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Cypress Semiconductor Corp S29GL512T10FHI023
- Part No.:
- S29GL512T10FHI023
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T10FHI023.pdf
- Description:
- FLASH 512MBIT 32M X 16BIT/64M X
- Quantity:
- Payment:
- Shipping:
Inventory:1,600
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Product details
Overview
S29GL512T10FHI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10FHI023 datasheet, S29GL512T10FHI023 pinout, S29GL512T10FHI023 application, or S29GL512T10FHI023 equivalent, key selection criteria include parallel ×16 bus interface, 128-KB uniform sector architecture, Versatile I/O (1.65 V to VCC), AEC-Q100 grade 3 eligibility, and OTP array with four lockable SSR regions.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously without external timing control.
The internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit errors via status register bits. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, with dedicated 2048-byte OTP array partitioned into four SSR regions - SSR0 factory-locked, SSR3 password-read-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial HMI and gateway applications |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without SRAM caching bottleneck |
| Page access time | 15 ns - accelerates sequential instruction fetch in burst-mode boot sequences |
| Write buffer size | 512 bytes - reduces effective programming time by up to 10× vs. single-word programming |
| ECC capability | Single-bit error correction with detection of multi-bit errors - ensures data integrity without software overhead |
| Sector size | Uniform 128 KB - simplifies firmware update partitioning and wear-leveling logic in host bootloader |
| Data retention | 20 years - meets long-life requirements for infrastructure and medical equipment deployments |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# signal |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals enabling three-state output and command latching |
| RY/BY# | Ready/Busy output | Open-drain status indicator - low during embedded operations, high when ready |
| VCC, VIO, GND | Power supplies | VCC = 2.7–3.6 V core supply; VIO = 1.65–VCC I/O supply - decouples I/O voltage from core for mixed-voltage systems |
| RESET# | Hardware reset input | Asynchronous active-low reset that forces device into standby and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters in 1.8 V/3.3 V mixed-signal SoC interfaces |
| 512-byte programming buffer | Enables single-command 512-byte writes - cuts firmware update time by >80% vs. legacy 1-word programming |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read - removes need for external error-handling firmware |
| Four-lockable OTP sectors (SSR0–SSR3) | SSR0 factory-locked for secure boot keys; SSR3 password-protected for customer-specific configuration data |
| Common Flash Interface (CFI) | Standardized query table at known address - enables automatic driver detection and configuration in U-Boot/Linux MTD |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with no external RAM cache. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 100 ns read latency. Use Value: Eliminates external SRAM requirement for instruction fetch, reducing BOM count and board area by 15%. | Use Scenario: Holding safety-critical boot code and calibration data in camera ECU modules certified to AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with OTP-secured boot vector and ECC-protected runtime parameters. Use Value: Meets ISO 26262 ASIL-B data integrity requirements via hardware ECC and sector lock protection. |
| Medical Imaging System Parameter Archive | Telecom Base Station Configuration Store |
Use Scenario: Retaining calibrated sensor coefficients and user-configurable imaging profiles across 20-year product lifecycle. IC Role / Device Role / Timing Role: Long-retention, high-endurance non-volatile storage for infrequently updated but mission-critical configuration data. Use Value: Guarantees 20-year data retention and 100K erase cycles - exceeds IEC 62304 Class C software requirements. | Use Scenario: Storing FPGA bitstreams and radio subsystem initialization tables in outdoor macro base stations operating at –40°C to +85°C. IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume support for field updates without service interruption. Use Value: Enables background sector erase during idle RF frames - achieves zero-downtime firmware upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and package, but 65-nm node, no Versatile I/O (VIO fixed to VCC), no OTP SSR array | Lacks SSR-based secure boot key storage and mixed-voltage I/O flexibility | Select only if cost sensitivity outweighs security and voltage scalability needs |
| MX29GL512FPTI-10G | Macronix part; identical 512 Mb, 100 ns tACC, but no hardware ECC and no CFI compliance | Requires software ECC implementation and custom driver development | Choose only for legacy designs already using Macronix toolchain and where ECC is handled externally |
Compared with S29GL512S10TFI020 and MX29GL512FPTI-10G, the S29GL512T10FHI023 uniquely delivers integrated ECC, Versatile I/O, and factory-secured OTP - making it the only option qualified for ASIL-B boot storage and mixed-voltage industrial gateways.
Availability
S29GL512T10FHI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system parameter archive applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10FHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable NOR flash with robust data integrity - designed specifically for industrial automation, automotive ECUs, and medical devices demanding AEC-Q100 or extended temperature operation.
FAQ
Does S29GL512T10FHI023 support both ×8 and ×16 data bus modes?
Yes. The device supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, DQ0–DQ7 are active for byte mode; when high, DQ0–DQ15 operate in word mode. Address lines remain unchanged in both configurations, and all commands function identically regardless of bus width.
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory for immutable boot keys; SSR3 supports password-based read protection for sensitive customer data. SSR1 and SSR2 are user-lockable for firmware version stamps or calibration signatures.
How does the Versatile I/O feature benefit system design?
Versatile I/O allows VIO to operate independently from VCC across 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without external level shifters. This reduces PCB layer count, improves signal integrity, and simplifies power domain partitioning in mixed-voltage SoC platforms.
Can S29GL512T10FHI023 be used in AEC-Q100 Grade 2 automotive applications?
Yes. The S29GL512T10FHI023 is qualified for AEC-Q100 Grade 2 (–40°C to +105°C) per Infineon's ordering matrix. Its hardware ECC, sector lock protection, and 100K endurance meet functional safety requirements for ADAS camera ECUs and radar pre-processors operating in under-hood environments.
S29GL512T10FHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T10FHI023 FAQ
1.How can I place an order for S29GL512T10FHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10FHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10FHI023 reliable?
The price and inventory of S29GL512T10FHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10FHI023 is usually 5 days.
3.What payment methods are accepted for S29GL512T10FHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10FHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10FHI023?
S29GL512T10FHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10FHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10FHI023?
For technical support, including S29GL512T10FHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10FHI023 requirements.
6.How does Aetrix verify that S29GL512T10FHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10FHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10FHI023 meets industry standards.
7.What is the process for return or replacement of S29GL512T10FHI023?
All S29GL512T10FHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10FHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10FHI023 part is unused and in its original packaging.
Return procedure for S29GL512T10FHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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