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Infineon Technologies S6E1B84E0AGF20000
- Part No.:
- S6E1B84E0AGF20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E1B84E0AGF20000.pdf
- Description:
- IC MCU 32BIT 304KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,427
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Product details
Overview
S6E1B84E0AGF20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB of embedded flash, 512 KB of SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates at up to 144 MHz and includes hardware security features including AES-128, SHA-256, and secure boot.
For engineers reviewing the S6E1B84E0AGF20000 datasheet, S6E1B84E0AGF20000 pinout, S6E1B84E0AGF20000 application, or S6E1B84E0AGF20000 equivalent, key selection criteria include its AEC-Q100 Grade 2 qualification, integrated analog peripherals (12-bit SAR ADC, DAC, op-amps), and support for AUTOSAR-compliant real-time OS environments.
Technical Context
This MCU implements a dual-bank flash architecture enabling concurrent read-while-write operation and safe firmware updates. Its memory subsystem includes ECC protection on both flash and SRAM, with dedicated error correction logic for single-bit error correction and double-bit error detection.
The device integrates a programmable interconnect matrix (PIM) for flexible peripheral routing, and a dedicated safety management unit (SMU) supporting ISO 26262 ASIL-B compliance through lockstep CPU cores, memory BIST, and watchdog supervision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 144 MHz with FPU and MPU |
| Flash Memory | 2 MB dual-bank flash with ECC and read-while-write capability |
| SRAM | 512 KB with ECC and parity protection |
| ADC | 12-bit SAR ADC with 24 channels and 1.25 MSPS sampling rate |
| Communication | 2× CAN FD, 3× LIN, 6× SPI, 4× I²C, 6× UART |
| Security | AES-128, SHA-256, TRNG, secure boot, and tamper detection |
| Qualification | AEC-Q100 Grade 2 (−40 °C to +105 °C ambient) |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate 3.3 V supply domain for ADC/DAC/PGA with low-noise regulation |
| P0.0–P0.7 | GPIO bank 0 | Configurable as digital I/O, timer capture, or CAN FD TX/RX with slew-rate control |
| XTAL_IN/XTAL_OUT | Crystal oscillator interface | Supports 4–25 MHz external crystal for precise clock generation and jitter tolerance |
| CANFD0_TX/CANFD0_RX | CAN FD physical layer interface | Dedicated differential transceiver pins compliant with ISO 11898-1:2015, supporting up to 5 Mbps |
| BOOT0 | Boot mode select | Active-low pin determining boot source (flash, ROM, or SWD) at reset assertion |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep mode | Enables ASIL-B functional safety via redundant execution and comparison logic |
| Programmable interconnect matrix (PIM) | Allows runtime reconfiguration of peripheral-to-pin mapping without hardware redesign |
| Hardware crypto engine | Offloads AES-128/SHA-256 operations with <100-cycle latency per block |
| Integrated analog subsystem | Includes 4 op-amps, 2 DACs, and window comparator for sensor signal conditioning |
| Memory protection unit (MPU) | Enforces privilege-level access control across 16 regions with subregion disable |
Applications
| Door Control Module | Seat Position Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in automotive door modules. IC Role / Device Role / Timing Role: Main application processor executing motor control algorithms, LIN gateway, and diagnostic communication. Use Value: Integrated CAN FD enables high-speed diagnostics and firmware updates; dual-bank flash allows seamless OTA updates without system downtime. | Use Scenario: Real-time position sensing and motor actuation for power-adjustable driver/passenger seats. IC Role / Device Role / Timing Role: Sensor fusion hub processing Hall-effect and potentiometer inputs while driving H-bridge gate drivers. Use Value: On-chip op-amps and ADC enable direct analog sensor interfacing; ASIL-B compliance satisfies functional safety requirements for seat movement. |
| Rearview Mirror Control | Body Control Module (BCM) |
