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Infineon Technologies S6E1B84E0AGV20000

Part No.:
S6E1B84E0AGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixS6E1B84E0AGV20000.pdf
Description:
IC MCU 32BIT 304KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,876

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Product details

Overview

S6E1B84E0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB of embedded flash, 384 KB of SRAM, supports CAN FD and LIN interfaces, and operates across -40°C to 125°C ambient temperature with ASIL-B functional safety capability.

For engineers reviewing the S6E1B84E0AGV20000 datasheet, S6E1B84E0AGV20000 pinout, S6E1B84E0AGV20000 application, or S6E1B84E0AGV20000 equivalent, this MCU delivers deterministic real-time control, hardware-accelerated cryptographic functions (AES-128/256, SHA-256), and configurable safety mechanisms including lockstep CPU cores and memory ECC - critical for door modules, lighting controllers, and seat control units.

Technical Context

The S6E1B84E0AGV20000 implements a dual-core lockstep configuration with two Arm® Cortex®-M4F CPUs running at up to 160 MHz, each with independent FPU and MPU. It includes a dedicated Safety Management Unit (SMU) that monitors clock, voltage, and memory integrity via built-in self-test (BIST) and error injection logic.

Peripheral integration includes 4x CAN FD controllers with time-triggered communication support, 8x LINFlexD modules, 2x SENT receivers, and a programmable high-resolution timer (HRT) subsystem capable of sub-microsecond timing resolution for PWM generation and sensor synchronization.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M4F dual-core lockstep, 160 MHz max - enables ASIL-B compliance via redundant execution and comparison
Flash Memory2 MB embedded flash with ECC and read-while-write capability - supports secure firmware updates and dual-bank operation
SRAM384 KB on-chip SRAM with ECC and parity protection - ensures data integrity in safety-critical variables and stack usage
Operating Temp-40°C to +125°C ambient - qualified for under-hood and interior automotive environments per AEC-Q100 Grade 2
CAN FD Support4x CAN FD controllers with ISO 11898-1:2015 compliance - enables high-bandwidth diagnostics and ECU-to-ECU communication up to 5 Mbps
Crypto AccelerationHardware AES-128/256, SHA-256, TRNG - offloads security processing to meet UNECE R155 CSMS requirements without CPU overhead

Pinout & Package

Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDA_3P3Analog supply (3.3 V)Powers ADC, DAC, and analog comparators; requires local 100 nF decoupling for noise immunity
PA0–PA31General-purpose I/O bank AConfigurable as GPIO, UART, SPI, or CAN FD signals; supports slew-rate control and pull-up/down
CANFD0_TX / CANFD0_RXCAN FD channel 0 differential pairDirect connection to external CAN transceiver; supports bit rates up to 5 Mbps with flexible data phase timing
CLKINExternal crystal input (1–20 MHz)Drives internal PLL for system clock generation; supports fail-safe switch to internal RC oscillator on loss
RESET_NActive-low reset inputAsynchronous reset signal with internal pull-up; compatible with external watchdog ICs and power-on reset circuits

Key Features

FeatureDesign Value
Dual-core lockstep executionReal-time fault detection via hardware comparator; meets ISO 26262 ASIL-B requirements without software intervention
Programmable HRT subsystem16-channel high-resolution timer with 1 ns resolution - enables precise PWM edge placement for LED dimming and motor commutation
Secure boot with immutable ROM loaderVerifies signature of boot image using ECDSA-P256 before execution - prevents unauthorized firmware loading
Configurable SMU with BISTMonitors CPU, memory, and peripheral health during runtime; triggers safe state transition on detected failure

Applications

Door Control ModuleLED Lighting Controller

Use Scenario: Centralized control of power windows, locks, mirrors, and intrusion detection sensors in automotive door assemblies.

IC Role / Device Role / Timing Role: Main application controller managing LIN slave devices, monitoring Hall-effect and capacitive touch inputs, and executing anti-pinch algorithms.

Use Value: Dual-core lockstep ensures functional safety compliance while HRT enables synchronized PWM for mirror heater control and LED status indicators.

Use Scenario: Adaptive front lighting system (AFS) and rear combination lamp control with dynamic dimming and diagnostics.

IC Role / Device Role / Timing Role: Primary lighting controller interfacing with LED drivers via SPI, processing CAN FD commands, and performing thermal derating based on internal temperature sensor readings.

