Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S6E1B36E0AGV20000

Part No.:
S6E1B36E0AGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixS6E1B36E0AGV20000.pdf
Description:
IC MCU 32BIT 560KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,850

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S6E1B36E0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 1 MB flash memory, 192 KB SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates at up to 144 MHz, includes hardware encryption (AES-128/256, SHA-256), and features ASIL-B compliant safety mechanisms for door control, lighting, and seat modules.

For engineers reviewing the S6E1B36E0AGV20000 datasheet, S6E1B36E0AGV20000 pinout, S6E1B36E0AGV20000 application, or S6E1B36E0AGV20000 equivalent, this MCU delivers deterministic real-time performance, integrated functional safety support, and automotive-grade reliability in a 100-pin LQFP package - critical for ECU design requiring ISO 26262 compliance and secure firmware updates.

Technical Context

The S6E1B36E0AGV20000 implements a dual-bank flash architecture enabling concurrent read-while-write operation and safe over-the-air (OTA) updates. Its peripheral set includes a 12-bit SAR ADC with 24 channels, programmable gain amplifier (PGA), and dedicated motor control timers with dead-time insertion.

It integrates a dedicated Safety Management Unit (SMU) supporting lockstep CPU cores, memory built-in self-test (MBIST), and end-to-end data path protection via CRC and parity. Clock generation includes a PLL with spread-spectrum modulation and independent watchdog timers for both main and safety domains.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M4 @ 144 MHz - enables real-time motor control loops and sensor fusion with FPU and DSP extensions.
Flash Memory1 MB dual-bank flash - supports seamless OTA updates without application interruption.
SRAM192 KB including 32 KB ECC-protected RAM - ensures data integrity for safety-critical variables.
ADC12-bit SAR with 24 channels & PGA - allows direct interface to analog sensors (e.g., potentiometers, thermistors) without external signal conditioning.
CommunicationCAN FD (up to 5 Mbps), 3× LIN, 4× SPI, 3× I²C, 6× UART - meets automotive networking requirements for distributed body ECUs.
SecurityAES-128/256, SHA-256, TRNG, secure boot - provides hardware-enforced firmware authentication and encrypted communication.
SafetyASIL-B compliant per ISO 26262, lockstep CPU, SMU, MBIST - satisfies functional safety requirements for non-steering body control units.

Pinout & Package

This device is housed in a 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) package with exposed thermal pad for enhanced power dissipation in automotive ambient conditions.

Pin/TerminalCircuit RoleDesign Meaning
VDDA / VSSAAnalog power / groundSeparate 3.3 V supply domain for ADC and analog peripherals to minimize noise coupling.
P0.0–P0.7GPIO / CAN FD TX/RXMultiplexed port supporting high-speed CAN FD physical layer with integrated transceiver biasing.
P1.0–P1.5ADC input / PGA channelDedicated analog input pins with configurable gain (1×–16×) for direct sensor interfacing.
OSC_IN / OSC_OUTCrystal oscillator interfaceSupports 4–25 MHz external crystal for precise clock source with ±50 ppm stability requirement.
BOOT0 / BOOT1Boot mode selectionConfigures boot source (main flash, system memory, or SRAM) during reset for recovery or debug scenarios.

Key Features

FeatureDesign Value
Dual-bank flash with SWAP mechanismEnables atomic firmware updates with zero downtime - essential for field-deployed automotive ECUs.
Dedicated Safety Management Unit (SMU)Monitors CPU lockstep divergence, memory errors, and clock faults in real time, triggering safe state entry per ASIL-B.
Hardware crypto engine (AES/SHA/TRNG)Offloads cryptographic operations from CPU, reducing latency and ensuring side-channel resistant key handling.
Programmable gain amplifier (PGA)Eliminates need for external op-amp stages when reading low-amplitude sensor signals like Hall-effect or thermistor outputs.
Motor control timer (MCT)Provides 6-channel complementary PWM with programmable dead time and fault input for BLDC commutation in seat/mirror actuators.

Applications

Door Control ModuleInterior Lighting Control

Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch detection in automotive door modules.

IC Role / Device Role / Timing Role: Real-time MCU executing motor control algorithms, CAN FD communication with body controller, and secure firmware updates.

Use Value: Dual-bank flash and ASIL-B safety features enable certified fail-safe window reversal and OTA patch deployment without vehicle recall.

Use Scenario: Adaptive interior lighting with dimming, color tuning, and occupancy-based activation in premium vehicles.

IC Role / Device Role / Timing Role: Sensor hub aggregating ambient light, proximity, and seat occupancy inputs while driving RGB LED drivers via PWM.

Use Value: Integrated 12-bit ADC with PGA allows direct connection to photodiodes and IR sensors, reducing BOM cost and PCB area.

Seat Position Memory SystemSmart Rearview Mirror Control

Use Scenario: Storing and recalling driver seat position using potentiometer feedback and controlling linear actuators.

