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Infineon Technologies S6E1B34F0AGV20000
- Part No.:
- S6E1B34F0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S6E1B34F0AGV20000.pdf
- Description:
- IC MCU 32BIT 304KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,892
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Product details
Overview
S6E1B34F0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash memory, 384 KB SRAM, and supports CAN FD, LIN, and Ethernet AVB interfaces. The device operates at up to 160 MHz, includes hardware security (HSM), and targets door control modules requiring functional safety compliance.
For engineers reviewing the S6E1B34F0AGV20000 datasheet, S6E1B34F0AGV20000 pinout, S6E1B34F0AGV20000 application, or S6E1B34F0AGV20000 equivalent, key selection criteria include ASIL-B capability, integrated HSM with AES-128/SHA-256, dual-core lockstep support, and automotive-grade temperature range (–40°C to +125°C).
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4 configuration with lockstep operation for ASIL-B compliance. It integrates a dedicated Hardware Security Module (HSM) supporting secure boot, key management, and cryptographic acceleration (AES-128, SHA-256, RSA-2048).
The device features a multi-layer AHB/APB bus matrix, configurable GPIOs with programmable pull-up/down, and peripheral sets including 4x CAN FD controllers, 2x Ethernet AVB MACs, and 3x LIN transceivers - all qualified per AEC-Q100 Grade 2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm® Cortex®-M4 @ up to 160 MHz with lockstep for ASIL-B |
| Flash Memory | 2 MB embedded flash with ECC and read-while-write capability |
| SRAM | 384 KB on-chip SRAM with parity/ECC protection |
| Security | HSM with AES-128, SHA-256, RSA-2048, secure boot, and key provisioning |
| Automotive Qualification | AEC-Q100 Grade 2 (–40°C to +125°C ambient) |
| Communication Interfaces | 4× CAN FD, 2× Ethernet AVB MAC, 3× LIN, 4× SPI, 4× I²C, 4× UART |
| Functional Safety | ISO 26262 ASIL-B compliant with diagnostic coverage ≥90% |
Pinout & Package
Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_3P3 | Analog supply (3.3 V) | Provides regulated power to ADC, DAC, and analog comparators |
| VSSA | Analog ground | Separate ground return for analog subsystems to minimize noise coupling |
| ETH_RXD0/ETH_TXD0 | Ethernet AVB data lane | Dedicated differential pair for 100BASE-TX receive/transmit in AVB mode |
| CANFD0_TX/CANFD0_RX | CAN FD transceiver interface | Direct connection to external CAN FD transceiver (e.g., TJA1044) |
| HSM_VDD/HSM_VSS | HSM power/ground | Isolated power domain for Hardware Security Module to prevent side-channel leakage |
| BOOT0 | Boot mode select | Pulled high during reset to enable boot from system memory (ROM bootloader) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Enables real-time fault detection and ASIL-B compliance without external watchdog supervision |
| Integrated HSM with crypto accelerators | Offloads secure boot, OTA update verification, and key derivation from main CPU cores |
| Configurable GPIO with glitch filtering | Supports robust switch debouncing and ESD transient suppression in door module inputs |
| Multi-channel DMA with scatter-gather support | Enables zero-CPU-overhead data movement between CAN FD, Ethernet, and memory for gateway applications |
| Temperature sensor with calibration | On-die sensor calibrated across –40°C to +125°C for thermal monitoring in sealed ECUs |
Applications
| Door Control Module | Body Control Module (BCM) |
|---|---|
Use Scenario: Centralized control of power windows, mirrors, locks, and interior lighting in premium vehicles. IC Role / Device Role / Timing Role: Primary application MCU managing LIN slaves, CAN FD communication with gateway, and real-time motor control via PWM timers. Use Value: Dual-core lockstep ensures fail-safe window anti-pinch logic while HSM secures over-the-air firmware updates. | Use Scenario: Integration hub for lighting, HVAC, wiper, and seat position control in mid-to-high-tier vehicles. IC Role / Device Role / Timing Role: Real-time scheduler coordinating multiple CAN FD buses, Ethernet AVB for camera feeds, and LIN for low-cost sensors. Use Value: 2 MB flash enables storage of multiple regional lighting profiles and diagnostic logs without external memory. |
| Rear Seat Entertainment Gateway | Smart Mirror Control Unit |
