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Cypress Semiconductor Corp S29GL512T10DHI013
- Part No.:
- S29GL512T10DHI013
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10DHI013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,200
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Product details
Overview
S29GL512T10DHI013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10DHI013 datasheet, S29GL512T10DHI013 pinout, S29GL512T10DHI013 application, or S29GL512T10DHI013 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages all program and erase operations, including automatic ECC correction and status monitoring via Status Register, Data Polling, or RY/BY# pin.
The architecture includes dedicated address space overlays for Device ID/CFI, Status Register, SSR (OTP), and ECC status, enabling standardized firmware interaction and secure one-time programmable region management. Sector protection uses volatile and non-volatile methods per 128-KB sector, with hardware reset and power-off data protection protocols defined.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - supports full boot image storage for mid-range microcontrollers |
| Interface type | Asynchronous parallel ×16 - enables direct CPU bus connection without glue logic |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements |
| Page access time | 15 ns - accelerates sequential instruction fetch in XIP mode |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words |
| ECC capability | Internal single-bit error correction - ensures data integrity without host-side ECC overhead |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware storage |
| Data retention | 20 years - guarantees long-term reliability in unpowered industrial deployments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard for legacy parallel flash integration in space-constrained industrial PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×16 mode with optional byte enable for ×8 |
| CE# | Chip enable | Active-low chip select; controls device participation in bus transactions |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase command latching |
| RY/BY# | Ready/Busy | Open-drain status indicator; low during embedded operations, high when ready |
| VCC | Core supply | 2.7 V to 3.6 V single supply for read/program/erase - eliminates auxiliary voltage rails |
| VIO | I/O supply | 1.65 V to VCC versatile I/O - allows interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables mixed-voltage system integration without level shifters |
| 512-byte programming buffer | Enables 256-word buffered writes - cuts typical firmware update time vs. single-word programming |
| Uniform 128-KB sectors | 64 identical sectors simplify partitioning for bootloader, app, and parameter storage |
| Four lockable OTP regions (SSR0–SSR3) | SSR0 factory-locked, SSR3 password-protected - secures calibration data and security keys |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant parameter table - enables OS/driver auto-detection and portability |
Applications
| Industrial PLC Boot Memory | Automotive Instrument Cluster Storage |
|---|---|
Use Scenario: Stores boot firmware and configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability; provides deterministic 100 ns read access for real-time startup. Use Value: Eliminates external SRAM copy step; reduces BOM count and power-on delay while maintaining AEC-Q100 grade 3 compliance. | Use Scenario: Holds display firmware, gauge calibration data, and driver behavior profiles in automotive digital instrument clusters. IC Role / Device Role / Timing Role: Secure, high-endurance flash storage with OTP-protected SSR3 for safety-critical calibration values. Use Value: Supports over-the-air updates via CAN FD gateway with verified 100,000-cycle endurance and 20-year data retention at 105°C. |
| Medical Imaging System Firmware | Telecom Base Station Configuration |
Use Scenario: Stores FPGA configuration bitstreams and diagnostic firmware in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability parallel flash with internal ECC - ensures bit-level integrity of critical imaging algorithms. Use Value: Meets IEC 62304 Class C software requirements through hardware-assisted error correction and 125°C extended temperature operation. | Use Scenario: Retains baseband processor configuration, RF calibration tables, and fail-safe recovery images in 5G macro base stations. IC Role / Device Role / Timing Role: Dual-voltage I/O flash interfacing with 1.8 V FPGAs and 3.3 V management MCUs in multi-rail telecom power domains. Use Value: Versatile I/O eliminates discrete level translators; CFI support simplifies field upgrade toolchain integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and core voltage, but 45 nm process variant with slower 110 ns tACC at +85°C; no OTP SSR array | Lacks OTP lockable regions - unsuitable for secure calibration storage | Select only if OTP functionality is not required and cost sensitivity outweighs security needs |
| MX29GL512FHT2I-90G | Macronix part; 90 ns tACC, same 512 Mb density, but no internal ECC or CFI support | Requires host-side ECC implementation; lacks standardized CFI auto-detection | Choose only when firmware stack already implements external ECC and CFI abstraction layer |
Compared with S29GL512S10TFI010 and MX29GL512FHT2I-90G, the S29GL512T10DHI013 uniquely combines OTP-based security, hardware ECC, and full CFI compliance-making it optimal for safety-aware, field-upgradable embedded systems where data integrity and firmware authenticity are design-critical.
Availability
S29GL512T10DHI013 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, and medical imaging systems requiring stable component supply across extended lifecycle programs.
Supply support for S29GL512T10DHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity features - designed specifically for industrial control, automotive, and medical applications demanding long-term availability and AEC-Q100 compliance.
FAQ
What is the operating voltage range for VIO and VCC?
VCC operates from 2.7 V to 3.6 V for core read/program/erase functions. VIO supports a versatile range of 1.65 V to VCC, enabling direct interface with 1.8 V or 3.3 V host processors without external level shifters. This dual-voltage flexibility is confirmed in the Absolute Maximum Ratings and DC Characteristics sections of the official Infineon datasheet 002-00247 Rev. *M.
Does this device support execute-in-place (XIP) operation?
Yes, the S29GL512T10DHI013 supports XIP operation due to its fast 100 ns random access time and asynchronous parallel interface. The GL-T family is explicitly described as combining "the fast random access of XIP flash along with the high density and fast program speed of data storage flash," enabling direct CPU instruction fetch from flash memory without copying to RAM.
How is the OTP array structured and protected?
The device includes a separate 2048-byte OTP array divided into four lockable regions (SSR0–SSR3). SSR0 is factory-locked and permanently read-only; SSR3 supports password-based read protection. Protection is implemented via non-volatile bits in the Status Register and enforced by the embedded algorithm controller during read attempts, as detailed in Section 2.5 and 3.3 of the datasheet.
What package type does S29GL512T10DHI013 use?
S29GL512T10DHI013 uses a 56-pin TSOP package (Type I, standard pitch), as specified in Section 12.1 of the datasheet. This package is RoHS-compliant, lead-free, and optimized for surface-mount assembly in industrial and automotive PCBs where thermal performance and board-level reliability are critical.
S29GL512T10DHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T10DHI013 FAQ
1.How can I place an order for S29GL512T10DHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10DHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10DHI013 reliable?
The price and inventory of S29GL512T10DHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10DHI013 is usually 5 days.
3.What payment methods are accepted for S29GL512T10DHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10DHI013 transactions.
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4.How is shipping managed for S29GL512T10DHI013?
S29GL512T10DHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10DHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10DHI013?
For technical support, including S29GL512T10DHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10DHI013 requirements.
6.How does Aetrix verify that S29GL512T10DHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10DHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10DHI013 meets industry standards.
7.What is the process for return or replacement of S29GL512T10DHI013?
All S29GL512T10DHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10DHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10DHI013 part is unused and in its original packaging.
Return procedure for S29GL512T10DHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10DHI013 Tags
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M24C02-WMN6TP
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