Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T10TFA020

Name: S29GL512T10TFA020
Brand: Infineon Technologies
SKU: S29GL512T10TFA020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512T10TFA020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512T10TFA020.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,413

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512T10TFA020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.

For engineers reviewing the S29GL512T10TFA020 datasheet, S29GL512T10TFA020 pinout, S29GL512T10TFA020 application, or S29GL512T10TFA020 equivalent, key selection criteria include parallel ×16 bus interface, 128-KB uniform sector architecture, OTP array with four lockable SSR regions, CFI compliance, and AEC-Q100 grade 3 qualification for automotive control modules.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host intervention.

The memory array is organized into uniform 128-KB sectors, each independently erasable, and includes a dedicated 2048-byte one-time programmable (OTP) array partitioned into four lockable sectors (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial HMI and gateway devices
Interface type	Asynchronous parallel ×16 - enables direct CPU address/data bus connection without translation logic
Random access time	100 ns at –40°C to +85°C - meets real-time boot latency requirements for ARM Cortex-M7/M4 microcontrollers
Page access time	15 ns - accelerates sequential instruction fetch during XIP operation
Write buffer size	512 bytes - reduces effective programming time by batching up to 256 words per command
ECC capability	Internal hardware single-bit error correction - ensures data integrity without software overhead or external ECC controller
Endurance	100,000 program/erase cycles - supports field-updatable firmware in telecom baseband modules
Data retention	20 years - guarantees long-term reliability in unattended infrastructure equipment

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address inputs	22-bit address bus supporting full 512 Mb linear addressing (byte/word aligned)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte (DQ0–DQ7) or word (DQ0–DQ15) mode via BYTE# signal
CE#	Chip enable	Active-low chip select; controls device power state and enables read/write/erase operations
OE#	Output enable	Active-low control for data bus output drivers; used during read cycles only
WE#	Write enable	Active-low strobe for write operations; latches address and data on rising edge
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operations (program/erase); asserts low during execution
RESET#	Hardware reset	Active-low asynchronous reset that halts ongoing operations and returns device to read mode
VIO	I/O supply voltage	Independent 1.65 V to VCC input enabling mixed-voltage system interfacing (e.g., 1.8 V I/O with 3.3 V core)

Key Features

Feature	Design Value
Versatile I/O voltage range	VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 2.5 V SoCs
Uniform 128-KB sector architecture	All sectors identical in size and erase characteristics - simplifies firmware partitioning and OTA update design
Dedicated OTP array with SSR locking	2048-byte OTP space with four independently lockable sectors - secures bootloader keys, calibration data, and device identity
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables auto-detection and driver portability across flash vendors
Suspend/Resume for program & erase	Allows interrupting long-duration operations to service higher-priority reads - critical for real-time OS environments

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot firmware and configuration data in programmable logic controllers deployed in factory automation systems.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic <100 ns latency.

Use Value: Uniform 128-KB sectors simplify firmware update partitioning; 20-year data retention ensures reliability over 15+ year equipment lifecycle.

Use Scenario: Holding safety-critical boot code and sensor calibration parameters in radar ECU modules compliant with ISO 26262 ASIL-B.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as secure, fast-access boot source for dual-core Cortex-R5F processors.

Use Value: Internal ECC and SSR-protected OTP prevent unauthorized modification of boot vectors; 100,000-cycle endurance supports field calibration updates.

Telecom Base Station Control Plane

Medical Imaging System Configuration

Use Scenario: Hosting FPGA configuration bitstreams and control plane software in 5G remote radio units operating in extended temperature environments.

IC Role / Device Role / Timing Role: High-reliability parallel flash with extended temperature grade (–40°C to +125°C) enabling operation in sealed outdoor enclosures.

Use Value: 120 ns max tACC at +125°C maintains timing margin for ARM-based control processors; CFI support simplifies multi-vendor BOM management.

Use Scenario: Storing DICOM metadata templates, calibration profiles, and regulatory compliance logs in portable ultrasound devices.

IC Role / Device Role / Timing Role: Secure, low-power non-volatile memory with OTP-locked SSR3 protecting FDA-mandated audit trails.

Use Value: 100 μA standby current extends battery life; password-protected SSR3 prevents tampering with traceable device history records.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI010	Same density and architecture but rated for industrial plus (–40°C to +105°C); no AEC-Q100 qualification	Lacks automotive qualification; suitable for high-temp industrial gateways but not safety-critical ECUs	Select when extended temperature operation is required without automotive certification overhead
MX29GL512FPTI-90G	Macronix part with 90 ns tACC, no integrated ECC, and different CFI implementation	Requires external ECC handling; CFI parameter offsets differ, necessitating driver adaptation	Choose for cost-sensitive designs where ECC is implemented in software or external logic

Compared with S29GL512S10TFI010 and MX29GL512FPTI-90G, the S29GL512T10TFA020 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, and SSR-based OTP security-making it the only option qualified for ASIL-B boot memory in production automotive systems.

Availability

S29GL512T10TFA020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, telecom base station control planes, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S29GL512T10TFA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.

The GL-T family targets high-reliability embedded systems requiring deterministic boot performance, long-term data retention, and robust security features-including automotive ECUs, industrial HMIs, and telecom infrastructure.

FAQ

What is the purpose of the SSR0–SSR3 regions in the OTP array?

SSR0–SSR3 are four independently lockable 512-byte sectors within the 2048-byte OTP array. SSR0 is factory-locked and reserved for Infineon use; SSR3 supports password-based read protection. These regions store immutable data such as cryptographic keys, device serial numbers, and calibration constants, preventing runtime overwrite or unauthorized access.

Does S29GL512T10TFA020 support both ×8 and ×16 data bus modes?

Yes. The device operates in ×16 mode by default, with DQ0–DQ15 active. When BYTE# is asserted low, it switches to ×8 mode using only DQ0–DQ7. This dual-mode capability allows flexible integration with 8-bit or 16-bit microcontrollers without hardware redesign.

How does the embedded algorithm controller (EAC) improve system-level reliability?

The EAC executes all program and erase operations autonomously, including automatic ECC generation and verification, status monitoring, and suspend/resume handling. This offloads timing-critical tasks from the host processor, eliminates software timing errors, and ensures consistent operation across voltage and temperature variations.

Can S29GL512T10TFA020 be used in place of older S29GL512P devices?

No. Although pin-compatible in TSOP packages, the S29GL512T uses updated command sets, enhanced CFI tables, and different timing parameters (e.g., faster tPACC = 15 ns vs. 25 ns). Migration requires firmware validation and may need timing adjustments in the host driver layer.

S29GL512T10TFA020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512T10TFA020 FAQ

1.How can I place an order for S29GL512T10TFA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T10TFA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T10TFA020 reliable?

The price and inventory of S29GL512T10TFA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFA020 is usually 5 days.

3.What payment methods are accepted for S29GL512T10TFA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T10TFA020?

S29GL512T10TFA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T10TFA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T10TFA020?

For technical support, including S29GL512T10TFA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFA020 requirements.

6.How does Aetrix verify that S29GL512T10TFA020 is sourced from the original manufacturer or authorized distributors?

All S29GL512T10TFA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFA020 meets industry standards.

7.What is the process for return or replacement of S29GL512T10TFA020?

All S29GL512T10TFA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T10TFA020 part is unused and in its original packaging.

Return procedure for S29GL512T10TFA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…