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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp S29GL512S11DHV020

Name: S29GL512S11DHV020
Brand: Cypress Semiconductor Corp
SKU: S29GL512S11DHV020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S11DHV020

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S11DHV020.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S11DHV020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V single-supply operation (2.7–3.6 V), 15 ns page access time, and integrated hardware ECC for single-bit error correction. It serves as non-volatile program/data storage in boot code execution and firmware update subsystems of industrial controllers and automotive ECUs.

For engineers reviewing the S29GL512S11DHV020 datasheet, S29GL512S11DHV020 pinout, S29GL512S11DHV020 application, or S29GL512S11DHV020 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer, Versatile I/O support (1.65–VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with ×16 data bus and word-aligned addressing, supporting both random read (90–110 ns) and page-mode read (15–25 ns). Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.

The flash array is organized into uniform 128-kbyte sectors, each individually erasable. Sector protection includes volatile (via status register) and non-volatile (via ASP bits) methods, plus a dedicated 1024-byte OTP array with two lockable regions for secure configuration or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware images for mid-tier microcontrollers without external memory expansion.
Interface	Asynchronous parallel ×16; enables direct XIP execution from flash without SRAM shadowing in resource-constrained systems.
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages, reducing effective latency in burst instruction fetches.
Write Buffer Size	512 bytes; permits single-command programming of up to 256 words, cutting total firmware update time vs. byte-by-byte writes.
ECC Support	On-die hardware single-bit error correction; eliminates need for external ECC logic or software overhead in safety-critical applications.
Endurance & Retention	100,000 program/erase cycles and 20-year data retention; meets long-life requirements for industrial field equipment and automotive modules.
Operating Temp	–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive use and high-ambient industrial environments.

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus (AMAX = A24); supports full 512 Mb address space with word boundary alignment only.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO (1.65–VCC), enabling mixed-voltage system interfacing.
CE#	Chip enable	Active-low device select; tCE ≤ 100 ns ensures fast chip activation during multi-device memory mapping.
OE#	Output enable	Active-low read strobe; tOE ≤ 35 ns guarantees timely data valid window in high-speed read cycles.
WE#	Write enable	Active-low write control; initiates command sequences and buffer programming operations.
RY/BY#	Ready/Busy output	Open-drain status indicator; signals ongoing embedded operations (program/erase) without polling overhead.
WP#	Write protect	Hardware sector lock control; prevents accidental program/erase when asserted low.
VCC	Core supply	3.0 V ±10% supply for all functions (read/program/erase); eliminates need for separate I/O rail.
VIO	I/O supply	Independent 1.65–VCC input; decouples interface voltage from core, simplifying mixed-signal SoC integration.

Key Features

Feature	Design Value
Uniform 128-kbyte sectors	Enables precise firmware partitioning (e.g., bootloader, app, config) with independent erase control and protection.
Suspend/resume commands	Allows real-time interruption of long-duration erase (≈1 s) or program (≈1 ms) operations for urgent read access.
Common Flash Interface (CFI)	Provides standardized JEDEC-compliant parameter table for automatic driver detection and configuration in OS/bootloader stacks.
Advanced Sector Protection (ASP)	Supports both volatile (power-cycle reset) and non-volatile (permanent) lock bits per sector for flexible security policies.
Secure Silicon Region (OTP)	1024-byte one-time-programmable area with dual lockable regions for storing cryptographic keys or calibration constants.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and OTA update payloads in AEC-Q100 Grade 2 qualified ECU hardware.

IC Role / Device Role / Timing Role: Non-volatile boot ROM and runtime firmware store; executes XIP code directly via parallel bus with <110 ns random access.

Use Value: Meets automotive thermal and reliability requirements (–40°C to +105°C, 100k cycles) while enabling fast firmware recovery after power loss.

Use Scenario: Holding ladder logic programs, I/O configuration tables, and safety-critical firmware updates in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Primary firmware repository with hardware ECC and sector-level write protection to prevent corruption during brown-out events.

Use Value: Eliminates need for external error-checking logic and supports field updates without full system shutdown via suspend/resume.

Medical Imaging System Boot Memory

Avionics Data Logger

Use Scenario: Hosting boot loader and FPGA configuration bitstreams in portable ultrasound or MRI subsystems requiring certified data integrity.

