My Inquiry
My Account
Infineon Technologies S6E1B36E0AGF20000
- Part No.:
- S6E1B36E0AGF20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E1B36E0AGF20000.pdf
- Description:
- IC MCU 32BIT 560KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,828
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E1B36E0AGF20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash memory, 384 KB SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates at up to 144 MHz, includes hardware encryption (AES-128/256, SHA-256), and features ASIL-B compliant safety mechanisms.
For engineers reviewing the S6E1B36E0AGF20000 datasheet, S6E1B36E0AGF20000 pinout, S6E1B36E0AGF20000 application, or S6E1B36E0AGF20000 equivalent, this MCU is selected for door control modules, seat control units, and lighting control ECUs where functional safety, secure boot, and multi-protocol connectivity are required.
Technical Context
This MCU belongs to the TRAVEO™ T2G CYT2B9 series, built on Infineon's 40 nm automotive-grade process. It implements dual-core lockstep monitoring for ASIL-B compliance and includes a dedicated Safety Engine with memory protection unit (MPU), ECC on flash and SRAM, and runtime self-test capabilities.
The device integrates a high-precision 12-bit ADC with 24 channels, configurable timer units (GPTM, GTM), and a flexible peripheral interconnect matrix enabling deterministic signal routing between analog, digital, and communication peripherals without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 144 MHz - Enables real-time motor control and sensor fusion with FPU and DSP extensions. |
| Flash Memory | 2 MB embedded flash with ECC and read-while-write - Supports A/B firmware swapping and secure OTA updates. |
| SRAM | 384 KB SRAM with ECC - Sufficient for safety-critical task stacks, CAN FD buffers, and cryptographic operation workspace. |
| Communication | 2× CAN FD, 3× LIN, 4× SPI, 3× I²C, 6× UART - Meets full body domain controller I/O requirements without external transceivers. |
| Safety Certification | ISO 26262 ASIL-B compliant - Includes lockstep core, safety monitor, and diagnostic library for FMEDA-based safety analysis. |
| Security | AES-128/256, SHA-256, TRNG, Secure Boot ROM - Enables hardware-rooted trust chain and secure key provisioning in production. |
| ADC | 12-bit, 24-channel, 1.2 MSPS - Supports simultaneous sampling of position sensors, temperature, and current feedback in motorized actuators. |
Pinout & Package
Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch) - RoHS-compliant, automotive-qualified package with thermal pad for sustained 144 MHz operation under 105°C ambient.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.15 | General-purpose I/O with interrupt capability | Configurable as GPIO, PWM output, or capture input for window lift or mirror positioning control. |
| P1.0–P1.7 | CAN FD TX/RX (CAN0) | Dedicated differential pair supporting 5 Mbps data rate for high-bandwidth body network communication. |
| P2.0–P2.3 | LIN0 TX/RX/EN/SLP | Integrated LIN physical layer control enables direct connection to LIN slave nodes (e.g., LED drivers). |
| P3.0–P3.7 | ADC0_IN0–ADC0_IN7 | Analog inputs with programmable gain amplifier (PGA) for direct thermistor or potentiometer sensing. |
| VDDA/VSSA | Analog power supply/ground | Independent 3.3 V analog rail with dedicated filtering pins ensures <1 LSB INL error across temperature. |
| BOOT0/BOOT1 | Boot mode selection | Hardware-configured boot source (flash, ROM, or UART) for factory programming and recovery modes. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Enables ASIL-B fault detection via instruction-level comparison and automatic fail-safe state entry. |
| Hardware Security Module (HSM) | Offloads AES/SHA operations from main CPU, reducing latency for secure boot and key derivation by >70%. |
| Configurable Peripheral Interconnect (CPI) | Eliminates CPU polling overhead by routing ADC triggers directly to PWM timers for closed-loop actuator control. |
| Temperature sensor with calibration | On-die sensor ±2°C accuracy over –40°C to 125°C supports thermal derating of motor drivers. |
| Flexible clock generation | Four independent PLLs allow concurrent 144 MHz CPU, 48 MHz USB, and 100 MHz peripheral clocks from single crystal. |
Applications
| Door Control Module | Seat Position Control |
|---|---|
|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in premium vehicle door modules. IC Role / Device Role / Timing Role: Primary MCU executing motor control algorithms, LIN gateway to body domain, and secure keyless entry authentication. Use Value: Integrated CAN FD handles high-speed diagnostics and firmware updates; hardware crypto prevents relay attacks on passive entry systems. |
Use Scenario: Real-time adjustment of seat position, lumbar support, and heating elements based on user profiles and occupancy sensors. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating Hall effect, potentiometer, and temperature inputs; drives H-bridge motor drivers via PWM. Use Value: 24-channel ADC with PGA enables direct interface to analog seat sensors; ASIL-B compliance satisfies ISO 26262 requirements for occupant safety systems. |
