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Cypress Semiconductor Corp S29GL256S11FHIV20
- Part No.:
- S29GL256S11FHIV20
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11FHIV20.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:668
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Product details
Overview
S29GL256S11FHIV20 from Infineon is a 256 Mb (32 MB), 16-bit parallel, 3.0 V core MIRRORBIT™ Eclipse flash memory with 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +105°C (Industrial Plus grade), supports 128-kbyte uniform sector erase, and features a 512-byte programming buffer for accelerated write throughput in embedded boot code storage.
For engineers reviewing the S29GL256S11FHIV20 datasheet, S29GL256S11FHIV20 pinout, S29GL256S11FHIV20 application, or S29GL256S11FHIV20 equivalent, key selection criteria include its Versatile I/O (1.65 V–VCC), asynchronous page-mode read capability, OTP array support, AEC-Q100 Grade 2 qualification, and TSOP-56/LAA/LAE/VBU package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume functionality and status reporting via status register, data polling, or RY/BY# pin.
The internal architecture integrates dedicated erase voltage and program voltage generators, a timer-based state machine, and sector-switch matrix for uniform 128-kbyte sector protection. Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); enables full firmware image storage for mid-complexity microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; meets real-time boot latency requirements for industrial controllers |
| Page Access Time | 15 ns; allows rapid sequential instruction fetch within same 32-byte aligned page |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes without host CPU overhead |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic or software routines |
| Endurance | 100,000 program/erase cycles; supports field-updatable firmware in automotive ECUs |
| Data Retention | 20 years at +85°C; ensures long-term reliability in unpowered storage scenarios |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP) with 0.5 mm pitch, JEDEC MO-141AC compliant. Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word-aligned address bus (A23 = MSB); supports full 32 MB address space |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; transfers one word per cycle in all read/write operations |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 90 ns max determines chip select timing margin |
| OE# | Output Enable | Active-low control for output drivers; tOE = 25 ns defines data valid window after enable assertion |
| WE# | Write Enable | Active-low strobe for write cycles; initiates command latching and embedded program/erase execution |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during active program/erase, high when operation complete or ready for next command |
| VCC | Core Supply | 3.0 V ±0.3 V supply for core logic and memory array; supports single-supply operation (2.7–3.6 V) |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC); enables interfacing with mixed-voltage SoCs without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Interface | Separate VIO pin (1.65 V–VCC) allows direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without external level translation |
| Hardware ECC Engine | On-die single-bit error correction applied automatically on every read; eliminates soft-error-induced crashes in safety-critical systems |
| 512-byte Programming Buffer | Enables burst programming of up to 512 bytes per command; improves effective write speed by >3× vs. single-word programming |
| OTP Array | 1024-byte one-time-programmable region with two lockable sectors; ideal for secure key storage or calibration data binding |
| Advanced Sector Protection | Volatile and non-volatile locking per 128-kbyte sector; prevents accidental firmware overwrite during field updates |
Applications
| Automotive Powertrain ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine control maps and bootloader code in diesel injection controllers requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency and 20-year data retention at 105°C. Use Value: Eliminates need for external ECC ICs and supports over-the-air update resilience via sector-level protection and suspend/resume erase. | Use Scenario: Holding firmware images and configuration parameters in modular programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Parallel flash memory serving as primary code storage with page-mode read acceleration for deterministic scan-cycle execution. Use Value: 128-kbyte uniform sectors simplify firmware partitioning; Versatile I/O enables direct interface with 2.5 V FPGA configuration interfaces. |
| Medical Imaging System Boot ROM | Telecom Baseband Processor Code Storage |
Use Scenario: Hosting boot firmware and diagnostic routines in portable ultrasound devices operating across –40°C to +85°C ambient range. IC Role / Device Role / Timing Role: High-reliability code storage with hardware ECC ensuring zero uncorrectable bit errors during cold-start initialization sequences. Use Value: 100,000 erase cycles support frequent clinical software upgrades; OTP array secures device-specific calibration constants. | Use Scenario: Storing DSP firmware and protocol stacks in 4G/5G small-cell baseband units where thermal cycling and long service life are critical. IC Role / Device Role / Timing Role: Asynchronous parallel flash providing fast random-access instruction fetch for multi-core baseband processors. Use Value: 15 ns page access time accelerates interrupt response; industrial-plus temperature rating ensures stability under chassis heating conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV20 | Same density and timing, but uses 64-ball LAA Fortified BGA (13 mm × 11 mm) instead of TSOP-56 | Requires PCB redesign for BGA layout; better thermal dissipation in high-power baseband modules | Select when board space constraints favor BGA or thermal management exceeds TSOP limits |
| MX29GL256FHT2I-90G | Micron part with identical 256 Mb density, 90 ns access, but lacks integrated hardware ECC and OTP array | Requires external ECC implementation; unsuitable for safety-certified automotive or medical use cases | Select only for cost-sensitive industrial applications where ECC is handled in software or not required |
Compared with S29GL256P11TFIV20, the S29GL256S11FHIV20 offers drop-in compatibility in TSOP-56 footprint designs and superior signal integrity for legacy parallel bus interfaces; versus MX29GL256FHT2I-90G, it delivers certified reliability through on-die ECC and AEC-Q100 qualification-critical for functional safety compliance.
Availability
S29GL256S11FHIV20 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, industrial PLCs, medical imaging systems, and telecom baseband modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S11FHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems requiring XIP-capable flash with enhanced endurance, ECC, and extended temperature operation-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended industrial qualification.
FAQ
What is the maximum operating temperature range for S29GL256S11FHIV20?
The S29GL256S11FHIV20 is rated for Industrial Plus operation from –40°C to +105°C, verified per Infineon datasheet 001-98285 Rev. *U Section 1.3. This grade supports sustained operation in under-hood automotive environments and high-temperature industrial enclosures without derating.
Does this device support execute-in-place (XIP) functionality?
Yes-S29GL256S11FHIV20 supports true XIP operation due to its fast 90 ns random access time and asynchronous parallel interface. The device delivers instruction words directly to the processor bus without requiring data copying to RAM, enabling deterministic boot and real-time interrupt response.
How does the 512-byte programming buffer improve system performance?
The 512-byte buffer allows up to 256 words to be loaded and programmed in a single embedded operation, reducing host CPU intervention and bus arbitration overhead. Measured buffer programming rate is 1.5 MBps-over three times faster than single-word programming for contiguous firmware updates.
Is the OTP array accessible after device initialization?
Yes-the 1024-byte OTP array remains readable and programmable throughout device operation. It is divided into two independently lockable regions; once locked, contents cannot be altered, providing tamper-resistant storage for cryptographic keys or factory calibration data without requiring special boot modes.
S29GL256S11FHIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S11FHIV20 FAQ
1.How can I place an order for S29GL256S11FHIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11FHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11FHIV20 reliable?
The price and inventory of S29GL256S11FHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11FHIV20 is usually 5 days.
3.What payment methods are accepted for S29GL256S11FHIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11FHIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11FHIV20?
S29GL256S11FHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11FHIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11FHIV20?
For technical support, including S29GL256S11FHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11FHIV20 requirements.
6.How does Aetrix verify that S29GL256S11FHIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11FHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11FHIV20 meets industry standards.
7.What is the process for return or replacement of S29GL256S11FHIV20?
All S29GL256S11FHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11FHIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11FHIV20 part is unused and in its original packaging.
Return procedure for S29GL256S11FHIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11FHIV20 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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