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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL256S11DHVV20

Name: S29GL256S11DHVV20
Brand: Cypress Semiconductor Corp
SKU: S29GL256S11DHVV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S11DHVV20

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S11DHVV20.pdf

Description:: FLASH - NOR MEMORY IC 256MB (16M

Quantity:: RFQ Add To RFQ list

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Inventory:2,446

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Product details

Overview

S29GL256S11DHVV20 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile firmware retention.

For engineers reviewing the S29GL256S11DHVV20 datasheet, S29GL256S11DHVV20 pinout, S29GL256S11DHVV20 application, or S29GL256S11DHVV20 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array for secure configuration, and AEC-Q100 Grade 2 qualification (-40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces command-set-based protection via status register and sector lock bits.

The internal architecture includes dedicated erase voltage and program voltage generators, a state machine-driven command interpreter, and hardware-accelerated ECC logic that automatically corrects single-bit errors during read and verifies integrity during write. Sector protection supports volatile (lock-down via command) and non-volatile (permanent bit-setting) methods per 128 kB sector.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); provides sufficient space for full firmware images plus parameter storage in resource-constrained embedded systems
Interface	Parallel ×16 asynchronous; enables direct CPU bus connection without translation logic or glue logic
Access Time	90 ns random / 15 ns page; allows real-time XIP execution of boot code with minimal latency penalty
Programming Buffer	512 bytes; reduces effective programming time by batching writes-critical for field firmware updates
Erase Granularity	Uniform 128 kB sectors; simplifies partitioning of boot loader, application, and configuration regions
ECC Support	Hardware single-bit correction; eliminates need for external error-handling software in safety-critical applications
Endurance	100,000 program/erase cycles; supports frequent over-the-air update deployments in industrial gateways
Data Retention	20 years at +85°C; ensures long-term reliability in unattended infrastructure equipment

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus; A23 is MSB for 256 Mb density (2²⁴ × 16-bit = 32 MB)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads under WE#/OE# control
CE#	Chip enable	Active-low chip select; must be asserted before OE# or WE# to initiate any operation
OE#	Output enable	Active-low read strobe; controls output buffer enable during read cycles only
WE#	Write enable	Active-low write strobe; latches address/data on rising edge for program/erase commands
RY/BY#	Ready/Busy indicator	Open-drain active-low signal; asserts low during embedded operations (program/erase)
RESET#	Hardware reset	Active-low asynchronous reset; forces device into reading ID mode and aborts ongoing operations
VCC	Core supply	2.7–3.6 V core power; powers logic, EAC, and memory array
VIO	I/O supply	1.65–3.6 V independent I/O rail; decouples interface voltage from core for mixed-voltage system interfacing
WP#	Write protect	Active-low hardware sector protection enable; disables program/erase when asserted

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65–3.6 V I/O supply allows seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters
512-byte programming buffer	Enables burst programming up to 1.5 MBps-over 3× faster than single-word writes for firmware patching
Hardware ECC engine	Single-bit error correction performed transparently during read; no CPU overhead or software intervention required
OTP array (1024 bytes)	Two lockable regions store immutable keys, calibration data, or security certificates-prevents tampering post-configuration
Advanced sector protection (ASP)	Combines volatile (command-based) and non-volatile (bit-programmed) locking per 128 kB sector for flexible, layered security
Suspend/resume capability	Allows interrupting erase or program operations to service high-priority reads-essential for real-time response in HMI systems

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns access latency.

Use Value: Uniform 128 kB sector erase enables safe dual-bank firmware updates; hardware ECC ensures integrity of safety-critical motion control code.

Use Scenario: Holding boot code and sensor fusion algorithms for radar/EPS ECUs operating in under-hood automotive environments.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot source for ARM Cortex-R5F-based domain controllers.

Use Value: 105°C operation and 20-year data retention meet ASIL-B requirements; OTP region stores cryptographic keys for secure boot verification.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring regulatory compliance and field-upgradability.

