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Infineon Technologies S29GL512T10TFA023

Part No.:
S29GL512T10TFA023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL512T10TFA023.pdf
Description:
IC FLASH 512MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,863

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Product details

Overview

S29GL512T10TFA023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.

For engineers reviewing the S29GL512T10TFA023 datasheet, S29GL512T10TFA023 pinout, S29GL512T10TFA023 application, or S29GL512T10TFA023 equivalent, key selection criteria include parallel ×16 bus interface timing compliance, OTP array configuration (SSR0–SSR3), ASP protection granularity, CFI parameter table support, and thermal grade validation for embedded control systems.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus widths. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously without host intervention.

The internal hardware ECC engine performs real-time single-bit error correction during read cycles and reports multi-bit errors via status register bits. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, with four lockable 2048-byte OTP regions-SSR0 factory-locked, SSR3 password-protected.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - sufficient for full firmware images and configuration tables in industrial HMI and PLCs
Random Access Time100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty in real-time control loops
Page Access Time15 ns - accelerates sequential instruction fetch during boot or diagnostic routines
Write Buffer Size512 bytes - reduces average programming time by batching up to 256 words per command
ECC SupportInternal hardware single-bit correction - eliminates need for external error-handling logic in safety-critical boot paths
Operating VoltageVCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with 1.8 V/3.3 V I/O domains in mixed-signal SoC designs
Endurance100,000 program/erase cycles - supports field-upgradable firmware in telecom baseband modules
Data Retention20 years - ensures long-term reliability in unattended infrastructure equipment

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard compliant, lead-free and RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address Inputs22-bit address bus supporting full 512 Mb decoding; A0 selects byte/word mode when x16 configured
DQ0–DQ15Data I/O16-bit bidirectional data bus; operates in x8 or x16 mode per configuration pins
CE#Chip EnableActive-low enable controlling device selection; tCE ≤ 100 ns defines minimum chip select assertion window
OE#Output EnableActive-low control for data output gating; tOE ≤ 25 ns ensures tight read timing margins
WE#Write EnableActive-low signal initiating internal program/erase algorithms; latched on rising edge of WE#
RY/BY#Ready/Busy OutputOpen-drain status indicator: low = operation in progress, high = ready for next command
RESET#Hardware ResetActive-low input forcing device into reset state; required before power-up initialization sequence

Key Features

FeatureDesign Value
Versatile I/O voltage rangeVIO supports 1.65 V to VCC - simplifies integration with mixed-voltage microcontrollers without level shifters
Asynchronous 32-byte page readEnables burst instruction fetch without wait states in legacy 8051/ARM7-based boot loaders
Separate 2048-byte OTP arrayFour lockable sectors (SSR0–SSR3) allow secure storage of keys, calibration data, and MAC addresses
Common Flash Interface (CFI)Standardized parameter table enables automatic driver detection and configuration in U-Boot/Linux MTD stacks
Suspend/Resume for program/eraseAllows interrupting long erase cycles (e.g., 245 KBps sector erase) to service high-priority read requests

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency to meet deterministic scan cycle deadlines.

Use Value: 128-KB uniform sectors enable atomic firmware updates without disrupting control loop execution; ECC prevents silent corruption in electrically noisy environments.

Use Scenario: Holding boot code and sensor calibration data for radar processing units in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel flash serving as primary boot source for TI TDA4VM and NXP S32G processors.

Use Value: OTP array secures cryptographic keys and camera calibration parameters; 105°C rating ensures reliability under hood-mounted ECU conditions.

Telecom Base Station BIOSMedical Imaging System Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in 5G macro base station remote radio units (RRUs).

IC Role / Device Role / Timing Role: High-reliability storage element interfacing directly with ARM Cortex-A53 application processors via 16-bit parallel bus.

Use Value: 100,000 erase cycles support frequent field upgrades; CFI compatibility enables standardized flash driver reuse across vendor platforms.

Use Scenario: Storing DICOM metadata templates and modality-specific calibration profiles in portable ultrasound and MRI console units.

IC Role / Device Role / Timing Role: Secure, long-retention storage for regulatory-critical configuration data requiring tamper-proof OTP locking.

Use Value: SSR3 password protection prevents unauthorized modification of FDA-cleared imaging parameters; 20-year retention meets medical device lifecycle requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL512S10TFI020Same density and architecture but rated for industrial plus (–40°C to +105°C); 110 ns tACC vs. 100 nsTargeted at higher ambient temperature deployments such as outdoor telecom cabinetsSelect when extended thermal margin is required over raw speed
MX29GL512FPTI-90GMacronix part with identical 512 Mb density, 90 ns tACC, no integrated ECC, requires external error handlingUsed where cost sensitivity outweighs ECC requirement and firmware integrity is managed in softwareChoose only if ECC is implemented externally and timing budget allows 90 ns vs. 100 ns

Compared with S29GL512S10TFI020, this part offers tighter read timing at industrial grade; versus MX29GL512FPTI-90G, it delivers built-in ECC and superior data integrity assurance without software overhead.

Availability

S29GL512T10TFA023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station BIOS requiring stable component supply across multi-year production cycles.

Supply support for S29GL512T10TFA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and R&D centers.

The GL-T family targets embedded systems needing high-density, fast-access, and robust non-volatile storage for boot code and critical configuration - optimized for XIP performance and long-term reliability in harsh environments.

FAQ

Does S29GL512T10TFA023 support both x8 and x16 data bus configurations?

Yes, it supports configurable ×8 or ×16 operation via hardware pin strapping (BYTE# input). When BYTE# is low, the device operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode with DQ0–DQ7 used and DQ8–DQ15 ignored. Address line A0 determines byte alignment in ×16 mode.

What is the function of the SSR0–SSR3 regions in the OTP array?

SSR0–SSR3 are four independent 2048-byte one-time-programmable sectors. SSR0 is permanently locked at factory and cannot be modified. SSR1 and SSR2 are user-lockable via command sequence. SSR3 supports password-based read protection, requiring a valid 16-bit password to access contents - used for secure key storage.

How does the Ready/Busy# (RY/BY#) pin behave during embedded operations?

RY/BY# is an open-drain output that goes low during any internal operation (program, erase, or suspend) and returns high upon completion. It can be polled continuously or used to generate interrupts. During suspend, RY/BY# asserts low again when resume begins, ensuring accurate status tracking without command polling overhead.

Is CFI support mandatory for driver compatibility in Linux-based systems?

CFI is not strictly mandatory but strongly recommended: it enables automatic detection of geometry, timing, and command set by MTD subsystem drivers like cfi_cmdset_0002. Without CFI, manual platform-specific flash mapping and timing configuration are required - increasing bring-up time and reducing portability across board revisions.

S29GL512T10TFA023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL512T10TFA023 FAQ

1.How can I place an order for S29GL512T10TFA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T10TFA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T10TFA023 reliable?

The price and inventory of S29GL512T10TFA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFA023 is usually 5 days.

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S29GL512T10TFA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T10TFA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T10TFA023?

For technical support, including S29GL512T10TFA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFA023 requirements.

6.How does Aetrix verify that S29GL512T10TFA023 is sourced from the original manufacturer or authorized distributors?

All S29GL512T10TFA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFA023 meets industry standards.

7.What is the process for return or replacement of S29GL512T10TFA023?

All S29GL512T10TFA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T10TFA023 part is unused and in its original packaging.

Return procedure for S29GL512T10TFA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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