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Infineon Technologies S29GL512T13TFNV20
- Part No.:
- S29GL512T13TFNV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T13TFNV20.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,481
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Product details
Overview
S29GL512T13TFNV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in microcontroller-based systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time and 15 ns page access time, features 512-byte write buffer programming, internal single-bit ECC, and uniform 128-KB sector erase - deployed in industrial control firmware storage.
For engineers reviewing the S29GL512T13TFNV20 datasheet, S29GL512T13TFNV20 pinout, S29GL512T13TFNV20 application, or S29GL512T13TFNV20 equivalent, key selection criteria include verified 128-KB sector architecture, TSOP-56 package compatibility, VIO range (1.65 V–VCC), AEC-Q100 Grade 3 qualification, and CFI-compliant command interface for bootloader integration.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously without host CPU intervention.
The hardware ECC engine corrects single-bit errors on-the-fly during read cycles, while the status register and RY/BY# pin provide real-time operation feedback. Sector protection is enforced via volatile/non-volatile ASP and four lockable OTP regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - supports full firmware images for mid-tier MCUs without external memory expansion |
| Random access time | 100 ns at –40°C to +85°C - enables deterministic XIP execution latency in real-time control loops |
| Page access time | 15 ns - accelerates sequential instruction fetch during boot or interrupt vector table reads |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction - ensures data integrity over 20-year retention without software overhead |
| Sector size | Uniform 128 KB - simplifies firmware partitioning and OTA update management |
| Endurance | 100,000 program/erase cycles - validated for field-updatable industrial HMI and gateway applications |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration pins (BYTE#) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| VCC | Core supply | 3.0 V ±10% main power for read/program/erase; no separate VPP required |
| VIO | I/O supply | 1.65 V to VCC - enables direct interfacing with 1.8 V or 3.3 V logic without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V–VCC - eliminates external level translation when interfacing with mixed-voltage SoCs |
| Hardware ECC engine | On-die single-bit correction - removes need for software ECC routines and associated RAM/CPU overhead |
| 512-byte write buffer | Enables burst programming of up to 256 words - cuts typical firmware update time by >60% vs. single-word writes |
| ASP and OTP security | Four lockable SSR regions with factory-locked SSR0 and password-protected SSR3 - secures bootloader and calibration data |
| CFI parameter table | Standardized JEDEC-compliant query structure - enables automatic driver detection and configuration in U-Boot/Linux MTD stacks |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency and 20-year data retention. Use Value: Eliminates external SRAM buffering and enables direct MCU core execution from flash, reducing BOM count and board space. | Use Scenario: Holding boot code and GUI assets in automotive digital instrument clusters qualified to AEC-Q100 Grade 3 (–40°C to +85°C). IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and sector protection to prevent corruption during cold cranking or ESD events. Use Value: Meets ASIL-B functional safety requirements via built-in error correction and secure OTP lockdown of critical startup vectors. |
| Medical Diagnostic Device Configuration | Network Router Boot Image Storage |
Use Scenario: Retaining calibrated sensor parameters and regulatory-compliant firmware versions in portable ultrasound systems. IC Role / Device Role / Timing Role: Secure, long-life configuration store using SSR3 password protection and 100,000-cycle endurance for field updates. Use Value: Ensures traceable, tamper-resistant calibration data persistence across device lifecycle without battery-backed SRAM. | Use Scenario: Hosting primary bootloader and fail-safe recovery image in enterprise-grade Ethernet routers requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: Dual-bank capable storage with suspend/resume during sector erase - enables background update without service interruption. Use Value: Supports atomic firmware swaps via CFI-compliant sector locking, minimizing risk of bricking during remote upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S13TFIV20 | Same density and pinout, but uses older 65-nm process; 110 ns tACC, no VIO versatility (VIO = VCC only) | Lacks versatile I/O and hardware ECC; limited to legacy 3.3 V-only designs | Select only if cost sensitivity outweighs ECC requirement and mixed-voltage interface needs |
| MX29GL512FPTI-90G | Macronix part; 90 ns tACC, 64-ball FBGA only, no OTP array or SSR protection | No factory-locked or password-protected sectors; requires external security layer for bootloader integrity | Choose when footprint flexibility (FBGA) and faster access time are prioritized over integrated security features |
Compared with S29GL512S13TFIV20 and MX29GL512FPTI-90G, the S29GL512T13TFNV20 uniquely combines TSOP-56 compatibility, hardware ECC, versatile I/O, and four-lockable OTP regions - making it optimal for new designs requiring robustness, security, and mixed-voltage interoperability.
Availability
S29GL512T13TFNV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic device configuration requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL512T13TFNV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
The GL-T family targets high-reliability embedded systems needing fast XIP execution, long-term data retention, and integrated security - specifically engineered for industrial automation, automotive clusters, and medical devices demanding AEC-Q100 or extended-temperature operation.
FAQ
Is S29GL512T13TFNV20 pin-compatible with earlier S29GL512P or S29GL512N variants?
No. S29GL512T13TFNV20 uses the TSOP-56 package with updated pin assignments for VIO and RY/BY#, differing from the legacy S29GL512P (TSOP-48) and S29GL512N (TSOP-44). Pin mapping must be verified against the Rev. *M datasheet Figure 12-1, and PCB layout requires revision for VIO routing and RY/BY# pull-up.
Does this device support true XIP (execute-in-place) operation without external caching?
Yes. With 100 ns random access time and asynchronous parallel interface, S29GL512T13TFNV20 allows ARM Cortex-M or RISC-V cores to execute code directly from flash without prefetch buffers or cache coherency management - confirmed by Infineon's GL-T family XIP timing validation in Application Note AN229225.
What is the function of the SSR3 region and how is password protection implemented?
SSR3 is the fourth 2048-byte one-time-programmable (OTP) region, protected by a user-defined 16-byte password stored in dedicated registers. Once programmed and locked, reads from SSR3 return zeros unless the correct password is written to the unlock register - preventing unauthorized access to cryptographic keys or calibration constants.
Can the 512-byte write buffer be used across sector boundaries during programming?
No. The write buffer operates strictly within a single 128-KB sector. Attempting to program across sector boundaries triggers a command error and sets the Status Register bit 4 (VPP Error). Buffer programming must be aligned to sector boundaries and initiated with the proper unlock sequence per sector.
S29GL512T13TFNV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T13TFNV20 FAQ
1.How can I place an order for S29GL512T13TFNV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T13TFNV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T13TFNV20 reliable?
The price and inventory of S29GL512T13TFNV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T13TFNV20 is usually 5 days.
3.What payment methods are accepted for S29GL512T13TFNV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T13TFNV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T13TFNV20?
S29GL512T13TFNV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T13TFNV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T13TFNV20?
For technical support, including S29GL512T13TFNV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T13TFNV20 requirements.
6.How does Aetrix verify that S29GL512T13TFNV20 is sourced from the original manufacturer or authorized distributors?
All S29GL512T13TFNV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T13TFNV20 meets industry standards.
7.What is the process for return or replacement of S29GL512T13TFNV20?
All S29GL512T13TFNV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T13TFNV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T13TFNV20 part is unused and in its original packaging.
Return procedure for S29GL512T13TFNV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T13TFNV20 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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