IC Role / Device Role / Timing Role: Trusted firmware repository with hardware write protection and CFI-compliant identification for automated BOM validation.

Use Value: Common Flash Interface (CFI) table enables plug-and-play detection by host bootloader; ASP prevents accidental corruption during remote diagnostics.

Use Scenario: Storing FPGA configuration, DSP firmware, and RF calibration tables in 5G macro base station radios with strict thermal and longevity requirements.

IC Role / Device Role / Timing Role: High-reliability parallel flash memory interfaced directly to TI C66xx DSPs for deterministic boot and runtime parameter loading.

Use Value: 100,000-cycle endurance supports frequent field calibration updates; Versatile I/O accommodates 1.8 V DSP I/O while maintaining 3.3 V core stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P11TFIV20	Same density and timing, but uses 64-ball LAE FBGA (9 mm × 9 mm); lacks OTP array and ASP non-volatile lock bits	Targeted at cost-sensitive consumer electronics where sector-level permanent lock is unnecessary	Select when footprint compatibility with LAE package is required and OTP/security features are not needed
N25Q256A13ESE40F	256 Mb quad SPI interface; 133 MHz clock, no parallel bus; no hardware ECC or OTP; supports 4-byte addressing	Designed for space-constrained designs using SPI-only host interfaces; requires driver abstraction layer	Select when board layout favors serial interface and host MCU supports QSPI with XIP extensions

Compared with S29GL256P11TFIV20, this part adds OTP and non-volatile sector locking for enhanced security; compared with N25Q256A13ESE40F, it offers deterministic parallel latency and integrated ECC but requires more PCB area and routing complexity.

Availability

S29GL256S11DHVV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S11DHVV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.

The GL-S family targets embedded systems needing robust, high-speed parallel NOR flash with advanced data integrity and security features-designed specifically for boot code, firmware, and configuration storage in harsh environments.

FAQ

What is the maximum operating temperature range for S29GL256S11DHVV20?

This part is rated for Industrial Plus grade (–40°C to +105°C), verified per Infineon's datasheet revision *U. It meets AEC-Q100 Grade 2 requirements for automotive under-hood use, with thermal derating applied above 85°C ambient per JEDEC JESD22-A108.

Does S29GL256S11DHVV20 support common flash interface (CFI)?

Yes-it implements a full CFI parameter table accessible via standard command sequences (0x98 at address 0x55). The table reports geometry, voltage, timing, and command set details, enabling automatic detection and configuration by host bootloaders and flash programmers.

Can S29GL256S11DHVV20 be used with a 1.8 V I/O interface?

Yes-its Versatile I/O feature supports VIO from 1.65 V to 3.6 V. When VIO = 1.8 V, all input thresholds and output drive levels comply with 1.8 V logic standards, and timing parameters (e.g., tOE = 35 ns) remain valid per datasheet Table 2-2.

How is the 1024-byte OTP array organized and protected?

The OTP array consists of two independently lockable 512-byte regions. Each region can be permanently locked via dedicated command sequence (0x60 → 0xD0), after which further programming or erasure is blocked. Lock status is readable via status register bit SR[6], and once locked, cannot be reversed.

S29GL256S11DHVV20 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S11DHVV20 FAQ

1.How can I place an order for S29GL256S11DHVV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S11DHVV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S11DHVV20 reliable?

The price and inventory of S29GL256S11DHVV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHVV20 is usually 5 days.

3.What payment methods are accepted for S29GL256S11DHVV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHVV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S11DHVV20?

S29GL256S11DHVV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S11DHVV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S11DHVV20?

For technical support, including S29GL256S11DHVV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHVV20 requirements.

6.How does Aetrix verify that S29GL256S11DHVV20 is sourced from the original manufacturer or authorized distributors?

All S29GL256S11DHVV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHVV20 meets industry standards.

7.What is the process for return or replacement of S29GL256S11DHVV20?

All S29GL256S11DHVV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHVV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S11DHVV20 part is unused and in its original packaging.

Return procedure for S29GL256S11DHVV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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