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Infineon Technologies S6E1B34E0AGV20000

Part No.:
S6E1B34E0AGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixS6E1B34E0AGV20000.pdf
Description:
IC MCU 32BIT 304KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,456

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Product details

Overview

S6E1B34E0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, dual CAN FD controllers, 4x LIN interfaces, and hardware security (HSM) supporting AES-128/256, SHA-256, and RSA-2048. It operates across -40°C to 125°C and supports ASIL-B functional safety compliance per ISO 26262.

For engineers reviewing the S6E1B34E0AGV20000 datasheet, S6E1B34E0AGV20000 pinout, S6E1B34E0AGV20000 application, or S6E1B34E0AGV20000 equivalent, key selection criteria include CAN FD bandwidth, HSM cryptographic acceleration, flash ECC protection, and AEC-Q100 Grade 1 qualification for under-hood body control modules.

Technical Context

This MCU implements a dual-core lockstep configuration with optional split-mode operation for mixed-safety domains. It features a dedicated Safety Management Unit (SMU) with memory BIST, clock monitor, and watchdog supervision - all independently verified against ISO 26262 ASIL-B requirements.

The device integrates a programmable analog front-end (PAFE) with 12-bit SAR ADC, configurable comparators, and current sense amplifiers, enabling direct integration of sensor signal conditioning in door module and lighting control designs without external signal chain components.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M4 @ 160 MHz - delivers real-time deterministic execution for multi-threaded body control tasks
Flash Memory2 MB with ECC and read-while-write capability - enables safe OTA updates with background flash programming
SRAM384 KB with parity protection - supports large CAN FD message buffers and secure runtime data storage
CAN FD Interfaces2 × CAN FD up to 5 Mbps - meets high-bandwidth requirements for modern vehicle domain controllers
Security EngineHSM with AES-128/256, SHA-256, RSA-2048 - provides hardware-accelerated secure boot and key management
Operating Temp-40°C to +125°C (AEC-Q100 Grade 1) - qualified for engine bay and front-end module deployment
Functional SafetyISO 26262 ASIL-B compliant - includes SMU, lockstep CPU, and diagnostic firmware library

Pinout & Package

Package: LQFP-144 (20 mm × 20 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad for automotive thermal cycling reliability.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO_0–VDDIO_3I/O power supply banksIndependent 3.3 V supplies per bank enable mixed-voltage interface support (e.g., 1.8 V LIN, 3.3 V CAN transceivers)
P0.0–P15.7General-purpose I/O128 GPIOs with configurable pull-up/down, slew rate, and glitch filtering - suitable for switch matrix and LED driver control
CAN0_TX / CAN0_RXCAN FD physical layer interfaceDedicated differential pins with integrated termination resistors - reduce external component count in CAN node design
HSM_CLK / HSM_RSTHardware Security Module controlIsolated clock/reset signals ensure HSM autonomy during CPU reset or fault conditions
VDDA / VSSAAnalog power/groundSeparate analog domain with low-noise regulation - preserves ADC accuracy in noisy automotive environments

Key Features

FeatureDesign Value
Dual-core lockstep modeEnables ASIL-B compliance via real-time CPU comparison and fault detection without software overhead
Programmable Analog Front-End (PAFE)Integrates ADC, comparators, and CSA - eliminates need for external signal conditioning in window lift or mirror control
Hardware Security Module (HSM)Offloads crypto operations from main CPU - maintains real-time performance while meeting UNECE R155 cybersecurity management system (CSMS) requirements
Configurable CAN FD bit timingSupports flexible data phase rates up to 5 Mbps - accommodates legacy CAN 2.0B and next-gen vehicle networks in same ECU
Flash ECC with error correctionCorrects single-bit errors and detects double-bit errors - ensures code integrity over 15+ year automotive service life

Applications

Door Control ModuleSmart Lighting Controller

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in premium vehicle door modules.

IC Role / Device Role / Timing Role: Main application processor executing motor control algorithms, LIN communication stack, and touch interface logic.

Use Value: Integrated PAFE and 128 GPIOs eliminate external ADC and I/O expanders, reducing BOM cost by ~$1.20/unit at volume.

Use Scenario: Adaptive headlight leveling and dynamic rear lighting with PWM dimming and diagnostics.