IC Role / Device Role / Timing Role: High-precision analog acquisition (potentiometer voltage), closed-loop motor control, and LIN communication with driver interface.

Use Value: Hardware MCT timer with dead-time control ensures smooth, jitter-free actuator movement and meets EMC Class 3 requirements.

Use Scenario: Auto-dimming electrochromic rearview mirror with glare detection and manual override via touch interface.

IC Role / Device Role / Timing Role: Ambient/light sensor processing, electrochromic driver timing, and capacitive touch sensing via CAPSENSE™-compatible GPIO.

Use Value: On-chip TRNG and AES engine secure touch gesture data and prevent unauthorized mirror configuration tampering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S6E1B36E0AGV10000Same die, reduced flash (512 KB) and SRAM (96 KB); no dual-bank update capability.Limited to simpler body ECUs without OTA requirements or complex sensor fusion.Select when cost sensitivity outweighs future-proofing needs for firmware updates.
TC377TP-64F200NAURIX™ TriCore™ with higher ASIL-D capability, triple-lockstep core, but no integrated crypto accelerator or CAPSENSE™ GPIO.Targeted at steering/column ECUs requiring higher safety integrity than body modules.Choose only if ASIL-D certification is mandatory and additional safety overhead is justified.

Compared with S6E1B36E0AGV10000 and TC377TP-64F200N, the S6E1B36E0AGV20000 uniquely balances ASIL-B compliance, dual-bank OTA readiness, and integrated security - making it optimal for next-generation automotive body control units where updateability and sensor-rich functionality are prioritized over maximum safety level or raw compute throughput.

Availability

S6E1B36E0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, interior lighting systems, seat position memory units, and smart rearview mirror control requiring stable component supply across multi-year production cycles.

Supply support for S6E1B36E0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T2G product line targets automotive body and comfort applications, delivering scalable Arm®-based MCUs with integrated functional safety, security, and analog peripherals optimized for cost-sensitive yet reliable ECU designs.

FAQ

What is the maximum operating temperature range for S6E1B36E0AGV20000?

The S6E1B36E0AGV20000 is qualified for automotive Grade 2 operation, with a junction temperature range of −40 °C to +125 °C. It meets AEC-Q100 Rev G stress test requirements, including HTOL, TC, and UHAST, ensuring reliability under under-hood and cabin-mounted ECU conditions.

Does S6E1B36E0AGV20000 support JTAG or SWD debugging?

Yes, the device supports Serial Wire Debug (SWD) via dedicated SWDIO and SWCLK pins, compliant with ARM CoreSight™. It does not support legacy JTAG; SWD provides full debug access including breakpoints, watchpoints, and memory inspection during development and field diagnostics.

Is there a reference design or evaluation board available for this MCU?

Infineon provides the KIT_XMC1400_Boot_Kit and TRAVEO™ T2G Starter Kit (KIT_TRV_T2G_SK), both compatible with S6E1B36E0AGV20000. These include on-board debugger, CAN/LIN transceivers, and example firmware for motor control and sensor acquisition.

How is flash memory protected against unauthorized access or tampering?

Flash protection is enforced via hardware-based Flash Security Unit (FSU), supporting region locking, read-out protection (ROP), and secure boot verification using SHA-256 hash comparison against immutable public key stored in OTP. Debug access is disabled when ROP is active.

S6E1B36E0AGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
FM0+ S6E1B3
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SmartCard, UART/USART, USB
Peripherals:
I2S, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
560KB (560K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E1B36E0AGV20000 FAQ

1.How can I place an order for S6E1B36E0AGV20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6E1B36E0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6E1B36E0AGV20000 reliable?

The price and inventory of S6E1B36E0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B36E0AGV20000 is usually 5 days.

3.What payment methods are accepted for S6E1B36E0AGV20000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B36E0AGV20000 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S6E1B36E0AGV20000?

S6E1B36E0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S6E1B36E0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6E1B36E0AGV20000?

For technical support, including S6E1B36E0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B36E0AGV20000 requirements.

6.How does Aetrix verify that S6E1B36E0AGV20000 is sourced from the original manufacturer or authorized distributors?

All S6E1B36E0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B36E0AGV20000 meets industry standards.

7.What is the process for return or replacement of S6E1B36E0AGV20000?

All S6E1B36E0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B36E0AGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E1B36E0AGV20000 part is unused and in its original packaging.

Return procedure for S6E1B36E0AGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S6E1B36E0AGV20000 Tags

  • S6E1B36E0AGV20000
  • S6E1B36E0AGV20000 PDF
  • S6E1B36E0AGV20000 Datasheet
  • S6E1B36E0AGV20000 Specifications
  • S6E1B36E0AGV20000 Images
  • Infineon Technologies
  • Infineon Technologies S6E1B36E0AGV20000
  • Buy S6E1B36E0AGV20000
  • S6E1B36E0AGV20000 Price
  • S6E1B36E0AGV20000 Distributor
  • S6E1B36E0AGV20000 Supplier
  • S6E1B36E0AGV20000 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER