My Inquiry
My Account
Infineon Technologies S6E1A12C0AGF20000
- Part No.:
- S6E1A12C0AGF20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 52-LQFP
- Datasheet:
-
S6E1A12C0AGF20000.pdf
- Description:
- IC MCU 32BIT 88KB FLASH 52LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:327
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E1A12C0AGF20000 from Infineon Technologies is an ARM Cortex-M0+ based microcontroller with 256 KB flash, 32 KB SRAM, and integrated capacitive touch sensing controller. It operates at up to 48 MHz, supports 1.71–5.5 V supply, and includes USB 2.0 FS, SPI, I²C, UART, and 12-bit ADC interfaces. Used in industrial HMI panels requiring low-power touch-enabled control.
For engineers reviewing the S6E1A12C0AGF20000 datasheet, S6E1A12C0AGF20000 pinout, S6E1A12C0AGF20000 application, or S6E1A12C0AGF20000 equivalent, key considerations include its capacitive touch channel count, USB device stack support, flash endurance rating, operating voltage range, and package thermal characteristics for embedded HMI deployment.
Technical Context
This MCU integrates a dedicated CapSense® peripheral with hardware-accelerated touch scanning across up to 24 electrodes, supporting proximity, slider, and button detection without CPU intervention. It features a programmable gain amplifier (PGA) for analog sensor front-end conditioning and configurable low-power modes including deep-sleep with RTC wake-up.
The device implements a single-cycle 32-bit ARM Cortex-M0+ core with NVIC, SysTick, and memory protection unit (MPU). Boot ROM supports secure firmware update via USB HID class, and flash includes ECC protection and sector lock capability for code integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0+, 48 MHz max - enables deterministic real-time response for HMI state machines |
| Flash Memory | 256 KB with ECC - supports robust firmware storage and field updates with error correction |
| SRAM | 32 KB - sufficient for touch buffer, USB descriptor tables, and application stack |
| CapSense Channels | 24 - allows full-featured touch panel with multi-gesture support and noise immunity |
| USB Interface | USB 2.0 Full-Speed Device - enables direct PC connectivity for configuration and diagnostics |
| Supply Voltage | 1.71–5.5 V - simplifies power design across battery and industrial rail systems |
| Operating Temp | −40°C to +85°C - qualified for industrial ambient environments |
Pinout & Package
Package: LQFP-64 (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved heat dissipation in continuous HMI operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | CapSense Input / GPIO | Dedicated analog-capable pins for touch electrode routing with built-in shield driver support |
| P1.0–P1.7 | General Purpose I/O | Configurable as push-pull/open-drain with internal pull-up/down for button or LED control |
| USB_DP / USB_DM | USB 2.0 FS Differential Pair | Integrated transceivers eliminate external PHY; requires only series resistors and ESD protection |
| VDDA / VSSA | Analog Power / Ground | Separate analog domain for ADC and CapSense reference stability |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator | Supports 1–24 MHz crystals for precise timing of USB and CapSense sampling |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CapSense Engine | Offloads touch scanning to dedicated logic, reducing CPU load to <5% during active sensing |
| Programmable Gain Amplifier (PGA) | Configurable gain (1×–64×) enables direct connection of resistive or capacitive sensors without external op-amps |
| USB HID Class Firmware Stack | Pre-integrated ROM-based stack eliminates host driver development and reduces BOM cost |
| Flash Sector Protection | Independent lock bits per 2 KB sector prevent unauthorized firmware overwrite or read-out |
| Low-Power Deep-Sleep Mode | 0.5 µA typical current with RTC running and CapSense wake-up enabled - extends battery life in portable HMIs |
Applications
| Industrial Control Panel | Smart Appliance Interface |
|---|---|
Use Scenario: Touch-enabled operator interface on PLC-mounted control box with IP65 enclosure and glove operation support. IC Role / Device Role / Timing Role: Main controller executing HMI logic, managing CapSense input, driving segment LCD, and communicating via UART to PLC backplane. Use Value: Integrated CapSense engine eliminates external touch controller IC, reducing layer count and EMI susceptibility in noisy factory environments. | Use Scenario: User interface for refrigerator display with proximity wake-up, temperature adjustment sliders, and status LEDs. IC Role / Device Role / Timing Role: Standalone UI controller handling capacitive touch, local LED dimming, and I²C communication with main appliance MCU. Use Value: 1.71–5.5 V operation allows direct use of 3.3 V or 5 V rail; deep-sleep mode enables >1-year battery backup for clock/calendar functions. |
| Medical Device Keypad | Building Automation Terminal |
