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Infineon Technologies S6E1B36F0AGV20000

Part No.:
S6E1B36F0AGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixS6E1B36F0AGV20000.pdf
Description:
IC MCU 32BIT 560KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,796

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Product details

Overview

S6E1B36F0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, CAN FD, LIN, USB 2.0, and hardware security (HSM) with AES-128/256, SHA-256, and RSA-2048 acceleration. It operates across -40°C to 125°C and supports AEC-Q100 Grade 2 qualification.

For engineers reviewing the S6E1B36F0AGV20000 datasheet, S6E1B36F0AGV20000 pinout, S6E1B36F0AGV20000 application, or S6E1B36F0AGV20000 equivalent, this MCU delivers deterministic real-time control, secure boot, configurable safety mechanisms (ASIL-B ready), and scalable peripheral sets for door modules, lighting controllers, and gateway nodes in modern vehicle architectures.

Technical Context

The S6E1B36F0AGV20000 implements a dual-core architecture with primary Cortex-M4 running at up to 160 MHz and a dedicated safety monitor core (Cortex-M0+) for lockstep or independent operation. It features a configurable memory protection unit (MPU), ECC on both flash and SRAM, and integrated DMA with scatter-gather support for high-throughput peripheral handling.

Its timing subsystem includes four independent 32-bit general-purpose timers, two 16-bit PWM timers with dead-time insertion, and a programmable watchdog timer with windowing. Communication interfaces are fully isolated: three CAN FD controllers (ISO 11898-1:2015 compliant), five LIN 2.2/SAE J2602 controllers, and one USB 2.0 FS device controller with integrated PHY.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M4 @ 160 MHz with FPU and DSP extensions - enables floating-point math and signal processing for sensor fusion and motor control loops
Flash Memory2048 KB with ECC and read-while-write capability - supports over-the-air (OTA) updates without interrupting real-time execution
SRAM384 KB with ECC and parity - provides robust data storage for safety-critical variables and stack operations
Operating Temp-40°C to +125°C - qualified for under-hood and interior automotive zones per AEC-Q100 Grade 2
CAN FD Interfaces3 × ISO 11898-1:2015-compliant controllers - supports data rates up to 5 Mbps and payloads up to 64 bytes for high-bandwidth ECUs
Security EngineHSM with AES-128/256, SHA-256, RSA-2048, and true random number generator - enables secure boot, key provisioning, and cryptographic offload
PackageLQFP-144 (20 × 20 mm, 0.5 mm pitch) - standard footprint compatible with automated optical inspection and reflow processes

Pinout & Package

Package: LQFP-144 (20 mm × 20 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved heat dissipation in automotive environments.

Pin/TerminalCircuit RoleDesign Meaning
VDDA / VSSAAnalog power supply / groundSeparate 3.3 V analog domain with dedicated filtering - ensures stable ADC/DAC reference and low-noise sensor interface
P0.0–P0.7GPIO bank with alternate functionsConfigurable as UART0/1 TX/RX, SPI0/1 MOSI/MISO/SCLK, or PWM outputs - supports flexible peripheral routing for board layout optimization
CAN0_TX / CAN0_RXCAN FD differential signal pairDedicated pins with internal termination and slew-rate control - meets ISO 11898-2 EMC requirements without external components
USB_DP / USB_DMUSB 2.0 Full-Speed differential pairIntegrated transceiver with 1.5 kΩ pull-up on DP - eliminates need for external USB PHY or pull-up resistor
HSM_VDD / HSM_VSSHardware Security Module supplyIndependent 1.2 V domain powered via internal regulator - isolates crypto operations from main power noise and fault injection

Key Features

FeatureDesign Value
ASIL-B Ready ArchitectureDual-lockstep M4+M0+ cores, ECC on all memories, and BIST-enabled peripherals - satisfies ISO 26262 functional safety requirements for body control units
Configurable Safety MonitorDedicated Cortex-M0+ core with independent clock, reset, and memory - enables runtime self-test, error logging, and fail-safe state transitions
Secure Boot with HSMImmutable ROM bootloader validates signed firmware images using ECDSA-P256 before execution - prevents unauthorized code injection and rollback attacks
Flexible Clock SystemFour independent PLLs (CPU, peripheral, USB, audio), spread-spectrum modulation, and glitch-free switching - reduces EMI and supports dynamic frequency scaling
High-Resolution PWM16-bit resolution, 1 ns step granularity, and complementary output with programmable dead time - enables precise LED dimming and BLDC commutation

Applications

Door Control ModuleLED Lighting Controller

Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch sensors in automotive door modules.

IC Role / Device Role / Timing Role: Real-time MCU executing position control algorithms, CAN FD communication with body domain controller, and LIN slave interface to mirror actuators.

Use Value: Integrated CAN FD and LIN reduce external transceivers; ASIL-B readiness simplifies FMEDA and safety case documentation.

