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Cypress Semiconductor Corp S29GL512T11DHV020
- Part No.:
- S29GL512T11DHV020
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11DHV020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:244
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Product details
Overview
S29GL512T11DHV020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C) in a 56-pin TSOP package. Used for firmware storage and XIP code execution in embedded controllers.
For engineers reviewing the S29GL512T11DHV020 datasheet, S29GL512T11DHV020 pinout, S29GL512T11DHV020 application, or S29GL512T11DHV020 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and Versatile I/O support down to 1.65 V.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) handles all program and erase operations autonomously, including suspend/resume capability and status monitoring via Status Register, Data Polling, or RY/BY# pin.
The flash integrates hardware-based ECC for single-bit error correction and detection, and includes a dedicated 2048-byte one-time programmable (OTP) array partitioned into four lockable sectors (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password read protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and boot code in industrial microcontrollers |
| Interface type | Parallel ×16 - enables high-speed XIP execution without serial latency overhead |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot timing requirements for automotive ECUs |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ year product lifecycle |
| Data retention | 20 years - ensures long-term reliability in unpowered storage applications |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 512 Mb address space with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum chip activation delay |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max - controls data valid window during read |
| WE# | Write enable | Active-low write strobe; initiates program/erase command latching sequence |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations, high when ready |
| VCC | Core supply | 2.7 V to 3.6 V single supply - powers core logic and memory array |
| VIO | I/O supply | 1.65 V to VCC - enables interfacing with mixed-voltage SoCs and FPGAs |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - allows direct connection to 1.8 V, 2.5 V, or 3.3 V host interfaces without level shifters |
| Uniform 128-KB sector architecture | 64 erasable sectors - simplifies firmware partitioning and OTA update management |
| Hardware ECC engine | Single-bit correction with no software overhead - critical for ASIL-B functional safety compliance |
| OTP array with SSR locking | 2048-byte OTP split into four lockable regions (SSR0–SSR3) - enables secure key storage and device identity binding |
| CFI-compliant parameter table | Standardized JEDEC JESD68 interface - enables automatic driver detection and configuration in Linux/RTOS BSPs |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable code execution with deterministic 100 ns access latency. Use Value: Enables fast cold-boot (<500 ms) and supports field firmware updates via RS-485 with verified sector protection. | Use Scenario: Holding boot code and GUI assets for digital instrument clusters operating across –40°C to +85°C. IC Role / Device Role / Timing Role: AEC-Q100 grade 3 certified parallel NOR flash serving as primary boot source for ARM Cortex-R5 MCU. Use Value: Meets automotive startup timing budgets and provides OTP-secured calibration data storage with hardware ECC. |
| Medical Imaging System Configuration | Telecom Base Station Control Plane Storage |
Use Scenario: Retaining calibration tables, device profiles, and regulatory compliance logs in FDA-cleared imaging equipment. IC Role / Device Role / Timing Role: High-reliability non-volatile storage with 20-year data retention and 100,000-cycle endurance. Use Value: Eliminates battery-backed SRAM dependency while ensuring audit-trail integrity under power loss events. | Use Scenario: Hosting FPGA bitstreams and control plane firmware in carrier-grade 5G baseband units. IC Role / Device Role / Timing Role: Parallel interface flash enabling rapid reconfiguration of FPGA fabric during maintenance windows. Use Value: 512-byte write buffer cuts bitstream load time by >40% vs. legacy 16-byte page devices, improving service uptime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11DHV020 | Same density and package, but uses older 65-nm process; 110 ns random access, no Versatile I/O (VIO fixed to VCC) | Lacks mixed-voltage interface support; unsuitable for 1.8 V host designs | Select only if cost sensitivity outweighs I/O flexibility and performance needs |
| MX29GL512FHT2I-90G | Micron 512 Mb parallel NOR; 90 ns access, 3.0 V only, no OTP array or hardware ECC | Requires external ECC implementation; no secure key storage capability | Choose when basic firmware storage suffices and BOM cost is primary constraint |
Compared with S29GL512S11DHV020 and MX29GL512FHT2I-90G, the S29GL512T11DHV020 uniquely combines 45-nm density scaling, Versatile I/O, integrated ECC, and OTP security - making it optimal for safety-aware, mixed-voltage, and long-lifecycle embedded systems.
Availability
S29GL512T11DHV020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL512T11DHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
The GL-T family targets high-reliability embedded applications demanding XIP performance, firmware security, and extended temperature operation - especially in industrial automation, automotive, and medical electronics.
FAQ
Is S29GL512T11DHV020 compatible with legacy S29GL512P designs?
No. The S29GL512T uses a different command set, enhanced ECC architecture, and Versatile I/O capability not present in the P-series. Pinout is identical in TSOP, but firmware drivers require modification to support new status register bits and OTP access sequences.
Does this device support synchronous burst reads?
No. S29GL512T11DHV020 is strictly asynchronous - it lacks clock input and does not support burst or interleaved read modes. All read operations are controlled by CE#, OE#, and address setup/hold timing per JEDEC standards.
Can the OTP array be reprogrammed after locking SSR3?
No. Once SSR3 is locked with password protection, its contents become permanently read-only. The password itself is stored in the sector and cannot be recovered or overwritten - this is a hardware-enforced security feature per Infineon's OTP specification.
What is the maximum sustained write bandwidth using the 512-byte buffer?
At –40°C to +85°C, the device achieves 1.14 MBps sustained buffer programming rate. This translates to ~450 μs per 512-byte write operation, independent of host bus speed, as the embedded algorithm executes autonomously after command initiation.
S29GL512T11DHV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T11DHV020 FAQ
1.How can I place an order for S29GL512T11DHV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11DHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11DHV020 reliable?
The price and inventory of S29GL512T11DHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHV020 is usually 5 days.
3.What payment methods are accepted for S29GL512T11DHV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHV020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11DHV020?
S29GL512T11DHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11DHV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11DHV020?
For technical support, including S29GL512T11DHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHV020 requirements.
6.How does Aetrix verify that S29GL512T11DHV020 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11DHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHV020 meets industry standards.
7.What is the process for return or replacement of S29GL512T11DHV020?
All S29GL512T11DHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11DHV020 part is unused and in its original packaging.
Return procedure for S29GL512T11DHV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11DHV020 Tags
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