Infineon Technologies S6E1B84FHAGV20000
- Part No.:
- S6E1B84FHAGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S6E1B84FHAGV20000.pdf
- Description:
- IC MCU 32BIT 304KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,420
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Product details
Overview
S6E1B84FHAGV20000 from Infineon is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller for automotive body electronics, featuring 2 MB embedded flash, 512 KB SRAM, CAN FD, LIN, and up to 144 GPIOs in a 176-pin LQFP package. It supports ASIL-B functional safety per ISO 26262 and operates across -40°C to 125°C ambient.
For engineers reviewing the S6E1B84FHAGV20000 datasheet, S6E1B84FHAGV20000 pinout, S6E1B84FHAGV20000 application, or S6E1B84FHAGV20000 equivalent, key selection criteria include CAN FD interface count, flash ECC configuration, SRAM retention mode support, and qualification for automotive AEC-Q100 Grade 2.
Technical Context
This MCU integrates dual-core lockstep capability for safety-critical body control modules, with dedicated hardware accelerators for CRC, encryption (AES-128/256), and secure boot. Its memory subsystem includes error correction code (ECC) on both flash and SRAM, plus parity protection on peripheral registers.
The device implements a multi-layer AHB/APB bus matrix with configurable access rights, supports up to 16 priority levels per interrupt, and includes a programmable watchdog timer with windowed mode and independent clock source.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 160 MHz with FPU and DSP extensions |
| Flash Memory | 2 MB embedded flash with ECC, sector erase, and read-while-write capability |
| SRAM | 512 KB on-chip SRAM with ECC and configurable retention modes |
| Communication Interfaces | 4× CAN FD, 4× LIN, 6× SPI, 4× I²C, 4× UART, 1× USB 2.0 FS |
| Safety Features | ASIL-B compliant per ISO 26262, lockstep CPU, memory BIST, and safety monitor unit |
| Package | 176-pin LQFP (24 × 24 mm, 0.5 mm pitch), AEC-Q100 Grade 2 qualified |
| Operating Temperature | -40°C to +125°C ambient, suitable for under-hood and cabin body control units |
Pinout & Package
Package: 176-pin LQFP (24 × 24 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved heat dissipation in automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Dedicated 3.3 V analog domain with filtering for ADC/DAC reference stability |
| P0.0–P0.31 | GPIO bank 0 | Configurable as digital I/O, CAN FD TX/RX, or LIN transceiver pins with slew-rate control |
| OSC_IN / OSC_OUT | External crystal oscillator input/output | Supports 4–20 MHz crystals for precise clock generation; internal PLL achieves 160 MHz system clock |
| BOOT0 / BOOT1 | Boot mode selection | Hardware-configured boot source: embedded flash, system memory, or SRAM for field firmware recovery |
| VDDIO_1 / VSSIO_1 | I/O power supply / ground | Independent 1.8–3.6 V I/O domain enabling mixed-voltage interface with sensors and actuators |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with Public Key Verification | Enables authenticated firmware loading using ECDSA-P256 signatures, preventing unauthorized code execution |
| Dual-Core Lockstep Operation | Redundant M4 cores compare results cycle-by-cycle; mismatch triggers safe state entry within ≤10 µs |
| Peripheral Protection Unit (PPU) | Configurable memory-mapped access control for peripherals, enforcing privilege-level isolation between SW modules |
| Flexible Clock Generation | Four independent clock sources (PLL, FLL, RC, external) with failover switching and glitch-free reconfiguration |
| ADC with Hardware Oversampling | 12-bit SAR ADC with up to 16x oversampling ratio and built-in decimation filter for noise reduction |
Applications
| Door Control Module | Seat Position Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting via LIN/CAN FD network. IC Role / Device Role / Timing Role: Primary MCU executing real-time motor control, sensor fusion (hall effect, potentiometer), and diagnostics. Use Value: Integrated CAN FD enables high-bandwidth communication with gateway; SRAM retention preserves seat position during ignition-off. | Use Scenario: Motorized adjustment of seat fore/aft, recline, lumbar, and headrest positions with position feedback. IC Role / Device Role / Timing Role: Safety-aware motor controller with ASIL-B-compliant current sensing, PWM generation, and stall detection. Use Value: Dual-core lockstep ensures fault-tolerant motor sequencing; flash ECC prevents corruption of calibration data across vehicle lifetime. |
| Rearview Mirror Control | Body Control Module (BCM) |
