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Infineon Technologies S6E1B84EHAGF20000
- Part No.:
- S6E1B84EHAGF20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E1B84EHAGF20000.pdf
- Description:
- IC MCU 32BIT 304KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,713
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Product details
Overview
S6E1B84EHAGF20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash memory, 384 KB SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates at up to 144 MHz, includes hardware encryption (AES-128/256, SHA-256), and features ASIL-B compliant safety mechanisms.
For engineers reviewing the S6E1B84EHAGF20000 datasheet, S6E1B84EHAGF20000 pinout, S6E1B84EHAGF20000 application, or S6E1B84EHAGF20000 equivalent, this MCU is selected for gate control modules, smart junction boxes, and lighting control units requiring functional safety, secure boot, and real-time deterministic response in 12 V automotive systems.
Technical Context
The S6E1B84EHAGF20000 implements a dual-core safety architecture with lockstep CPU monitoring and memory built-in self-test (MBIST). It integrates a dedicated Safety Management Unit (SMU) supporting ISO 26262 ASIL-B decomposition across core, memory, and peripheral domains.
Its peripheral set includes a 12-bit ADC with 24 channels, 4x PWM timers with dead-time insertion, 2x CAN FD controllers with flexible data-rate support up to 5 Mbps, and a configurable serial communication unit (SCU) supporting UART, SPI, and I²C in shared pin configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 144 MHz - enables real-time motor control loops and sensor fusion with FPU and DSP extensions. |
| Flash Memory | 2 MB embedded flash with ECC and read-while-write capability - supports dual-bank operation for safe OTA updates. |
| SRAM | 384 KB on-chip SRAM with parity/ECC - accommodates large real-time task stacks and safety-critical buffers. |
| CAN FD Support | 2x CAN FD controllers, 5 Mbps data phase - meets modern E/E architecture requirements for high-bandwidth body domain communication. |
| Safety Certification | ISO 26262 ASIL-B compliant - validated via FMEDA and diagnostic coverage reports for system-level safety integration. |
| Cryptographic Acceleration | Dedicated AES-128/256, SHA-256, TRNG - enables secure boot, firmware authentication, and key management without CPU overhead. |
| Operating Voltage | 2.7 V to 5.5 V supply range - compatible with 12 V automotive battery systems including cold-crank (4.5 V min) and load-dump transients. |
Pinout & Package
The S6E1B84EHAGF20000 is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad for enhanced thermal dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.15 | General-purpose I/O with interrupt capability | Configurable as GPIO, UART0 RX/TX, SPI0 MISO/MOSI, or CAN0 TX/RX - supports multiplexing for board-level signal routing flexibility. |
| P1.0–P1.7 | Analog input / ADC channel inputs | Direct connection to 12-bit SAR ADC with internal reference - used for voltage sensing, temperature monitoring, and potentiometer interface. |
| P2.0–P2.3 | CAN FD transceiver interface | Dedicated differential CANH/CANL pins with integrated termination resistors - reduces external component count for CAN FD node implementation. |
| VDDA/VSSA | Analog power supply/ground | Independent analog domain supply - isolates sensitive ADC and PLL circuits from digital switching noise for <1 LSB INL error. |
| BOOT0 | Boot mode selection | Pull-up/pull-down configuration determines boot source (embedded flash, system memory, or external SPI flash) - critical for production programming and recovery sequences. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Module (HSM) | Integrated HSM with secure boot ROM, key storage, and cryptographic acceleration - eliminates need for external secure element in entry-level automotive ECUs. |
| Dual-Core Lockstep Monitor | Real-time comparison of primary and shadow Cortex-M4 cores with automatic fault detection and NMI assertion - satisfies ASIL-B diagnostic coverage targets without software polling. |
| Configurable Serial Communication Unit (SCU) | Single peripheral block supporting UART/SPI/I²C with dynamic pin mapping - reduces PCB layer count by consolidating protocol interfaces onto shared pins. |
| Temperature Sensor with Calibration | On-die sensor calibrated across -40°C to 125°C with ±2.5°C accuracy - enables thermal derating and junction temperature monitoring without external components. |
| Flexible Power Modes | Multiple low-power states (Sleep, Deep Sleep, Standby) with wake-up via CAN, GPIO, or RTC - achieves <15 µA standby current for always-on body control functions. |
Applications
| Smart Junction Box | LED Headlamp Control |
|---|---|
|
Use Scenario: Centralized power distribution unit managing 12–24 switched loads in modern vehicle architectures. IC Role / Device Role / Timing Role: Main system controller executing load scheduling, short-circuit protection, and CAN FD-based diagnostics. Use Value: Dual-core lockstep and ASIL-B compliance enable functional safety certification without external watchdogs or redundant MCUs. |
Use Scenario: Adaptive front-lighting system (AFS) controlling matrix LED arrays with dynamic beam shaping. IC Role / Device Role / Timing Role: Real-time PWM generator and CAN FD gateway coordinating with camera and radar subsystems. Use Value: Hardware-accelerated AES/SHA enables secure firmware updates for lighting algorithms while maintaining <100 µs PWM jitter. |
