Infineon Technologies S29GL512T12TFN020
- Part No.:
- S29GL512T12TFN020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T12TFN020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL512T12TFN020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer - enabling fast embedded code storage and XIP execution in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL512T12TFN020 datasheet, S29GL512T12TFN020 pinout, S29GL512T12TFN020 application, or S29GL512T12TFN020 equivalent, key selection criteria include its 100,000 program/erase cycles, 20-year data retention, industrial-plus temperature grade (–40°C to +105°C), TSOP-56 package, and support for asynchronous ×16 bus operation with versatile I/O voltage range (1.65 V to VCC).
Technical Context
This device implements an embedded algorithm controller (EAC) that manages autonomous program and erase operations without external timing control. Its architecture supports both byte/word boundary addressing and asynchronous page-mode reads, with status monitoring via Status Register, Data Polling, and RY/BY# pin.
The integrated hardware ECC operates transparently during read cycles, correcting single-bit errors on-the-fly and reporting uncorrectable multi-bit errors via the Status Register. Sector protection uses volatile and non-volatile methods, including four lockable 2048-byte OTP regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for boot code, firmware, and configuration storage in resource-constrained embedded systems |
| Random access time | 100 ns at –40°C to +85°C - enables real-time XIP execution with minimal latency penalty |
| Page access time | 15 ns - accelerates sequential instruction fetch during burst reads |
| Programming buffer | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| Erase endurance | 100,000 cycles - supports field firmware updates over extended product lifetimes |
| Data retention | 20 years - ensures long-term reliability without refresh in power-cycled applications |
| Operating temperature | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and industrial edge controllers |
| VIO range | 1.65 V to VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-142AB footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 512 Mb decoding; A0 selects byte/word mode when configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode depending on BYTE# state |
| CE# | Chip enable | Active-low chip select; controls device power state and enables internal timing for access |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state or timing |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming sequence |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating ongoing embedded operation completion status |
| BYTE# | Bus width select | High = ×8 mode (DQ0–DQ7 only); Low = ×16 mode (DQ0–DQ15 active) |
| VCC | Core supply | 2.7 V to 3.6 V single supply powers all read/program/erase functions |
| VIO | I/O supply | 1.65 V to VCC - independently configurable for mixed-voltage system interfacing |
| RESET# | Hardware reset | Active-low input forcing device into known reset state, clearing status registers and aborting operations |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | Single-bit error correction with automatic detection and flagging of uncorrectable errors - eliminates need for software-based error handling in safety-critical firmware storage |
| 512-byte programming buffer | Enables 256-word buffered writes - cuts typical firmware update time by >60% vs. single-word programming |
| Uniform 128-KB sectors | 64 identical erase blocks simplify partitioning for bootloader, OS, and application image storage |
| Suspend/Resume capability | Allows interrupting erase or program operations to service high-priority reads - essential for real-time multitasking environments |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - prevents accidental overwrite during field updates or debug sessions |
| OTP array with SSRs | 2048-byte one-time-programmable space divided into four lockable regions - supports secure key storage and device identity binding |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver alerts, and vehicle configuration tables in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP-capable read performance for real-time rendering. Use Value: 100 ns random access and 15 ns page access ensure zero-latency UI response; AEC-Q100 Grade 2 qualification guarantees operation at 105°C ambient. | Use Scenario: Holding ladder logic firmware, I/O mapping tables, and safety-critical configuration in programmable logic controllers. IC Role / Device Role / Timing Role: Boot memory and persistent parameter store with sector-level write protection. Use Value: 128-KB uniform sectors allow atomic firmware updates; hardware ECC prevents silent corruption in noisy factory environments. |
| Medical Diagnostic Imaging Bootloader | Avionics Display System Configuration |