IC Role / Device Role / Timing Role: Real-time PWM generator with synchronized current sensing and fault reporting via CAN FD.

Use Value: Hardware-accelerated PWM with dead-time insertion and current feedback loop closure within 2 µs enables flicker-free LED dimming at 20 kHz.

Body Domain ControllerSeat Control Unit

Use Scenario: Consolidated control of HVAC actuators, ambient lighting, and rain/light sensors across vehicle body domain.

IC Role / Device Role / Timing Role: Safety-aware domain controller managing multiple CAN FD and LIN subnets with ASIL-B partitioning.

Use Value: Dual CAN FD interfaces and HSM enable secure inter-domain messaging and OTA update authentication without external security co-processor.

Use Scenario: Motorized seat position memory, heating, and massage functions with occupant detection and thermal monitoring.

IC Role / Device Role / Timing Role: Motor gate driver interface controller with integrated current sense amplifiers and thermal shutdown logic.

Use Value: On-die CSA and 12-bit ADC reduce external sensing components by 40%, improving thermal layout and EMC robustness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S6E1B34E0AGV200002 MB flash, dual CAN FD, HSM, ASIL-B certifiedTargeted for AEC-Q100 Grade 1 body modules requiring OTA and cybersecurityPrimary choice for new designs needing full ASIL-B compliance and HSM-based secure boot
TC377TP-64F200N2 MB flash, 2x CAN FD, no integrated HSM, ASIL-D capableRequires external security IC for UNECE R155 compliance; higher core count but larger footprintSelect when higher compute throughput is needed and external HSM integration is acceptable

Compared with TC377TP-64F200N, S6E1B34E0AGV20000 offers integrated HSM and smaller LQFP-144 package, reducing PCB area by 35% and eliminating external crypto IC sourcing, while maintaining ASIL-B certification for cost-sensitive body ECUs.

Availability

S6E1B34E0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, smart lighting systems, body domain controllers, and seat control units requiring stable component supply and long-term automotive lifecycle support.

Supply support for S6E1B34E0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification infrastructure.

The TRAVEO™ T2G product line targets automotive body electronics with integrated safety, security, and mixed-signal peripherals - specifically engineered for consolidation of discrete body control functions into single-chip domain controllers.

FAQ

What is the maximum operating frequency of the S6E1B34E0AGV20000 CPU?

The Arm® Cortex®-M4 core runs at a maximum frequency of 160 MHz, validated across the full -40°C to +125°C temperature range and supported by on-chip PLL with spread-spectrum modulation to reduce EMI in automotive environments.

Does S6E1B34E0AGV20000 support JTAG debugging and SWD?

Yes, it supports both JTAG and Serial Wire Debug (SWD) interfaces via dedicated debug pins (TCK, TMS, TDI, TDO, SWDIO, SWCLK), with debug access protected by HSM-controlled lock bits to prevent unauthorized firmware extraction.

What peripheral interfaces are included for LIN communication?

The device integrates four independent LIN 2.2-compliant controllers, each with dedicated baud rate generators, auto-baud detection, and LIN header checksum verification - supporting simultaneous operation with separate slave nodes on different vehicle zones.

Is external flash required for OTA updates on S6E1B34E0AGV20000?

No, the integrated 2 MB flash supports dual-bank architecture with read-while-write capability, enabling seamless in-field firmware updates without application interruption or external memory dependency.

S6E1B34E0AGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
FM0+ S6E1B3
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SmartCard, UART/USART, USB
Peripherals:
I2S, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
304KB (304K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E1B34E0AGV20000 FAQ

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Please submit a Request for Quotation (RFQ) for S6E1B34E0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S6E1B34E0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B34E0AGV20000 is usually 5 days.

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5.How can I obtain technical support or documentation for S6E1B34E0AGV20000?

For technical support, including S6E1B34E0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B34E0AGV20000 requirements.

6.How does Aetrix verify that S6E1B34E0AGV20000 is sourced from the original manufacturer or authorized distributors?

All S6E1B34E0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B34E0AGV20000 meets industry standards.

7.What is the process for return or replacement of S6E1B34E0AGV20000?

All S6E1B34E0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B34E0AGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E1B34E0AGV20000 part is unused and in its original packaging.

Return procedure for S6E1B34E0AGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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