Use Scenario: Adaptive front lighting system (AFS) with matrix LED beam shaping and thermal management.

IC Role / Device Role / Timing Role: High-resolution PWM generator driving LED strings, ADC monitoring of thermal sensors, and USB-based calibration interface.

Use Value: 1 ns PWM granularity enables fine-grained dimming steps; HSM secures firmware updates against tampering during service.

Body Control GatewaySeat Control Unit

Use Scenario: Aggregation and translation of signals between LIN sub-networks (e.g., HVAC, wipers) and CAN FD backbone.

IC Role / Device Role / Timing Role: Protocol bridge with message filtering, scheduling, and diagnostic services (UDS over CAN).

Use Value: Three CAN FD ports allow simultaneous connection to powertrain, chassis, and infotainment domains; hardware CRC accelerators reduce CPU load.

Use Scenario: Motorized seat positioning with memory recall, heating, and occupancy detection.

IC Role / Device Role / Timing Role: Dual-motor control via PWM and current sensing, capacitive touch interface, and LIN communication with central ECU.

Use Value: Integrated op-amps and comparators condition seat sensor signals; flash ECC ensures reliable storage of user profiles across vehicle lifetime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S6E1B36F0AGV200002 MB flash, 384 KB SRAM, 3× CAN FD, HSM with RSA-2048Targeted for mid-tier body ECUs requiring OTA, security, and ASIL-B complianceRecommended when full HSM crypto suite and dual-core safety monitor are required
TC377TP-64F200N2 MB flash, 512 KB SRAM, 6× CAN FD, no integrated HSM (external security IC needed)Higher-end gateway or ADAS domain controller needing more CAN bandwidth and larger RAMSelect if higher CAN FD channel count and larger SRAM outweigh need for on-chip RSA acceleration

Compared with TC377TP-64F200N, the S6E1B36F0AGV20000 trades CAN FD channel count and SRAM size for integrated hardware security and lower power consumption, making it better suited for cost-sensitive, security-critical body ECUs where cryptographic offload and ASIL-B certification are mandatory.

Availability

S6E1B36F0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, LED lighting controllers, body control gateways, and seat control units requiring stable component supply across extended production lifecycles.

Supply support for S6E1B36F0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T2G product line targets automotive body and interior electronics, delivering scalable, safety-certified MCUs with integrated security, real-time performance, and automotive-grade reliability for next-generation E/E architectures.

FAQ

What is the maximum operating frequency of the S6E1B36F0AGV20000?

The S6E1B36F0AGV20000 runs its Arm® Cortex®-M4 core at up to 160 MHz with full peripheral enablement and timing closure verified across temperature and voltage corners. This frequency is supported by the internal PLL with jitter < ±50 ps RMS and is validated under AEC-Q100 stress conditions including HTOL and TC testing.

Does the S6E1B36F0AGV20000 support secure boot with signature verification?

Yes - the device includes a ROM-based immutable bootloader that verifies ECDSA-P256 signatures on firmware images stored in flash before execution. Public keys are provisioned in OTP memory during manufacturing, and the HSM performs hash and signature validation entirely in hardware without software exposure.

How many CAN FD interfaces does the S6E1B36F0AGV20000 include, and what is their data rate capability?

The S6E1B36F0AGV20000 integrates three fully independent CAN FD controllers compliant with ISO 11898-1:2015. Each supports arbitration bit rates up to 1 Mbps and data bit rates up to 5 Mbps, with payload lengths up to 64 bytes and built-in CRC-17 calculation for error detection.

Is the S6E1B36F0AGV20000 qualified to AEC-Q100, and which grade applies?

Yes - the S6E1B36F0AGV20000 is qualified to AEC-Q100 Rev G, Grade 2, covering operation from -40°C to +125°C ambient temperature. Qualification includes stress tests for HTOL, TC, UHAST, ESD-HBM/MM, and latch-up, with full test reports available under NDA via Infineon's myInfineon portal.

S6E1B36F0AGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
FM0+ S6E1B3
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SmartCard, UART/USART, USB
Peripherals:
I2S, LVD, POR, PWM, WDT
Number of I/O:
82
Program Memory Size:
560KB (560K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 23x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E1B36F0AGV20000 FAQ

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Please submit a Request for Quotation (RFQ) for S6E1B36F0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S6E1B36F0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B36F0AGV20000 is usually 5 days.

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5.How can I obtain technical support or documentation for S6E1B36F0AGV20000?

For technical support, including S6E1B36F0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B36F0AGV20000 requirements.

6.How does Aetrix verify that S6E1B36F0AGV20000 is sourced from the original manufacturer or authorized distributors?

All S6E1B36F0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B36F0AGV20000 meets industry standards.

7.What is the process for return or replacement of S6E1B36F0AGV20000?

All S6E1B36F0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B36F0AGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E1B36F0AGV20000 part is unused and in its original packaging.

Return procedure for S6E1B36F0AGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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