Use Value: Hardware crypto acceleration secures OTA updates; 160 MHz CPU handles real-time PWM modulation for flicker-free dimming across 64+ LED channels.

Seat Position ControlBody Domain Controller

Use Scenario: Motorized seat adjustment with position memory, lumbar support, and heating elements controlled via CAN FD network.

IC Role / Device Role / Timing Role: Real-time motion controller coordinating up to 4 DC motors using SENT feedback and current sensing via integrated ADC.

Use Value: On-chip 384 KB SRAM with ECC stores seat profiles and motor calibration data; CAN FD interface enables fast parameter upload during service mode.

Use Scenario: Central body controller managing door, lighting, wiper, and HVAC subsystems in modern vehicle architectures.

IC Role / Device Role / Timing Role: Domain master coordinating inter-subsystem communication via multiple CAN FD buses and LIN clusters with time-synchronized event handling.

Use Value: Dual M4F cores allow separation of safety-critical (ASIL-B) and non-safety tasks; SMU ensures continuous monitoring of communication stack health.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S6E2CC4E0AGV20000Same TRAVEO™ T2G family but with 4 MB flash, 512 KB SRAM, and additional Ethernet MAC - no CAN FD supportTargeted at gateway or domain controller roles requiring network bridging, not body actuationSelect when Ethernet connectivity and larger code space outweigh CAN FD need
TC377TP-64F200NAURIX™ TC3xx TriCore™ MCU with 2 MB flash, 384 KB RAM, and 3x CAN FD - lacks integrated HRT and SENT receiversUsed in powertrain and chassis domains where lockstep TriCore architecture is preferred over Cortex-M4Choose for legacy AURIX toolchain compatibility and higher ASIL-D readiness

Compared with S6E1B84E0AGV20000, the S6E2CC4E0AGV20000 trades CAN FD for Ethernet and larger memory, while the TC377TP offers TriCore-based ASIL-D scalability at the cost of reduced timing precision and no SENT support - making the S6E1B84E0AGV20000 optimal for cost-sensitive, CAN FD–centric body applications.

Availability

S6E1B84E0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, LED lighting controllers, seat position systems, and body domain controllers requiring stable component supply across extended production lifecycles.

Supply support for S6E1B84E0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D facilities.

This device belongs to the TRAVEO™ T2G automotive microcontroller product line, engineered specifically for body electronics applications demanding functional safety, real-time responsiveness, and robust communication interfaces in harsh automotive environments.

FAQ

What is the maximum operating frequency of the S6E1B84E0AGV20000?

The S6E1B84E0AGV20000 features two Arm® Cortex®-M4F cores operating synchronously at up to 160 MHz. This frequency is achievable under full voltage (3.3 V) and within the specified ambient temperature range (-40°C to +125°C), with all peripherals enabled and configured for maximum performance.

Does the S6E1B84E0AGV20000 support JTAG debugging?

Yes, the S6E1B84E0AGV20000 supports SWD (Serial Wire Debug) and JTAG interfaces via dedicated pins (TCK, TMS, TDI, TDO, TRES). Debug access is secured by a configurable debug authentication mechanism that can disable JTAG/SWD after boot unless authorized via secure key exchange.

How is functional safety implemented in this MCU?

Functional safety is implemented through hardware-enforced dual-core lockstep execution, Safety Management Unit (SMU) with BIST, ECC on flash and SRAM, and dedicated safety peripherals including windowed watchdog timers and clock/frequency monitors. These features collectively support ISO 26262 ASIL-B compliance out-of-the-box.

Can the S6E1B84E0AGV20000 operate without an external crystal?

Yes - the device includes an internal 12 MHz RC oscillator usable as the main clock source. However, for CAN FD timing accuracy and ASIL-B compliance, an external crystal (1–20 MHz) is required to drive the PLL; the internal RC oscillator serves only as fallback during crystal failure or low-power modes.

S6E1B84E0AGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
FM0+ S6E1B8
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SmartCard, UART/USART, USB
Peripherals:
I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
304KB (304K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E1B84E0AGV20000 FAQ

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All S6E1B84E0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B84E0AGV20000 meets industry standards.

7.What is the process for return or replacement of S6E1B84E0AGV20000?

All S6E1B84E0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B84E0AGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E1B84E0AGV20000 part is unused and in its original packaging.

Return procedure for S6E1B84E0AGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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