Cypress Semiconductor Corp S29VS064RABBHW010
- Part No.:
- S29VS064RABBHW010
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 44-VFBGA
- Datasheet:
-
S29VS064RABBHW010.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 44FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,968
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29VS064RABBHW010 from Infineon Technologies (formerly Cypress) is a 64-Mbit (4M × 16-bit), 1.8 V-only, multiplexed-address burst-mode Flash memory IC with simultaneous read/write capability across four independent banks, 108 MHz synchronous burst operation, and VersatileIO™ support for 1.8 V I/O compatibility. It features 100,000 program/erase cycles per sector, 10-year data retention, and operates from −25°C to +85°C in industrial applications requiring nonvolatile code/data storage with zero-latency background operations.
For engineers reviewing the S29VS064RABBHW010 datasheet, S29VS064RABBHW010 pinout, S29VS064RABBHW010 application, or S29VS064RABBHW010 equivalent, key selection criteria include its ADM interface mode, 44-ball VT-FBGA package, burst linear/wrap-around timing, Dynamic Protection Bit (DYB) sector locking, and CFI-compliant command set for embedded boot and firmware update systems.
Technical Context
This device implements a Simultaneous Read/Write architecture partitioned into four independent banks, enabling concurrent execution of erase/program in one bank while sustaining continuous burst reads from another - with zero latency handoff between modes. Its VersatileIO™ logic ties output drive strength and input voltage tolerance directly to the VCCQ supply, ensuring robust 1.8 V signal integrity without level-shifting circuitry.
The flash uses Infineon's 65 nm MirrorBit® process and supports JEDEC 42.4 single-power-supply command sets. It integrates hardware reset (RESET#), RDY handshaking, Data# Polling (DQ7), and toggle bits (DQ6/DQ2) for precise operation status monitoring, alongside Erase/Program Suspend-Resume for real-time foreground access during background operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 × 16-bit words) - supports full firmware images or large configuration tables in compact footprint |
| Supply Voltage | 1.7–1.95 V (VCC), 1.7–1.95 V (VCCQ) - single-rail 1.8 V system compatibility with no auxiliary supplies required |
| Burst Clock Speed | 108 MHz - enables 7.6 ns synchronous burst access time for high-throughput data streaming |
| Asynchronous Access | 80 ns tACC - maintains fast random-access performance for legacy bus interfaces |
| Endurance & Retention | 100,000 cycles/sector, 10 years retention - validated for long-life industrial firmware storage with frequent field updates |
| Operating Temperature | −25°C to +85°C - qualified for extended industrial environments without derating |
| Interface Mode | Address/Data Multiplexed (ADM) - reduces pin count to 44-ball VT-FBGA while preserving full 16-bit data path |
Pinout & Package
Package: 44-ball Very Thin Fine-Pitch Ball Grid Array (VT-FBGA), 8 mm × 10 mm, 0.8 mm pitch, RoHS-compliant, bottom-side thermal pad optional.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs (Multiplexed) | 22-bit address bus shared with DQ0–DQ15 in ADM mode; A21 = Amax for 4M-word addressing |
| DQ0–DQ15 | Data/Address Bidirectional I/O | 16-bit multiplexed data/address lines; driven at VCCQ voltage level per VersatileIO™ |
| CE#, OE#, WE#, RESET#, AVD#, RDY | Control Signals | Active-low chip enable, output enable, write enable, hardware reset, address valid, and ready handshake |
| VCC, VCCQ, VSS | Power & Ground | VCC = core/memory supply (1.7–1.95 V); VCCQ = I/O supply (1.7–1.95 V); VSS = common ground reference |
| CLK | Clock Input | Required only for synchronous burst read; supports 108 MHz operation with defined setup/hold timing |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write Banks | Four independent banks enable true background erase/program with zero-latency read resumption - eliminates CPU idle stalls in real-time systems |
| VersatileIO™ Interface | VCCQ-synchronized I/O voltage generation/tolerance - removes need for external level shifters in mixed-voltage SoC designs |
| Dynamic Protection Bit (DYB) | In-system programmable sector lock/unlock at VCC - allows runtime firmware partitioning without hardware write-protect pins |
| Erase/Program Suspend-Resume | Pause background erase or program to service urgent read/write requests in other sectors - enables deterministic response in safety-critical firmware |
| Secured Silicon Sector | 256-word protected region (128 factory + 128 customer) accessible only via command sequence - isolates boot keys or calibration data from standard access |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and updating ladder logic, motion control algorithms, and I/O configuration in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Nonvolatile boot and runtime firmware storage with in-field update capability and sector-level protection against corruption during power loss. Use Value: 100,000-cycle endurance and 10-year retention ensure >15-year operational life; simultaneous read/write enables seamless firmware patching without halting machine control. | Use Scenario: Hosting boot code and sensor fusion firmware for automotive camera/radar ECUs requiring ASIL-B-aware storage with fast startup and secure update paths. IC Role / Device Role / Timing Role: Primary boot flash with CFI compliance for bootloader initialization and secured silicon sector for cryptographic key storage. Use Value: −25°C to +85°C rating meets automotive extended temperature requirements; DYB locking prevents unauthorized reprogramming of safety-critical boot code. |
| Medical Imaging System Configuration | Telecom Base Station Firmware |
