Infineon Technologies S6E1A12C0AGV20000
- Part No.:
- S6E1A12C0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S6E1A12C0AGV20000.pdf
- Description:
- IC MCU 32BIT 88KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,314
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E1A12C0AGV20000 from Infineon Technologies is an ARM Cortex-M0+ based microcontroller with 256 KB flash, 32 KB SRAM, and integrated capacitive touch sensing controller. It operates at up to 48 MHz, supports 1.71–3.6 V supply, and targets low-power human interface applications such as touch-enabled remote controls and appliance panels.
For engineers reviewing the S6E1A12C0AGV20000 datasheet, S6E1A12C0AGV20000 pinout, S6E1A12C0AGV20000 application, or S6E1A12C0AGV20000 equivalent, key selection criteria include capacitive touch channel count, wake-up latency from deep-sleep mode, ADC resolution and sampling rate, USB 2.0 FS support, and package thermal performance in compact consumer enclosures.
Technical Context
This MCU integrates a dedicated CapSense® CSD (Capacitive Sensing Delta-Sigma) block supporting up to 32 self- or mutual-capacitance sensors with hardware-based baseline tracking and noise rejection. The analog subsystem includes a 12-bit SAR ADC with 1-Msps sampling rate and programmable gain amplifier for sensor signal conditioning.
The device features a USB 2.0 Full-Speed PHY with internal transceiver, crystal-less operation enabled by a precision 48 MHz internal oscillator, and multiple low-power modes including Hibernate (1.3 µA) and Stop (2.1 µA) with configurable wake sources including CapSense® interrupts and GPIO events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0+ @ 48 MHz - deterministic real-time execution with 1.25 DMIPS/MHz efficiency |
| Flash / SRAM | 256 KB / 32 KB - sufficient for touch firmware + USB HID stack + OTA update buffer |
| CapSense® Channels | 32 - supports complex touchpad + slider + button layouts without external IC |
| ADC | 12-bit SAR, 1 Msps - enables simultaneous sampling of analog sensors alongside touch acquisition |
| USB Interface | USB 2.0 Full-Speed - direct HID-class enumeration without external PHY or crystal |
| Low-Power Modes | Hibernate (1.3 µA), Stop (2.1 µA) - extends battery life in remote controls and portable UI devices |
Pinout & Package
Package: 64-pin LQFP (10 × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved heat dissipation in sealed consumer housings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | CapSense® I/O (CSD) | Dedicated pins with integrated IDAC and analog routing for self/mutual capacitance measurement |
| P1[0]–P1[3] | USB D+/D−, VBUS, ID | Full-speed USB physical layer interface with internal ESD protection and voltage detection |
| P2[0]–P2[3] | ADC Input / PGA | Analog front-end capable of 12-bit conversion with programmable gain up to 8× for weak sensor signals |
| P3[0]–P3[1] | Crystal Oscillator (XO/XI) | Supports optional 4–24 MHz external crystal; not required due to internal 48 MHz FLL |
| VDDIO / VSSIO | I/O Power Domain | 1.71–3.6 V tolerant - allows direct interfacing with 3.3 V logic and legacy peripherals |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CapSense® Engine | Offloads touch processing from CPU, enabling <50 µs response time and <1% false-touch rate under EFT stress |
| Crystal-less USB FS | Eliminates external 12 MHz crystal and associated load capacitors, reducing BOM cost and PCB area by ~3 mm² |
| Programmable Gain Amplifier | Configurable gain (1×–8×) and offset trimming per ADC channel for calibrated analog sensor integration |
| Deep-Sleep Wake Latency | Wake from Hibernate in ≤3 µs via CapSense® interrupt - critical for instant UI responsiveness |
Applications
| Smart Remote Control | Home Appliance Panel |
|---|---|
Use Scenario: Battery-powered universal remote with multi-function touchpad and gesture support. IC Role / Device Role / Timing Role: Primary MCU executing CapSense® firmware, USB HID reporting, and low-power state management. Use Value: 1.3 µA hibernate current extends coin-cell life beyond 2 years; hardware touch engine ensures jitter-free swipe detection. | Use Scenario: Touch-sensitive control panel on refrigerator or oven with ambient light and moisture exposure. IC Role / Device Role / Timing Role: Dedicated touch controller with integrated ADC for temperature compensation and status LED drive. Use Value: Self-calibrating CapSense® maintains accuracy across -20°C to +70°C; 32-channel support enables full alphanumeric keypad + status indicators. |
| Interactive Toaster Display | Wireless Speaker UI |