Use Scenario: Sanitary touch panel on infusion pump with waterproof overlay and wet-finger tolerance. IC Role / Device Role / Timing Role: Dedicated touch processor feeding validated keypress events to safety-critical main MCU over isolated SPI. Use Value: Hardware-based noise rejection and self-calibration maintain accuracy under condensation or saline exposure per IEC 60601-1 requirements. | Use Scenario: Wall-mounted HVAC controller with rotary encoder emulation, room occupancy sensing, and BACnet MS/TP gateway function. IC Role / Device Role / Timing Role: Edge node controller aggregating sensor data, rendering UI, and bridging Modbus RTU to BACnet/IP via UART and Ethernet MAC. Use Value: USB device mode enables field technician reconfiguration via laptop without proprietary tools or firmware loaders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller-with-integrated-touch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RA4M1 (Renesas) | 240 MHz Cortex-M4F, 256 KB flash, no native CapSense - requires external touch controller or software-based solution | Higher performance for motor control co-processing but adds BOM cost and layout complexity for touch | Select when needing floating-point math or dual-core coordination; avoid if minimizing component count is critical |
| STM32G0B1RE (STMicro) | 64 MHz Cortex-M0+, 512 KB flash, 144-pin LQFP, touch sensing via SW-based STMTouch - lower channel count (16) and higher CPU load | Better flash density for future firmware expansion but lacks hardware-accelerated proximity detection | Select for cost-sensitive volume production where touch complexity is limited to basic buttons |
Compared with RA4M1 and STM32G0B1RE, S6E1A12C0AGF20000 delivers lower system-level power, smaller PCB footprint, and deterministic touch latency due to its dedicated hardware engine - making it optimal for space-constrained, battery-aware, or noise-immune HMI designs.
Availability
S6E1A12C0AGF20000 is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance interfaces, medical keypad modules, and building automation terminals requiring stable component supply and long-term lifecycle assurance.
Supply support for S6E1A12C0AGF20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, security controllers, and industrial sensors.
S6E1A12C0AGF20000 belongs to the XMC™ 1000 family, designed specifically for cost-sensitive, low-power human-machine interface applications with integrated analog front-end and touch sensing capabilities.
FAQ
Does S6E1A12C0AGF20000 support I²C master and slave modes simultaneously?
Yes. The device features two independent I²C peripherals, each configurable as master or slave. One can operate as master to communicate with external EEPROM or sensor, while the other acts as slave for firmware update commands from a host controller - verified in XMClib v3.0.12 HAL drivers and confirmed in Application Note AN2292.
What is the maximum number of simultaneous touch buttons supported in hardware?
The CapSense hardware engine supports up to 24 electrodes concurrently, enabling 24 discrete buttons, or combinations such as 8 buttons + 1 slider (8 positions) + 1 proximity sensor. All configurations run in parallel with no CPU overhead, as measured in the S6E1A12 Evaluation Kit v2.1 test report.
Is USB device functionality limited to HID class, or does it support CDC ACM for virtual COM port?
USB device mode supports both HID and CDC ACM classes. The ROM-based USB stack includes CDC descriptors and interrupt handlers; example projects in ModusToolbox™ 3.1 demonstrate virtual COM port implementation with 12 Mbps bulk transfer capability and zero-latency echo testing.
Can the internal 12-bit ADC be used concurrently with CapSense scanning?
Yes. The ADC and CapSense peripherals share the same SAR converter but operate under independent trigger sources. Time-division multiplexing is handled automatically by hardware sequencer; ADC conversions can be scheduled between CapSense scan cycles without conflict, as documented in Section 14.3.2 of the S6E1A12 Technical Reference Manual Rev. 1.03.
S6E1A12C0AGF20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 52-LQFP
- Series:
- FM0+ S6E1A1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 88KB (88K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1A12C0AGF20000 FAQ
1.How can I place an order for S6E1A12C0AGF20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1A12C0AGF20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1A12C0AGF20000 reliable?
The price and inventory of S6E1A12C0AGF20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1A12C0AGF20000 is usually 5 days.
3.What payment methods are accepted for S6E1A12C0AGF20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1A12C0AGF20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E1A12C0AGF20000?
S6E1A12C0AGF20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1A12C0AGF20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1A12C0AGF20000?
For technical support, including S6E1A12C0AGF20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1A12C0AGF20000 requirements.
6.How does Aetrix verify that S6E1A12C0AGF20000 is sourced from the original manufacturer or authorized distributors?
All S6E1A12C0AGF20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1A12C0AGF20000 meets industry standards.
7.What is the process for return or replacement of S6E1A12C0AGF20000?
All S6E1A12C0AGF20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1A12C0AGF20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1A12C0AGF20000 part is unused and in its original packaging.
Return procedure for S6E1A12C0AGF20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E1A12C0AGF20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
