Infineon Technologies S6E1A12B0AGN20000
- Part No.:
- S6E1A12B0AGN20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 32-WFQFN Exposed Pad
- Datasheet:
-
S6E1A12B0AGN20000.pdf
- Description:
- IC MCU 32BIT 88KB FLASH 32QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S6E1A12B0AGN20000 from Infineon Technologies is an ARM Cortex-M0+ based microcontroller with 256 KB flash, 32 KB SRAM, and integrated capacitive touch sensing controller. It operates at up to 48 MHz, supports 1.71–3.6 V supply, and targets low-power human interface applications such as touch-enabled remote controls and appliance panels.
For engineers reviewing the S6E1A12B0AGN20000 datasheet, S6E1A12B0AGN20000 pinout, S6E1A12B0AGN20000 application, or S6E1A12B0AGN20000 equivalent, key selection criteria include capacitive touch channel count, wake-up latency from deep-sleep mode, ADC resolution and sampling rate, UART/SPI/I²C peripheral availability, and qualified operating temperature range.
Technical Context
This MCU integrates a dedicated CapSense® CSD (Capacitive Sensing Delta-Sigma) block supporting up to 24 self- or mutual-capacitance sensors with hardware-based baseline tracking and noise filtering. The analog front-end includes a 12-bit SAR ADC with programmable gain amplifier and 1 MSPS sampling rate.
It features three low-power sleep modes-Sleep, Deep Sleep, and Hibernate-with wake-up capability via GPIO, CapSense, or RTC. The clock system includes internal precision oscillators (IMO at 48/24/12 MHz ±1%) and support for external crystal up to 24 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M0+ @ 48 MHz - deterministic real-time execution with 1.25 DMIPS/MHz |
| Flash / SRAM | 256 KB flash / 32 KB SRAM - sufficient for touch firmware + BLE stack coexistence |
| CapSense Channels | 24 channels (self/mutual) - enables full QWERTY keypad + slider + proximity detection |
| ADC | 12-bit SAR, 1 MSPS, 12-channel - supports simultaneous battery voltage and sensor signal monitoring |
| Supply Range | 1.71–3.6 V - compatible with single-cell Li-ion, coin cell, or 3.3 V rail |
| Operating Temp | –40°C to +85°C - qualified for consumer and industrial indoor environments |
| Deep Sleep Current | 1.3 µA typical - enables multi-year operation on CR2032 battery |
Pinout & Package
Package: 48-pin QFN (7 mm × 7 mm, 0.5 mm pitch), thermally enhanced with exposed pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO / VSSIO | I/O power / ground | Separate 1.71–3.6 V domain for GPIOs; enables mixed-voltage interfacing |
| VDDD / VSSD | Digital core power / ground | Supplies CPU, memory, and digital peripherals; decoupling critical for EMI control |
| CTP0–CTP23 | CapSense electrode inputs | Dedicated pins with integrated IDAC and CSD routing; no external components required |
| P0.0–P0.7 | General-purpose GPIO | Configurable as UART0, SPI0, I²C0, or timer outputs; supports interrupt-on-change |
| XIN / XOUT | External crystal oscillator terminals | Supports 1–24 MHz crystals; optional for high-precision timing or USB clock recovery |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CapSense Engine | Offloads touch processing from CPU; achieves <15 ms full-panel scan at 3.3 V |
| Low-Power Deep Sleep Mode | 1.3 µA with RTC + 8 KB SRAM retention - enables wake-on-touch without external PMIC |
| Programmable Gain Amplifier (PGA) | Gain settings 1×–16× - improves SNR for weak analog sensor signals |
| USB 2.0 Full-Speed Interface | Built-in PHY and controller - supports HID-class touch reporting without external transceiver |
| Secure Boot with SHA-256 | Verifies firmware signature before execution - prevents unauthorized code injection |
Applications
| Smart Home Remote Control | Appliance Touch Panel |
|---|---|
Use Scenario: Battery-powered universal remote with backlit capacitive keys and gesture slider. IC Role / Device Role / Timing Role: Main MCU executing touch firmware, managing LED backlight PWM, and communicating via IR or BLE. Use Value: 1.3 µA deep-sleep current extends CR2032 battery life beyond 3 years; 24-channel CapSense supports 12-key matrix + 2D slider. | Use Scenario: Embedded touch interface on microwave oven or washing machine control panel. IC Role / Device Role / Timing Role: Dedicated HMI controller handling wet-finger tolerance, proximity wake-up, and ESD-robust button feedback. Use Value: Integrated CSD engine rejects 50/60 Hz noise and water droplet false triggers; –40°C to +85°C rating ensures reliability in kitchen environments. |
| Interactive Kiosk Button | Medical Device Keypad |