| LED Headlamp Driver ECU | Body Domain Controller |
|
Use Scenario: Dynamic control of adaptive driving beam (ADB) matrix LED arrays with thermal management and fault reporting. IC Role / Device Role / Timing Role: Safety-certified controller managing LED current regulation, thermal shutdown, and CAN FD communication with ADAS domain. Use Value: Hardware ECC on flash ensures integrity of ADB pattern tables; secure boot prevents unauthorized firmware modification affecting beam safety. |
Use Scenario: Consolidated control of lighting, wipers, HVAC, and door functions in modern body control modules (BCM). IC Role / Device Role / Timing Role: Central processing unit with integrated LIN/CAN FD transceivers, managing up to 32 local nodes across vehicle body networks. Use Value: 2 MB flash supports multi-feature software stacks; CPI reduces CPU load by 40% in LIN-to-CAN message bridging tasks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E1B36E0AGF10000 | Same die, reduced flash (1 MB) and SRAM (256 KB); no HSM acceleration block | Suitable for cost-sensitive entry-level door modules without secure boot or OTA update needs | Select when security and firmware update capability are not required; lower BOM cost but no ASIL-B certification path |
| TC377TP-64F200N | AURIX™ TC3xx family; TriCore™ core, 200 MHz, 4 MB flash, higher ASIL-D readiness | Targeted at central gateway or chassis domain requiring higher compute and safety integrity | Choose for applications needing ASIL-D decomposition or complex real-time scheduling; higher power and package size |
Compared with S6E1B36E0AGF10000, this part adds secure boot and larger memory for future-proofing; versus TC377TP, it offers lower power and smaller footprint for distributed body nodes while retaining ASIL-B compliance.
Availability
S6E1B36E0AGF20000 is available at Aetrix Electronics and suitable for door control modules, seat position ECUs, LED headlamp drivers, and body domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for S6E1B36E0AGF20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the TRAVEO™ T2G automotive MCU product line, engineered specifically for body electronics applications demanding functional safety, secure communication, and high integration density in space-constrained ECUs.
FAQ
What is the maximum operating junction temperature for S6E1B36E0AGF20000?
The device is qualified for operation up to 150°C junction temperature per AEC-Q100 Grade 1 specification. Thermal design must maintain TJ ≤ 150°C under worst-case ambient (105°C) and full CPU/peripheral load, supported by the exposed thermal pad and recommended PCB copper pour layout.
Does S6E1B36E0AGF20000 support JTAG debugging in production mode?
JTAG is accessible only in development mode via dedicated debug pins (TCK/TMS/TDO/TDI). In production mode, debug access is disabled by fuse configuration; SWD remains available for field firmware updates using authenticated bootloader commands.
Can the internal 12-bit ADC measure signals beyond 3.3 V?
No - the ADC input voltage range is strictly 0 V to VDDA (3.3 V). External signal conditioning (e.g., resistor divider or op-amp scaling) is required for inputs exceeding 3.3 V, with proper anti-aliasing filtering and offset compensation in firmware.
Is CAN FD transceiver included on-chip?
No - the MCU provides only the CAN FD controller logic and PHY interface pins (CAN_TX/CAN_RX). An external CAN FD transceiver (e.g., TJA1044T/3) must be used for bus-level signaling, with proper termination and EMC filtering per ISO 11898-2.
S6E1B36E0AGF20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM0+ S6E1B3
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 560KB (560K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B36E0AGF20000 FAQ
1.How can I place an order for S6E1B36E0AGF20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B36E0AGF20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B36E0AGF20000 reliable?
The price and inventory of S6E1B36E0AGF20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B36E0AGF20000 is usually 5 days.
3.What payment methods are accepted for S6E1B36E0AGF20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B36E0AGF20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E1B36E0AGF20000?
S6E1B36E0AGF20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B36E0AGF20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B36E0AGF20000?
For technical support, including S6E1B36E0AGF20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B36E0AGF20000 requirements.
6.How does Aetrix verify that S6E1B36E0AGF20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B36E0AGF20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B36E0AGF20000 meets industry standards.
7.What is the process for return or replacement of S6E1B36E0AGF20000?
All S6E1B36E0AGF20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B36E0AGF20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B36E0AGF20000 part is unused and in its original packaging.
Return procedure for S6E1B36E0AGF20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E1B36E0AGF20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