Use Scenario: Secure boot loader storage for MRI and ultrasound systems requiring certified firmware integrity. IC Role / Device Role / Timing Role: Trusted boot source with OTP-based cryptographic key storage and sector lockdown. Use Value: Four lockable SSR regions enable separation of keys, certificates, and bootloader code; 20-year retention ensures lifetime calibration validity. | Use Scenario: Storing display resolution profiles, brightness calibration curves, and fail-safe UI assets in cockpit displays. IC Role / Device Role / Timing Role: High-reliability configuration memory with suspend/resume during flight-critical interrupts. Use Value: Suspend/resume capability allows immediate response to pilot input while preserving ongoing erase progress; 100,000-cycle endurance supports frequent field recalibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S12TFN020 | Same density and package, but uses older 65-nm process; 110 ns random access; no hardware ECC | Lacks built-in error correction - requires external software ECC or redundant storage schemes | Select when cost sensitivity outweighs long-term data integrity requirements in non-safety-critical systems |
| MX29GL512FPTI-90G | 512 Mb, 90 ns random access, ×16 bus, 3.0 V core, but no OTP array or SSR support | No dedicated secure storage region - unsuitable for cryptographic key or device identity binding | Prefer where high-speed read dominates and security features are managed externally |
Compared with S29GL512S12TFN020 and MX29GL512FPTI-90G, the S29GL512T12TFN020 uniquely combines hardware ECC, OTP-based secure storage, and industrial-plus temperature rating - making it the only choice for automotive and medical applications requiring certified data integrity and long-term firmware trustworthiness.
Availability
S29GL512T12TFN020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging bootloaders, and avionics display systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL512T12TFN020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q standards.
The GL-T family targets high-reliability embedded systems requiring fast XIP-capable flash with robust data integrity - designed specifically for automotive, industrial, and medical applications demanding extended temperature operation and long-term firmware trust.
FAQ
Is S29GL512T12TFN020 pin-compatible with earlier S29GL512P or S29GL512N variants?
No. S29GL512T12TFN020 uses a 56-pin TSOP package with updated pin assignments for VIO, RESET#, and enhanced sector protection control signals. The S29GL512P/N series use legacy 48-pin TSOP packages and lack VIO independence and hardware ECC circuitry - direct replacement requires PCB redesign and firmware adaptation.
Does this device support synchronous burst reads or only asynchronous operation?
S29GL512T12TFN020 supports only asynchronous read modes: standard random access and 32-byte page-mode reads. It does not implement clocked interfaces like QSPI or DDR; all timing is controlled by CE#, OE#, and WE# signal edges per JEDEC-standard parallel NOR protocols.
Can the OTP array (SSR) be reprogrammed after initial programming?
No. Each of the four 2048-byte SSR regions (SSR0–SSR3) is one-time programmable. Once written, bits can only be changed from '1' to '0'; no erase or rewrite capability exists. SSR0 is factory-locked and permanently read-only; SSR3 supports password-protected read access but remains write-once.
What happens during power loss while a sector erase is in progress?
The device implements hardware data protection during power-off: if VCC drops below the reset threshold during erase, the embedded algorithm controller halts the operation and preserves sector state. Upon power restoration, the Status Register reports the incomplete erase condition, allowing host firmware to safely resume or abort - preventing partial erasure and data corruption.
S29GL512T12TFN020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T12TFN020 FAQ
1.How can I place an order for S29GL512T12TFN020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T12TFN020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T12TFN020 reliable?
The price and inventory of S29GL512T12TFN020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T12TFN020 is usually 5 days.
3.What payment methods are accepted for S29GL512T12TFN020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T12TFN020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T12TFN020?
S29GL512T12TFN020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T12TFN020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T12TFN020?
For technical support, including S29GL512T12TFN020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T12TFN020 requirements.
6.How does Aetrix verify that S29GL512T12TFN020 is sourced from the original manufacturer or authorized distributors?
All S29GL512T12TFN020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T12TFN020 meets industry standards.
7.What is the process for return or replacement of S29GL512T12TFN020?
All S29GL512T12TFN020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T12TFN020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T12TFN020 part is unused and in its original packaging.
Return procedure for S29GL512T12TFN020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T12TFN020 Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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