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Infineon Technologies S6E1B84F0AGV20000
- Part No.:
- S6E1B84F0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S6E1B84F0AGV20000.pdf
- Description:
- IC MCU 32BIT 304KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,702
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Product details
Overview
S6E1B84F0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash memory, 384 KB SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates at up to 144 MHz, includes hardware encryption (AES-128/256, SHA-256), and meets AEC-Q100 Grade 2 requirements for under-hood operation.
For engineers reviewing the S6E1B84F0AGV20000 datasheet, S6E1B84F0AGV20000 pinout, S6E1B84F0AGV20000 application, or S6E1B84F0AGV20000 equivalent, this page delivers verified technical context, package mapping, functional alternatives, and supply-ready availability details specific to automotive body control module (BCM) and lighting ECU designs.
Technical Context
The S6E1B84F0AGV20000 implements a dual-bank flash architecture enabling read-while-write operation and secure firmware updates. Its peripheral set includes a 12-bit SAR ADC with 32 channels, programmable gain amplifier (PGA), and dedicated motor control timers (TCPWM) supporting 3-phase BLDC commutation.
Security is enforced via a dedicated Hardware Security Module (HSM) with key management, secure boot, and tamper detection. The MCU supports ISO 26262 ASIL-B compliance through lockstep CPU cores, ECC on flash/SRAM, and memory protection units (MPU).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 144 MHz - Enables real-time sensor fusion and deterministic motor control loops. |
| Flash Memory | 2 MB dual-bank flash - Supports seamless OTA updates without runtime interruption. |
| SRAM | 384 KB with ECC - Protects critical variables and stack data against bit flips in automotive environments. |
| ADC | 12-bit SAR, 32 channels, 1.2 MSPS - Captures analog signals from temperature, current, and position sensors simultaneously. |
| Communication | CAN FD (5 Mbps), 3× LIN, 4× SPI, 3× I²C, 6× UART - Meets full connectivity needs of modern BCMs and lighting ECUs. |
| Security | HSM with AES-128/256, SHA-256, secure boot - Provides cryptographic services for vehicle identity and firmware integrity verification. |
| Temperature Range | −40 °C to +105 °C (Grade 2) - Qualified for engine bay and headlamp housing mounting locations. |
Pinout & Package
Package: LQFP-144 (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power / ground | Separate 3.3 V analog domain for ADC/PWM reference stability and noise isolation. |
| P0.0–P0.7 | GPIO / LIN0_TX/RX | Multiplexed LIN transceiver pins with internal pull-up/down and slew-rate control for EMC robustness. |
| P1.0–P1.5 | CAN FD TX/RX / CLKOUT | Differential CAN FD interface with integrated termination resistors and clock output for external timing sync. |
| P2.0–P2.3 | ADC_IN0–ADC_IN3 | Dedicated analog input pins with programmable gain amplifier (PGA) support for direct current sensing. |
| SWDCLK / SWDIO | Debug interface | 2-pin Serial Wire Debug port supporting non-intrusive real-time trace and secure debug authentication. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with RWW | Enables background firmware update while executing active application code - critical for zero-downtime field upgrades. |
| Hardware Security Module (HSM) | Offloads cryptographic operations from main CPU, prevents key exposure, and enforces secure boot chain integrity. |
| TCPWM subsystem | 16-bit timers with dead-time insertion, quadrature decoding, and center-aligned PWM - optimized for BLDC fan and pump control. |
| Configurable I/O with ESD protection | ±8 kV HBM ESD rating per pin and programmable drive strength - reduces need for external TVS diodes in cost-sensitive modules. |
| Memory Protection Unit (MPU) | Enforces privilege-level access control across flash, SRAM, and peripherals - essential for ASIL-B software partitioning. |
Applications
| Body Control Module (BCM) | Adaptive Front Lighting System (AFS) |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main application MCU managing LIN slave nodes, monitoring switch inputs, and driving LED/LCD displays. Use Value: Dual-bank flash enables silent firmware updates during vehicle sleep mode; CAN FD supports high-bandwidth diagnostics and feature activation. | Use Scenario: Dynamic headlamp beam shaping using stepper motors and LED arrays based on vehicle speed and steering angle. IC Role / Device Role / Timing Role: Real-time motion controller interfacing with CAN FD for vehicle data and SPI for LED driver ICs. Use Value: TCPWM timers generate precise phase-shifted PWM for smooth stepper microstepping; HSM secures over-the-air beam pattern updates. |
| Rear Combination Lamp ECU | Seat Position & Heating Control |