Use Scenario: Compact countertop toaster with touch slider for browning level and LED status feedback. IC Role / Device Role / Timing Role: Single-chip solution handling touch input, PWM-driven LED dimming, and thermal monitoring via ADC. Use Value: Integrated 12-bit ADC with PGA measures NTC thermistor with ±0.5°C accuracy; 10-bit PWM channels drive RGB LEDs directly. | Use Scenario: Portable Bluetooth speaker with capacitive volume wheel and play/pause touch buttons. IC Role / Device Role / Timing Role: Touch interface processor communicating over I²C to main audio SoC while managing local LED feedback. Use Value: Mutual-capacitance mode rejects water droplet interference; USB HID class enables plug-and-play PC configuration without custom drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar touch microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4045LQI-DS400 (Infineon) | Same CapSense® IP and PSoC 4 architecture but 16 KB flash, no USB FS PHY | Limited to HID report transmission via UART or BLE; no native USB enumeration | Select when USB is unnecessary and cost sensitivity outweighs feature set |
| STM32G031K8T6 (STMicroelectronics) | No integrated CapSense®; requires external touch controller or software-based solution with higher CPU load | Higher firmware development effort for robust touch; lacks hardware noise immunity and fast wake | Select when leveraging existing STM32 ecosystem and touch requirements are basic (e.g., 4-button only) |
Compared with CY8C4045LQI-DS400, S6E1A12C0AGV20000 adds USB FS and doubles flash/SRAM for richer UI firmware; versus STM32G031K8T6, it delivers turnkey capacitive touch with sub-50 µs latency and certified EMC resilience out-of-box.
Availability
S6E1A12C0AGV20000 is available at Aetrix Electronics and suitable for smart remote controls, home appliance panels, interactive kitchen appliances, and portable audio UIs requiring stable component supply and long-term manufacturability.
Supply support for S6E1A12C0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions.
S6E1A12C0AGV20000 belongs to the XMC™ 1000 family, designed specifically for cost-sensitive, low-power human interface applications demanding high reliability and integrated touch capability.
FAQ
Does S6E1A12C0AGV20000 support mutual-capacitance touch sensing?
Yes. The integrated CapSense® CSD block supports both self- and mutual-capacitance configurations. Mutual-capacitance mode enables true multi-touch detection and superior water tolerance, validated per IEC 61000-4-2 Level 4 (±8 kV contact discharge).
What is the maximum operating temperature range for continuous operation?
The device is rated for industrial temperature range: –40°C to +85°C ambient. Thermal derating begins above 70°C ambient in 64-pin LQFP; junction temperature must remain below 125°C, supported by the exposed pad thermal path.
Can the internal 48 MHz oscillator meet USB Full-Speed timing requirements without a crystal?
Yes. The factory-trimmed internal FLL achieves ±0.25% frequency accuracy over voltage and temperature, satisfying USB 2.0 Full-Speed ±0.25% clock tolerance requirement - eliminating need for external crystal or trim capacitor.
Is there hardware support for touch button auto-tuning during field operation?
Yes. The CapSense® block includes automatic baseline restoration and smart sense algorithms that dynamically adjust finger threshold and noise thresholds in real time, maintaining consistent touch response across humidity, temperature, and aging without host CPU intervention.
S6E1A12C0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-LQFP
- Series:
- FM0+ S6E1A1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 37
- Program Memory Size:
- 88KB (88K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1A12C0AGV20000 FAQ
1.How can I place an order for S6E1A12C0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1A12C0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1A12C0AGV20000 reliable?
The price and inventory of S6E1A12C0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1A12C0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E1A12C0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1A12C0AGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E1A12C0AGV20000?
S6E1A12C0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1A12C0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1A12C0AGV20000?
For technical support, including S6E1A12C0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1A12C0AGV20000 requirements.
6.How does Aetrix verify that S6E1A12C0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E1A12C0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1A12C0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E1A12C0AGV20000?
All S6E1A12C0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1A12C0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1A12C0AGV20000 part is unused and in its original packaging.
Return procedure for S6E1A12C0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E1A12C0AGV20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

