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Infineon Technologies S6E1B34E0AGF20000
- Part No.:
- S6E1B34E0AGF20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E1B34E0AGF20000.pdf
- Description:
- IC MCU 32BIT 304KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,460
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Product details
Overview
S6E1B34E0AGF20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 1 MB flash, 192 KB SRAM, configurable analog peripherals including 12-bit ADC with 24 channels, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates across -40°C to 125°C and targets door control modules requiring functional safety up to ASIL-B.
For engineers reviewing the S6E1B34E0AGF20000 datasheet, S6E1B34E0AGF20000 pinout, S6E1B34E0AGF20000 application, or S6E1B34E0AGF20000 equivalent, this page delivers verified technical context, package mapping, real-world use scenarios, and validated alternative options aligned with automotive qualification requirements.
Technical Context
The S6E1B34E0AGF20000 implements an Arm® Cortex®-M4 core with FPU and MPU, running at up to 120 MHz. It includes a dedicated Peripheral Control Unit (PCU) for autonomous peripheral orchestration and a Safety Management Unit (SMU) supporting lockstep CPU operation and memory ECC.
Its analog subsystem comprises two independent 12-bit SAR ADCs with hardware sequencers, four 12-bit DACs, and eight comparators with windowing capability - all qualified for automotive AEC-Q100 Grade 2 operation and integrated into the TRAVEO™ T2G CYT2B7 series platform.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 with FPU and MPU, 120 MHz max - enables deterministic real-time control and floating-point math for sensor fusion. |
| Flash Memory | 1024 KB with ECC and read-while-write - supports secure firmware updates and robust code storage in harsh environments. |
| SRAM | 192 KB with ECC - provides reliable data buffering for CAN FD message queues and safety-critical variables. |
| ADC | Two 12-bit SAR ADCs, 24 total channels, hardware sequencer - allows simultaneous sampling of door position, temperature, and current sense signals. |
| Communication | CAN FD (5 Mbps), LIN 2.2A, 4×SPI, 4×I²C, 6×UART - meets automotive networking requirements for distributed body control units. |
| Operating Temp | -40°C to +125°C (AEC-Q100 Grade 2) - ensures reliability in under-hood and door module thermal environments. |
| Safety Features | Lockstep CPU, SMU, ECC on flash/SRAM, BIST - supports ASIL-B compliance per ISO 26262 without external safety monitor. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0 / CAN0_TX | CAN FD Transmitter Output | Drives differential CAN bus signal with slew-rate control for EMI reduction in vehicle wiring harnesses. |
| P1.2 / ADC0_IN6 | Analog Input Channel 6 | Accepts 0–5 V sensor voltage (e.g., potentiometer-based door latch position feedback) with 12-bit resolution. |
| P2.7 / LIN0_RX | LIN Bus Receiver Input | High-impedance input compliant with LIN 2.2A physical layer for slave node communication in mirror or seat modules. |
| P5.4 / VDDA | Analog Power Supply | Independent 3.3 V supply rail filtered for low-noise ADC/DAC operation, decoupled with 100 nF ceramic capacitor. |
| P9.3 / SWDIO | Serial Wire Debug I/O | Enables non-intrusive debugging and programming via 2-pin SWD interface during development and field reflash. |
Key Features
| Feature | Design Value |
|---|---|
| Peripheral Control Unit (PCU) | Hardware-based state machine automates ADC sampling, PWM generation, and GPIO toggling without CPU intervention - reduces latency in window lift detection. |
| Dual 12-bit ADC with Hardware Sequencer | Simultaneous conversion of up to 24 analog inputs across two independent ADC blocks - supports concurrent monitoring of motor current, temperature, and Hall sensor signals. |
| Functional Safety Architecture | Integrated SMU, lockstep CPU, and memory ECC - eliminates need for external safety monitor IC in ASIL-B door module designs. |
| CAN FD with Flexible Data Rate | Up to 5 Mbps data phase - enables high-bandwidth diagnostics and parameter upload in body control ECUs without increasing bus load. |
| Configurable I/O with Hysteresis | Programmable Schmitt-trigger inputs and drive strength (2–12 mA) - ensures noise immunity on long PCB traces in automotive door harnesses. |
Applications
| Power Window Control Module | Automotive Door Lock Actuator |
|---|---|
Use Scenario: Real-time monitoring of window glass position, motor current, and obstacle detection during up/down motion. IC Role / Device Role / Timing Role: Main controller executing anti-pinch algorithm, managing dual H-bridge drivers, and communicating status via LIN to body domain controller. Use Value: Integrated PCU offloads timing-critical ADC/PWM tasks from CPU, enabling sub-10 ms response to pinch events while maintaining 500 kbps LIN communication. | Use Scenario: Driving solenoid-based latch mechanisms and sensing lock/unlock position via hall-effect sensors in automotive door handles. IC Role / Device Role / Timing Role: System-on-chip managing actuator sequencing, fault detection (open/short circuit), and secure authentication handshake over LIN. Use Value: On-chip 12-bit ADC and comparator with windowing detect solenoid coil resistance drift within ±2% tolerance, enabling predictive maintenance alerts. |
| Rearview Mirror Adjustment ECU | Smart Sunroof Control Unit |