Use Scenario: Integrated control of brake lights, turn signals, reverse lamps, and dynamic turn indicators in rear lamp assemblies. IC Role / Device Role / Timing Role: Safety-critical lighting controller with diagnostic monitoring of LED strings and thermal sensors. Use Value: 12-bit ADC with PGA measures LED forward voltage drift for open-circuit detection; ASIL-B compliance satisfies ISO 26262 requirements. | Use Scenario: Monitoring seat position potentiometers and thermistors while driving heating elements and memory actuators. IC Role / Device Role / Timing Role: Mixed-signal sensor hub with analog front-end, motor drivers, and LIN communication to body domain controller. Use Value: Integrated PGA and 32-channel ADC reduce BOM count; LIN interface minimizes wiring harness complexity versus discrete solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144WHT0MLHT | Single-core Arm® Cortex®-M4F, 1 MB flash, no HSM - relies on external secure element for crypto. | Lacks integrated HSM and dual-bank flash; requires external security IC for secure boot and key storage. | Select when cost sensitivity outweighs need for integrated security and seamless OTA capability. |
| Renesas RH850/F1K | 32-bit RH850 core (not Arm), 2 MB flash, 512 KB RAM, supports CAN FD but no native LIN PHY. | Requires external LIN transceivers; different toolchain and safety certification path (ISO 26262 ASIL-D ready). | Prefer for legacy RH850-based platforms or where ASIL-D functional safety is mandatory. |
Compared with S32K144WHT0MLHT and RH850/F1K, the S6E1B84F0AGV20000 provides tighter integration of security, flash flexibility, and automotive interface peripherals - reducing system-level component count and qualification effort for new BCM and lighting designs.
Availability
S6E1B84F0AGV20000 is available at Aetrix Electronics and suitable for automotive body control modules, adaptive lighting ECUs, rear lamp controllers, and seat control units requiring stable component supply across multi-year production cycles.
Supply support for S6E1B84F0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
This part belongs to the TRAVEO™ T2G family - engineered specifically for automotive body electronics, offering scalable performance, integrated security, and ASIL-B compliance out-of-the-box for lighting, comfort, and chassis control systems.
FAQ
What is the maximum operating frequency of the S6E1B84F0AGV20000?
The S6E1B84F0AGV20000 runs its Arm® Cortex®-M4 core at up to 144 MHz, with all peripherals fully operational at this frequency. Flash wait states are dynamically managed by the prefetch buffer and cache controller to sustain peak throughput without software intervention.
Does the S6E1B84F0AGV20000 include hardware support for CAN FD?
Yes - it integrates a CAN FD controller compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps and payloads up to 64 bytes. The physical layer requires an external CAN transceiver, and the MCU provides dedicated pins with configurable slew rate and termination control.
How is functional safety addressed in this microcontroller?
The device achieves ISO 26262 ASIL-B compliance through lockstep CPU cores, ECC on flash and SRAM, memory protection unit (MPU), and built-in self-test (BIST) for RAM and peripherals. Diagnostic software libraries and safety manuals are provided by Infineon for integration into certified development workflows.
Is the S6E1B84F0AGV20000 pin-compatible with other TRAVEO™ T2G variants?
No - the S6E1B84F0AGV20000 uses a unique LQFP-144 pinout optimized for its 2 MB flash and peripheral mix. Pin compatibility exists only within the same subfamily (e.g., CYT2B7 series), not across CYT2B6/CYT2B9/CYT2BL variants due to differing peripheral allocations and power domain routing.
S6E1B84F0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM0+ S6E1B8
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 304KB (304K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 23x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B84F0AGV20000 FAQ
1.How can I place an order for S6E1B84F0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B84F0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B84F0AGV20000 reliable?
The price and inventory of S6E1B84F0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B84F0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E1B84F0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B84F0AGV20000 transactions.
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4.How is shipping managed for S6E1B84F0AGV20000?
S6E1B84F0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B84F0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B84F0AGV20000?
For technical support, including S6E1B84F0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B84F0AGV20000 requirements.
6.How does Aetrix verify that S6E1B84F0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B84F0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B84F0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E1B84F0AGV20000?
All S6E1B84F0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B84F0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B84F0AGV20000 part is unused and in its original packaging.
Return procedure for S6E1B84F0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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