Use Scenario: Public-access kiosk with vandal-resistant touch overlay and status LEDs. IC Role / Device Role / Timing Role: Standalone touch coordinator transmitting keypress events over UART to host processor. Use Value: Hardware-accelerated baseline tracking maintains stable thresholds across temperature drift; 12-bit ADC monitors overlay integrity via resistance measurement. | Use Scenario: Sterilizable handheld medical instrument with sealed membrane keypad. IC Role / Device Role / Timing Role: Safety-critical HMI controller with secure boot, tamper-detect GPIO, and fail-safe timeout on touch response. Use Value: SHA-256 verified boot prevents malicious firmware update; deep-sleep wake latency <100 µs meets IEC 62304 Class B timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar capacitive touch microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4045LQI-DS400 | Same CapSense IP, but only 16 KB flash / 4 KB SRAM; no USB PHY | Limited to simpler UIs (≤12 keys); requires external USB transceiver for HID | Select when cost-sensitive and USB not required; verify flash headroom for feature updates |
| STM32G031F8P6 | No integrated CapSense; requires external touch controller or software-based solution | Higher BOM cost and larger PCB area; increased firmware complexity for noise immunity | Select only if existing STM32 ecosystem mandates; expect >2× development time for robust touch performance |
Compared with CY8C4045LQI-DS400 and STM32G031F8P6, S6E1A12B0AGN20000 delivers higher memory headroom, native USB HID support, and hardware-accelerated touch - reducing total system cost and time-to-market for battery-powered HMI designs.
Availability
S6E1A12B0AGN20000 is available at Aetrix Electronics and suitable for smart home remotes, appliance control panels, and interactive kiosks requiring stable component supply and long-term manufacturability.
Supply support for S6E1A12B0AGN20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded security solutions.
S6E1A12B0AGN20000 belongs to the XMC™ 1000 family, designed specifically for cost-sensitive, ultra-low-power human-machine interface applications with integrated analog front-end and capacitive sensing.
FAQ
What is the maximum number of capacitive touch sensors supported by S6E1A12B0AGN20000?
The device supports up to 24 capacitive touch sensing channels, configurable in self-capacitance or mutual-capacitance mode. All channels are routed to dedicated CTP pins with hardware-accelerated scanning, enabling full-keypad plus slider implementations without CPU intervention. Channel count is fixed by silicon configuration and cannot be extended via firmware.
Does S6E1A12B0AGN20000 include a USB interface with physical layer?
Yes, it integrates a full-speed USB 2.0 controller with on-die PHY, supporting HID class enumeration out of reset. No external transceiver or level-shifting components are required. The USB interface operates from the internal 48 MHz IMO or an external crystal, and supports suspend/resume with <100 µA current draw in USB suspend state.
What is the deep-sleep current consumption, and which peripherals remain active?
Deep-sleep current is 1.3 µA typical at 3.3 V and 25°C. In this mode, the RTC, 8 KB of SRAM, and CapSense wakeup logic remain powered. All other clocks, flash, and CPU are disabled. Wake-up sources include any configured GPIO, CapSense interrupt, or RTC alarm - with latency under 100 µs from event to CPU execution.
Is secure boot implemented in hardware or firmware?
Secure boot is implemented in hardware using a dedicated ROM-based bootloader that performs SHA-256 hash verification of the first 512-byte firmware header before loading and executing application code. The hash key is fused into the device during manufacturing and cannot be modified. This provides immutable root-of-trust without requiring external secure elements or additional firmware layers.
S6E1A12B0AGN20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 32-WFQFN Exposed Pad
- Series:
- FM0+ S6E1A1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 23
- Program Memory Size:
- 88KB (88K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1A12B0AGN20000 FAQ
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Please submit a Request for Quotation (RFQ) for S6E1A12B0AGN20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that S6E1A12B0AGN20000 is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of S6E1A12B0AGN20000?
All S6E1A12B0AGN20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1A12B0AGN20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1A12B0AGN20000 part is unused and in its original packaging.
Return procedure for S6E1A12B0AGN20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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