| Power Door Lock Actuator | Seat Position Memory Module |
|
Use Scenario: Motor-driven door latch control with anti-pinch detection and LIN bus communication. IC Role / Device Role / Timing Role: Motor driver interface controller with integrated ADC for current sensing and position feedback. Use Value: On-chip 12-bit ADC with hardware oversampling delivers <±0.5% current measurement accuracy for reliable stall detection. |
Use Scenario: Non-volatile seat position storage and recall using EEPROM emulation and LIN command handling. IC Role / Device Role / Timing Role: Secure parameter manager storing user profiles with encrypted flash sectors and tamper-resistant keys. Use Value: Embedded 2 MB flash with ECC and wear leveling supports >100,000 write cycles for seat memory without external EEPROM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E1B84EHAGF10000 | Same die, reduced flash (1 MB) and SRAM (256 KB); no HSM cryptographic engine | Limited to non-security-critical applications such as basic window lift control without OTA update requirements | Select when cost sensitivity outweighs need for secure boot or cryptographic services. |
| TC377TP-64F200N | AURIX™ TriCore™ MCU with higher ASIL-D capability, triple-lockstep core, but larger 176-pin LQFP package and higher BOM cost | Targeted at ADAS domain controllers where multi-core redundancy and higher safety integrity are mandatory | Choose only if ASIL-D compliance and >200 MHz real-time performance are required - over-spec for body electronics. |
Compared with S6E1B84EHAGF10000, this part adds security and memory headroom for future-proofing; versus TC377TP, it offers optimal cost-performance balance for ASIL-B body control without unnecessary complexity or footprint.
Availability
S6E1B84EHAGF20000 is available at Aetrix Electronics and suitable for smart junction boxes, LED headlamp control units, and power door lock actuators requiring stable component supply, long-term automotive qualification, and full lifecycle traceability.
Supply support for S6E1B84EHAGF20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the TRAVEO™ T2G family - engineered specifically for automotive body electronics, offering scalable performance, functional safety, and secure connectivity in compact packages for cost-sensitive ECU designs.
FAQ
What is the maximum operating junction temperature for S6E1B84EHAGF20000?
The S6E1B84EHAGF20000 is qualified for operation up to +125°C junction temperature per AEC-Q100 Grade 2 specification. Thermal design must maintain TJ ≤ 125°C under worst-case ambient and power dissipation conditions, with the exposed thermal pad soldered to a minimum 4-layer PCB with ≥4 thermal vias for effective heat transfer.
Does S6E1B84EHAGF20000 support JTAG debugging in production environments?
Yes - the device supports SWD (Serial Wire Debug) and JTAG interfaces via dedicated pins (TCK, TMS, TDI, TDO, nTRST). Debug access can be permanently disabled via fuse programming after production testing to prevent unauthorized firmware extraction or modification.
Can the internal flash be used for EEPROM emulation?
Yes - Infineon provides certified Flash EEPROM Emulation (FEE) middleware that leverages the 2 MB flash with wear-leveling and atomic write operations. It supports up to 100,000 erase/write cycles per logical sector and maintains data integrity during power loss events.
Is CAN FD physical layer transceiver included on-chip?
No - the S6E1B84EHAGF20000 integrates CAN FD protocol controllers only. An external CAN FD transceiver (e.g., TJA1044T/3) must be used for physical layer signaling, with proper termination and common-mode choke placement per ISO 11898-2:2016 requirements.
S6E1B84EHAGF20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM0+ S6E1B8
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 304KB (304K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B84EHAGF20000 FAQ
1.How can I place an order for S6E1B84EHAGF20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B84EHAGF20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B84EHAGF20000 reliable?
The price and inventory of S6E1B84EHAGF20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B84EHAGF20000 is usually 5 days.
3.What payment methods are accepted for S6E1B84EHAGF20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B84EHAGF20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E1B84EHAGF20000?
S6E1B84EHAGF20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B84EHAGF20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B84EHAGF20000?
For technical support, including S6E1B84EHAGF20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B84EHAGF20000 requirements.
6.How does Aetrix verify that S6E1B84EHAGF20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B84EHAGF20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B84EHAGF20000 meets industry standards.
7.What is the process for return or replacement of S6E1B84EHAGF20000?
All S6E1B84EHAGF20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B84EHAGF20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B84EHAGF20000 part is unused and in its original packaging.
Return procedure for S6E1B84EHAGF20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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