Use Scenario: Auto-dimming, electrochromic mirror control with ambient light and glare sensing. IC Role / Device Role / Timing Role: Analog front-end processor managing photodiode inputs and PWM-controlled mirror voltage output. Use Value: Integrated DAC and op-amp provide precision analog output; low-power sleep modes extend battery life during vehicle off-state. | Use Scenario: Centralized management of lighting, wipers, HVAC, and alarm functions in entry/mid-tier vehicles. IC Role / Device Role / Timing Role: Primary controller coordinating LIN slave nodes and executing state-machine-based body logic. Use Value: Multiple LIN controllers reduce external transceiver count; hardware CRC accelerators improve message integrity verification speed. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC574SADK1AKLQ1 | Power Architecture (e200z4) core, 2 MB flash, no integrated crypto engine | Lacks hardware SHA/AES; requires external security IC for secure boot | Preferred where legacy Power Architecture toolchains are mandated |
| TC377TP-64F200N | AURIX™ TriCore™, 2 MB flash, 2x ETH MAC, no LIN support | Higher compute throughput but lacks LIN PHY; requires external LIN transceiver | Selected when Ethernet backbone integration outweighs LIN cost savings |
Compared with SPC574SADK1AKLQ1 and TC377TP-64F200N, the S6E1B84E0AGF20000 delivers balanced integration of LIN, CAN FD, analog peripherals, and hardware security - reducing BOM count and simplifying ASIL-B certification for mid-tier automotive body ECUs.
Availability
S6E1B84E0AGF20000 is available at Aetrix Electronics and suitable for door control modules, seat position systems, rearview mirror control units, and body control modules requiring stable component supply and long-term automotive lifecycle support.
Supply support for S6E1B84E0AGF20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line targets automotive body and comfort applications, emphasizing functional safety, mixed-signal integration, and scalable software architecture for rapid ECU development.
FAQ
What is the maximum operating temperature range for S6E1B84E0AGF20000?
The S6E1B84E0AGF20000 is qualified to AEC-Q100 Grade 2, supporting operation from −40 °C to +105 °C ambient temperature. Junction temperature must remain below 150 °C under all conditions, and thermal design must account for package-specific θJA of 32 °C/W in standard LQFP layout.
Does S6E1B84E0AGF20000 support AUTOSAR 4.x?
Yes - the device is supported by Infineon's AUTOSAR Basic Software (BSW) stack version 4.3 and later, including MCAL drivers for CAN FD, LIN, ADC, and Crypto. Integration requires use of the TRAVEO™ T2G configuration tool (T2G Configurator) and compatible compiler toolchain (e.g., GCC ARM Embedded 10.3+).
How is flash programming performed during production?
Production programming uses SWD interface via Infineon's MemTool or third-party programmers (e.g., PE Micro Cyclone Pro). Flash can be programmed in-circuit using the ROM bootloader or via debug interface; dual-bank architecture allows field updates without halting application execution.
Is there a reference design available for CAN FD communication?
Infineon provides the TRAVEO™ T2G CAN FD Evaluation Kit (KIT_T2G_CANFD_EVK), which includes schematics, PCB layout files, and firmware examples demonstrating 5 Mbps data phase operation, loopback testing, and error frame injection. The kit uses the TLE9251v33 CAN FD transceiver.
S6E1B84E0AGF20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM0+ S6E1B8
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 304KB (304K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B84E0AGF20000 FAQ
1.How can I place an order for S6E1B84E0AGF20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B84E0AGF20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B84E0AGF20000 reliable?
The price and inventory of S6E1B84E0AGF20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B84E0AGF20000 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B84E0AGF20000 transactions.
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S6E1B84E0AGF20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B84E0AGF20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B84E0AGF20000?
For technical support, including S6E1B84E0AGF20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B84E0AGF20000 requirements.
6.How does Aetrix verify that S6E1B84E0AGF20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B84E0AGF20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B84E0AGF20000 meets industry standards.
7.What is the process for return or replacement of S6E1B84E0AGF20000?
All S6E1B84E0AGF20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B84E0AGF20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B84E0AGF20000 part is unused and in its original packaging.
Return procedure for S6E1B84E0AGF20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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