Use Scenario: Storing calibration profiles, image processing parameters, and regulatory compliance settings in portable ultrasound and X-ray devices subject to strict traceability audits. IC Role / Device Role / Timing Role: Parameter and configuration storage with hardware reset recovery and RDY handshaking for deterministic boot sequencing. Use Value: Secured Silicon Sector isolates FDA-mandated calibration constants; Erase Suspend allows real-time parameter reload during imaging sessions. | Use Scenario: Holding baseband firmware, protocol stacks, and field-upgradable DSP code in 5G small cell radios requiring high reliability and remote update resilience. IC Role / Device Role / Timing Role: High-bandwidth burst-mode firmware execution memory interfaced to ARM-based baseband processors via ADM bus. Use Value: 108 MHz burst read delivers >1.7 Gbps effective throughput; four-bank architecture enables concurrent OTA update verification and active runtime execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar burst-mode flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29VS064RABBHW012 | Same die, identical specs, but rated for −40°C to +85°C industrial temperature range | Required for extended cold-environment deployments (e.g., outdoor telecom, polar instrumentation) | Select HW012 when ambient operating temperature may fall below −25°C |
| S29VS064RABBHW020 | Same die, identical specs, but packaged in 48-pin TSOP-II (400 mil) instead of 44-ball VT-FBGA | Preferred for legacy PCB layouts or cost-sensitive consumer applications where board space is less constrained | Select HW020 when FBGA assembly infrastructure is unavailable or thermal management favors TSOP |
Compared with S29VS064RABBHW012 and S29VS064RABBHW020, the HW010 variant offers optimal balance of industrial temperature margin, ultra-compact VT-FBGA footprint, and proven reliability in space-constrained embedded systems - making it the default choice for new designs targeting −25°C to +85°C operation.
Availability
S29VS064RABBHW010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for S29VS064RABBHW010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and memory solutions, with global R&D and manufacturing infrastructure.
The S29VS064R belongs to Infineon's MirrorBit® Flash product line, engineered for high-reliability embedded systems requiring simultaneous read/write, secure firmware storage, and industrial-temperature operation without external voltage translation.
FAQ
What interface modes does S29VS064RABBHW010 support?
The S29VS064RABBHW010 supports Address/Data Multiplexed (ADM) mode only, as indicated by the "VS" suffix and confirmed in the datasheet Section 9.1. It does not support AADM mode (reserved for S29XS-R variants). ADM reduces pin count by sharing address and data lines on DQ0–DQ15, controlled via AVD# and CLK signals for burst operation.
Does this part require a separate VPP supply for normal operation?
No. S29VS064RABBHW010 operates fully from a single 1.7–1.95 V VCC supply for read, program, and erase. A 9.0 V VPP is optional and only used to accelerate programming speed - it is not required for standard functionality, and the device functions identically at VPP = VSS in all standard command sequences.
How is sector protection implemented on this device?
Sector protection uses two complementary methods: Dynamic Protection Bit (DYB), which allows in-system locking/unlocking of individual sectors via command sequence at VCC level, and Hardware Sector Protection, which locks all sectors automatically when VPP is pulled low (VIL). DYB provides flexible runtime control; hardware protection adds fail-safe power-loss immunity.
Is CFI support mandatory for host system integration?
CFI support is built-in and enabled by default; it is not optional. The device responds to CFI query commands (0x98 at address 0x55) and returns standardized vendor, device, and timing information. Host systems must use CFI data to auto-configure timing parameters and command sets - no hardcoded values are guaranteed across revisions or temperature ranges.
S29VS064RABBHW010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- VS-R
- Package/Case:
- 44-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 80 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-FBGA (7.5x5)
S29VS064RABBHW010 FAQ
1.How can I place an order for S29VS064RABBHW010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29VS064RABBHW010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29VS064RABBHW010 reliable?
The price and inventory of S29VS064RABBHW010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29VS064RABBHW010 is usually 5 days.
3.What payment methods are accepted for S29VS064RABBHW010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29VS064RABBHW010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29VS064RABBHW010?
S29VS064RABBHW010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29VS064RABBHW010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29VS064RABBHW010?
For technical support, including S29VS064RABBHW010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29VS064RABBHW010 requirements.
6.How does Aetrix verify that S29VS064RABBHW010 is sourced from the original manufacturer or authorized distributors?
All S29VS064RABBHW010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29VS064RABBHW010 meets industry standards.
7.What is the process for return or replacement of S29VS064RABBHW010?
All S29VS064RABBHW010 units undergo pre-shipment inspection (PSI). If there is an issue with S29VS064RABBHW010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29VS064RABBHW010 part is unused and in its original packaging.
Return procedure for S29VS064RABBHW010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29VS064RABBHW010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

