embedded systems requiring XIP-capable NOR flash with integrated ECC, sector protection, and extended temperature operation - specifically designed for automotive ECUs, industrial HMIs, and medical devices.
FAQ
Does S29GL256S10DHV020 support execute-in-place (XIP) operation?
Yes. The device supports true XIP with 90 ns random access time and 15 ns page-mode reads, enabling direct CPU instruction fetch from flash without copying to RAM. Its architecture includes dedicated address/data latches and fast state control logic optimized for zero-wait-state execution in Cortex-M and Power Architecture microcontrollers.
What is the function of the Versatile I/O (VIO) feature?
VIO provides independent voltage control for the DQ[15:0] bus (1.65–3.6 V), decoupled from the 3.0 V core supply. This allows direct interfacing with 1.8 V FPGAs or 3.3 V MCUs without external level shifters, reducing BOM count and signal integrity risk in mixed-voltage embedded systems.
How does the hardware ECC operate during read cycles?
Hardware ECC runs transparently on every read: the device checks each 512-byte sector for single-bit errors and corrects them in real time before presenting data on DQ[15:0]. No software intervention is needed, and corrected data is latched with no timing penalty - critical for deterministic boot sequences.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is permanently programmable once per sector; each of its two lockable regions can be individually locked via dedicated command sequence. After locking, further writes to that region are blocked at the hardware level - ensuring permanent storage of cryptographic keys or calibration data.
S29GL256S10DHV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHV020 FAQ
1.How can I place an order for S29GL256S10DHV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHV020 reliable?
The price and inventory of S29GL256S10DHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHV020 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHV020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHV020?
S29GL256S10DHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHV020?
For technical support, including S29GL256S10DHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHV020 requirements.
6.How does Aetrix verify that S29GL256S10DHV020 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHV020 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHV020?
All S29GL256S10DHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHV020 part is unused and in its original packaging.
Return procedure for S29GL256S10DHV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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