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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL256S10FAIV20

Name: S29GL256S10FAIV20
Brand: Cypress Semiconductor Corp
SKU: S29GL256S10FAIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10FAIV20

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10FAIV20.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S10FAIV20 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL256S10FAIV20 datasheet, S29GL256S10FAIV20 pinout, S29GL256S10FAIV20 application, or S29GL256S10FAIV20 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and OTP array for secure configuration storage.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces automatic ECC during read cycles.

The flash array is organized into uniform 128 kB sectors with advanced sector protection (ASP), enabling independent volatile/non-volatile locking per sector. The integrated 1024-byte OTP array contains two lockable regions for immutable firmware keys or calibration data.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), mapped as 2²³ × 16-bit words - supports full boot image storage for mid-range MCUs
Random access time	90 ns at VCC = VIO - enables deterministic XIP execution latency in real-time systems
Page access time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages
Write buffer size	512 bytes - reduces effective programming time by batching up to 256 words per command
ECC capability	Hardware single-bit error correction - eliminates need for external ECC logic in safety-critical designs
Endurance & retention	100,000 program/erase cycles; 20-year data retention - meets long-lifecycle industrial deployment requirements
Operating temperature	–40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive and high-ambient industrial control

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	Word-aligned address bus; A23 is MSB for 256 Mb density (2²³ words)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control
CE#	Chip enable	Active-low chip select; controls device power state and command latching
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal state
WE#	Write enable	Active-low write strobe; initiates program/erase commands when CE# and OE# are inactive
RY/BY#	Ready/Busy indicator	Open-drain status flag; low during embedded operations, high when ready for next command
VCC	Core supply	2.7–3.6 V single supply for read/program/erase - eliminates auxiliary voltage rails
VIO	I/O supply	1.65–VCC versatile I/O - allows interfacing with 1.8 V or 3.3 V controllers without level shifters

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse technology	Enables higher density and lower active current vs. legacy floating-gate NOR, with improved cycling reliability
Asynchronous 32-byte page read	Reduces average instruction fetch latency in XIP applications by minimizing address setup overhead per word
512-byte programming buffer	Increases effective write bandwidth to 1.5 MBps - cuts firmware update time by >70% vs. single-word programming
Hardware ECC with single-bit correction	Offloads error handling from host processor and ensures data integrity without software intervention
1024-byte OTP array with dual lockable regions	Stores immutable security keys or factory calibration data, preventing field overwrite while allowing one-time provisioning

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic 90 ns instruction fetch latency to ARM Cortex-M7 MCU.

Use Value: 20-year data retention and 100K cycle endurance ensure firmware integrity over 15+ year product lifecycles without refresh.

Use Scenario: Hosting boot code and safety monitor firmware in radar ECU modules certified to ISO 26262 ASIL-B.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) parallel NOR flash with hardware ECC for fault-tolerant startup sequence.

Use Value: Integrated single-bit ECC eliminates external error detection logic, reducing BOM count and board area in space-constrained modules.

Medical Imaging System Configuration

Telecom Base Station FPGA Bitstream

Use Scenario: Storing calibrated sensor coefficients and regulatory compliance settings in portable ultrasound devices with battery-backed operation.

IC Role / Device Role / Timing Role: OTP-secured configuration store using dual-lockable 1024-byte region to prevent accidental field modification of calibration data.

Use Value: One-time programmable regions guarantee immutability of FDA-cleared parameters, satisfying traceability and audit requirements.

Use Scenario: Loading FPGA configuration bitstreams at power-on in 5G remote radio units deployed in outdoor cabinets.

IC Role / Device Role / Timing Role: High-speed parallel interface flash delivering 15 ns page access to minimize FPGA configuration time (<50 ms).

Use Value: 512-byte write buffer enables rapid field upgrades of FPGA logic without service interruption or extended downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFIV20	Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where footprint reduction outweighs manual soldering complexity	Select when board layout prioritizes miniaturization and automated assembly over hand-soldering feasibility
MX29GL256FHT2I-90G	Macronix part; 90 ns access, but lacks hardware ECC and OTP array; requires external error management	Suitable for cost-sensitive consumer applications where ECC is handled in software or omitted	Choose only if system-level ECC is already implemented and AEC-Q100 qualification is not required

Compared with S29GL256P10TFIV20, this TSOP variant offers easier prototyping and rework; versus MX29GL256FHT2I-90G, it provides built-in ECC and OTP security-critical for automotive and medical use cases where data integrity is non-negotiable.

Availability

S29GL256S10FAIV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across multi-year production programs.

Supply support for S29GL256S10FAIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life non-volatile storage-specifically designed for boot code, firmware, and configuration data in automotive, industrial, and medical equipment.

FAQ

Is S29GL256S10FAIV20 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. While functionally similar, S29GL256S uses a revised command set and timing model optimized for 65 nm MIRRORBIT™ Eclipse. Pinout matches S29GL256P in TSOP package, but differences in reset behavior, OTP access protocol, and ASP register mapping require firmware validation before drop-in replacement.

Does this device support burst read or synchronous interface modes?

No. S29GL256S10FAIV20 is strictly asynchronous and does not support burst, clocked, or DDR read modes. It relies on CE#, OE#, and WE# handshaking for all operations. Page-mode reads (15 ns) are the fastest supported sequential access method.

How is the 1024-byte OTP array accessed and locked?

The OTP array resides at fixed address offset 0x0000_0000 in the CFI query region. Locking is performed via dedicated unlock/lock commands issued to specific addresses in the status register ASO map; each of the two 512-byte regions can be independently locked permanently after programming.

What thermal derating applies above 85°C ambient?

Per datasheet Section 10.4, the device is rated for full performance up to +105°C junction temperature. At 105°C ambient with typical PCB copper pour, junction rise is ~15°C; no derating of access time or endurance is specified, but active current increases ~12% versus 25°C conditions.

S29GL256S10FAIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S10FAIV20 FAQ

1.How can I place an order for S29GL256S10FAIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10FAIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10FAIV20 reliable?

The price and inventory of S29GL256S10FAIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FAIV20 is usually 5 days.

3.What payment methods are accepted for S29GL256S10FAIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FAIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10FAIV20?

S29GL256S10FAIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10FAIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10FAIV20?

For technical support, including S29GL256S10FAIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FAIV20 requirements.

6.How does Aetrix verify that S29GL256S10FAIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10FAIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FAIV20 meets industry standards.

7.What is the process for return or replacement of S29GL256S10FAIV20?

All S29GL256S10FAIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FAIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10FAIV20 part is unused and in its original packaging.

Return procedure for S29GL256S10FAIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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