IC Role / Device Role / Timing Role: Secure initialization memory with OTP region for device-specific calibration signatures and locked bootloader code.

Use Value: Hardware ECC and OTP locking satisfy IEC 62304 Class C software safety requirements for medical devices.

Use Scenario: Recording flight parameters and fault logs in DO-160 qualified avionics black boxes where long-term data retention is mission-critical.

IC Role / Device Role / Timing Role: High-reliability non-volatile archive memory with 20-year retention and 128-kbyte sector granularity for timestamped log segmentation.

Use Value: Uniform sector size simplifies wear leveling in cyclic logging; AEC-Q100 Grade 2 temp range covers extended aircraft operational envelopes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFV020	Same density and architecture but in 64-ball LAE FBGA (9 mm × 9 mm); lacks VBU package's smaller footprint.	Preferred for designs with higher PCB routing density tolerance and less strict board area constraints.	Select when BGA pad layout flexibility outweighs minimal size advantage of VBU package.
MX29GL512FHI-11G	Micron equivalent with identical 512 Mb density, 15 ns page access, and AEC-Q100 Grade 2 rating; differs in CFI implementation and OTP structure.	Used in cross-manufacturer supply chain diversification strategies where functional equivalence is verified per application test.	Choose for second-source assurance where Infineon-specific features (e.g., ASP behavior) are not design-critical.

Compared with S29GL512S11DHV020, the TFV020 variant trades compact packaging for slightly relaxed routing constraints, while the Micron MX29GL512FHI-11G offers validated functional parity but requires revalidation of OTP lock sequencing and sector protection timing.

Availability

S29GL512S11DHV020 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot memory applications requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S11DHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.

The GL-S family targets embedded systems needing robust, high-density parallel NOR flash with automotive-grade qualification, fast XIP performance, and hardware-based data integrity - bridging the gap between legacy boot ROMs and modern data storage flash.

FAQ

What is the maximum operating frequency supported by S29GL512S11DHV020?

The device does not operate on a clock signal; it uses asynchronous timing. Its performance is defined by access times: random access up to 110 ns and page access as fast as 15 ns. These values are guaranteed across the full temperature and voltage range (–40°C to +105°C, 2.7–3.6 V), enabling reliable interface timing with microcontrollers running at up to 40 MHz bus speeds.

Does S29GL512S11DHV020 support burst read or sequential addressing?

No - it supports only asynchronous random and page-mode reads. Page-mode allows up to 32 consecutive 16-bit words (64 bytes) to be read with 15 ns cycle time after initial 110 ns access, but no internal address incrementing or burst command. Sequential access must be managed externally by the host processor incrementing A0–A23.

How is hardware ECC implemented and what errors does it correct?

ECC is fully hardware-based and transparent: single-bit errors in any 512-byte sector are automatically detected and corrected during read operations. No software intervention or additional latency is required. The ECC engine operates inline and does not support multi-bit error correction or reporting - only silent correction of isolated bit flips due to charge leakage or radiation effects.

Can the OTP region be reprogrammed after initial programming?

No - the 1024-byte OTP array is permanently programmable once. Each of its two lockable regions can be independently secured via fuse blowing; after locking, no further writes are possible to that region. This ensures immutable storage of cryptographic keys or calibration data, meeting requirements for secure boot and regulatory compliance in medical and automotive systems.

S29GL512S11DHV020 Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512S11DHV020 FAQ

1.How can I place an order for S29GL512S11DHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S11DHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S11DHV020 reliable?

The price and inventory of S29GL512S11DHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S11DHV020 is usually 5 days.

3.What payment methods are accepted for S29GL512S11DHV020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S11DHV020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S11DHV020?

S29GL512S11DHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S11DHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S11DHV020?

For technical support, including S29GL512S11DHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S11DHV020 requirements.

6.How does Aetrix verify that S29GL512S11DHV020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S11DHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S11DHV020 meets industry standards.

7.What is the process for return or replacement of S29GL512S11DHV020?

All S29GL512S11DHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S11DHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S11DHV020 part is unused and in its original packaging.

Return procedure for S29GL512S11DHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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