Use Scenario: Aggregation and routing of video/audio streams from headrest displays, USB media, and Bluetooth sources. IC Role / Device Role / Timing Role: Ethernet AVB endpoint handling time-synchronized audio streaming and CAN FD for vehicle status reporting. Use Value: Hardware timestamping and AVB traffic shaping ensure lip-sync accuracy across distributed displays. | Use Scenario: Digital rearview mirror with auto-dimming, blind-spot detection overlay, and gesture interface. IC Role / Device Role / Timing Role: Sensor fusion processor combining camera input, ambient light, and CAN bus vehicle speed for adaptive dimming. Use Value: Integrated ADCs and comparators enable direct analog sensor interfacing without external signal conditioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 @ 320 MHz; no integrated Ethernet MAC; uses external PHY | Lacks native Ethernet AVB support; requires additional PHY and magnetics for AVB networking | Select when higher single-thread performance is prioritized over integrated AVB and lower BOM count |
| Renesas RH850/U2A | 32-bit RH850 core; 1.5 MB flash; no HSM; relies on external security chip for ISO 21434 compliance | Requires external secure element for OTA signing; lacks hardware-accelerated crypto engines | Select for legacy toolchain continuity where existing RH850 software investment exists |
Compared with S32K344 and RH850/U2A, the S6E1B34F0AGV20000 provides integrated Ethernet AVB MACs and an on-die HSM-reducing component count and simplifying ISO 21434-compliant secure boot implementation without external security ICs.
Availability
S6E1B34F0AGV20000 is available at Aetrix Electronics and suitable for door control modules, body control units, rear-seat entertainment gateways, and smart mirror control units requiring stable component supply and automotive qualification.
Supply support for S6E1B34F0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line targets automotive body electronics with integrated functional safety, security, and high-speed connectivity-designed specifically for centralized domain controllers replacing legacy discrete ECUs.
FAQ
What is the maximum operating frequency of the S6E1B34F0AGV20000?
The S6E1B34F0AGV20000 operates at up to 160 MHz across its full temperature range (–40°C to +125°C). This frequency is guaranteed under worst-case voltage (3.0 V) and temperature conditions, with dynamic voltage scaling enabled via internal regulators to maintain timing margins.
Does the S6E1B34F0AGV20000 support JTAG debugging?
Yes, it supports SWD (Serial Wire Debug) and JTAG interfaces via dedicated pins (TCK, TMS, TDI, TDO, nTRST). Debug access is configurable through the HSM to restrict unauthorized firmware inspection, and debug authentication keys are stored in protected HSM memory.
How is functional safety achieved in this MCU?
Functional safety is implemented via dual-core lockstep execution with continuous comparison logic, ECC on flash/SRAM, built-in self-test (BIST) for memories and peripherals, and ASIL-B-certified safety manual covering diagnostic coverage, failure modes, and safe states per ISO 26262 Part 5.
Can the Ethernet AVB interface operate without external PHY?
No-the S6E1B34F0AGV20000 contains only the Ethernet AVB Media Access Controller (MAC); an external PHY (e.g., Infineon TDK-ETH-100BASE-T1) is required for physical layer signaling, magnetics, and MII/RMII interface bridging.
S6E1B34F0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM0+ S6E1B3
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 304KB (304K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 23x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B34F0AGV20000 FAQ
1.How can I place an order for S6E1B34F0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B34F0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B34F0AGV20000 reliable?
The price and inventory of S6E1B34F0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B34F0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E1B34F0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B34F0AGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E1B34F0AGV20000?
S6E1B34F0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B34F0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B34F0AGV20000?
For technical support, including S6E1B34F0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B34F0AGV20000 requirements.
6.How does Aetrix verify that S6E1B34F0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B34F0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B34F0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E1B34F0AGV20000?
All S6E1B34F0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B34F0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B34F0AGV20000 part is unused and in its original packaging.
Return procedure for S6E1B34F0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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