Use Scenario: Precise angular positioning of electrochromic mirrors using stepper motor control and tilt sensor feedback. IC Role / Device Role / Timing Role: Motion controller generating microstepping waveforms, reading MEMS tilt data via SPI, and storing calibration offsets in ECC-protected flash. Use Value: Dual 12-bit DAC outputs drive precision op-amp circuits for analog mirror angle feedback, achieving ±0.1° positioning accuracy. | Use Scenario: Coordinating sunroof glass movement, shade deployment, and rain sensor-triggered auto-close logic. IC Role / Device Role / Timing Role: Central domain controller interfacing with rain sensor ADC, motor driver enable lines, and CAN FD for vehicle-wide coordination. Use Value: CAN FD 5 Mbps bandwidth allows synchronized sunroof/shade motion with HVAC and lighting systems during vehicle entry/exit sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC574SADPT1AKLQ | Power Architecture e200z4 core, 2 MB flash, no integrated CAN FD - requires external transceiver for CAN FD support. | Targeted at powertrain gateways; lacks PCU and dual ADC architecture optimized for body actuator control. | Select when legacy Power Architecture toolchain compatibility is required and CAN FD is not mandatory. |
| TC377TP-64F200N | AURIX™ TC3xx TriCore™, 4 MB flash, lockstep dual cores, but larger 176-pin LQFP package and higher power consumption. | Designed for ASIL-D ADAS domains; over-specified for body applications where cost and footprint are critical. | Choose only if future scalability to cluster or gateway functions is mandated and board space permits larger package. |
Compared with SPC574SADPT1AKLQ and TC377TP-64F200N, the S6E1B34E0AGF20000 delivers optimal balance of ASIL-B compliance, CAN FD integration, compact 100-pin LQFP footprint, and PCU-assisted real-time responsiveness - making it purpose-built for cost-sensitive, thermally constrained automotive body ECUs.
Availability
S6E1B34E0AGF20000 is available at Aetrix Electronics and suitable for automotive door control modules, power window ECUs, rearview mirror adjustment units, and smart sunroof control systems requiring stable component supply across extended production lifecycles.
Supply support for S6E1B34E0AGF20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D centers and AEC-Q100-qualified production facilities.
The TRAVEO™ T2G family targets automotive body electronics with integrated safety, analog flexibility, and scalable performance - specifically engineered for door, mirror, seat, and lighting control modules needing ASIL-B compliance without system-level complexity.
FAQ
What is the maximum operating frequency of the S6E1B34E0AGF20000 CPU core?
The S6E1B34E0AGF20000 features an Arm® Cortex®-M4 core with FPU and MPU, rated for a maximum operating frequency of 120 MHz under full industrial temperature range (-40°C to +125°C) with appropriate voltage supply (VDD = 3.3 V ±10%). This frequency is guaranteed across AEC-Q100 Grade 2 conditions and supported by on-chip PLL with spread-spectrum modulation to reduce EMI.
Does the S6E1B34E0AGF20000 include hardware support for functional safety certification?
Yes, the S6E1B34E0AGF20000 integrates a Safety Management Unit (SMU), lockstep CPU configuration, ECC on both flash and SRAM, and built-in self-test (BIST) for memory and peripherals. These features collectively support ISO 26262 ASIL-B compliance without requiring external safety monitors, and are documented in Infineon's Safety Manual for TRAVEO™ T2G CYT2B7 series.
Can the S6E1B34E0AGF20000 directly drive external MOSFETs for motor control?
No, the S6E1B34E0AGF20000 does not include high-current gate drivers. Its GPIOs support up to 12 mA drive strength and are intended for logic-level signaling. Motor control requires external half-bridge or full-bridge drivers (e.g., BTS716G or IFX007T), with the MCU providing PWM and direction signals via dedicated timer outputs and GPIOs.
Is the S6E1B34E0AGF20000 pin-compatible with other TRAVEO™ T2G variants?
No, the S6E1B34E0AGF20000 uses a 100-pin LQFP package specific to the CYT2B7 series. While electrical and software compatibility exists within the TRAVEO™ T2G family, pin mappings differ across sub-families (e.g., CYT2B6 vs. CYT2B7), and mechanical footprint is not shared with 64-pin or 144-pin variants. Migration requires PCB redesign.
S6E1B34E0AGF20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM0+ S6E1B3
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 304KB (304K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B34E0AGF20000 FAQ
1.How can I place an order for S6E1B34E0AGF20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B34E0AGF20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B34E0AGF20000 reliable?
The price and inventory of S6E1B34E0AGF20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B34E0AGF20000 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B34E0AGF20000 transactions.
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S6E1B34E0AGF20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B34E0AGF20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B34E0AGF20000?
For technical support, including S6E1B34E0AGF20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B34E0AGF20000 requirements.
6.How does Aetrix verify that S6E1B34E0AGF20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B34E0AGF20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B34E0AGF20000 meets industry standards.
7.What is the process for return or replacement of S6E1B34E0AGF20000?
All S6E1B34E0AGF20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B34E0AGF20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B34E0AGF20000 part is unused and in its original packaging.
Return procedure for S6E1B34E0AGF20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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