Use Scenario: Auto-dimming electrochromic mirror with ambient light and glare sensing, plus fold/unfold actuation. IC Role / Device Role / Timing Role: Sensor hub aggregating photodiode inputs, driving mirror driver ICs, and managing LIN communication to cluster. Use Value: Hardware CRC accelerator offloads checksum computation from CPU; low-power sleep modes extend battery life in parked state. | Use Scenario: Centralized management of lighting, wipers, HVAC, and door functions across multiple vehicle domains. IC Role / Device Role / Timing Role: Main BCM processor handling CAN FD message routing, power state coordination, and diagnostic event logging. Use Value: 2 MB flash stores multiple firmware variants and OTA update images; secure boot prevents malicious payload injection during updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E1B84FHAGV10000 | Same die, reduced flash (1 MB) and SRAM (256 KB); identical pinout and peripheral set | Suitable for cost-sensitive modules with smaller firmware footprint and fewer concurrent tasks | Select when full 2 MB flash and 512 KB SRAM are not required to reduce BOM cost |
| TC377TP-64F200N | AURIX™ TC3xx family; TriCore™ core, 200 MHz, 4 MB flash, 1.5 MB RAM, higher ASIL-D capability | Targeted at safety-critical chassis/ADAS domains requiring higher integrity level and more complex control loops | Choose for systems needing ASIL-D compliance or advanced motor control algorithms beyond body domain scope |
Compared with S6E1B84FHAGV10000, this part provides double flash/SRAM capacity for future-proofing and feature-rich software stacks; versus TC377TP, it offers lower power consumption and optimized peripheral mix for non-safety-critical body functions without ASIL-D overhead.
Availability
S6E1B84FHAGV20000 is available at Aetrix Electronics and suitable for automotive door modules, seat control units, rearview mirror systems, and centralized body control modules requiring stable component supply across extended production lifecycles.
Supply support for S6E1B84FHAGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
S6E1B84FHAGV20000 belongs to the TRAVEO™ T2G family-designed specifically for automotive body electronics with integrated safety, security, and mixed-signal capabilities for centralized and distributed control units.
FAQ
What is the maximum operating frequency of the S6E1B84FHAGV20000?
The S6E1B84FHAGV20000 runs its Arm® Cortex®-M4F core at up to 160 MHz, sustained across the full -40°C to +125°C temperature range with appropriate voltage scaling. This frequency is achieved using the internal PLL driven by an external 20 MHz crystal, and all peripherals remain fully functional at this speed without timing violations.
Does the S6E1B84FHAGV20000 support CAN FD with flexible data rate?
Yes, the device integrates four independent CAN FD controllers compliant with ISO 11898-1:2015, supporting arbitration bit rates up to 1 Mbps and data bit rates up to 5 Mbps. Each controller includes dedicated message RAM with hardware acceptance filtering and transmit/receive FIFOs for deterministic real-time messaging.
How is functional safety implemented in this MCU?
Functional safety is implemented via hardware-enforced mechanisms including dual-core lockstep execution, ECC on flash and SRAM, memory BIST, peripheral protection unit (PPU), and a dedicated safety monitor unit that independently verifies clock, reset, and voltage domains. These features collectively enable ASIL-B compliance per ISO 26262 without requiring external safety components.
What debug interfaces are supported for development and production testing?
The MCU supports JTAG and SWD debug interfaces via dedicated pins, with full support for real-time trace using the Embedded Trace Macrocell (ETM). Production testing leverages boundary scan (IEEE 1149.1) and on-chip self-test routines accessible through the debug port, enabling automated test coverage for solder joint integrity and logic functionality.
S6E1B84FHAGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM0+ S6E1B8
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 304KB (304K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 23x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B84FHAGV20000 FAQ
1.How can I place an order for S6E1B84FHAGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B84FHAGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B84FHAGV20000 reliable?
The price and inventory of S6E1B84FHAGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B84FHAGV20000 is usually 5 days.
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S6E1B84FHAGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B84FHAGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B84FHAGV20000?
For technical support, including S6E1B84FHAGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B84FHAGV20000 requirements.
6.How does Aetrix verify that S6E1B84FHAGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B84FHAGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B84FHAGV20000 meets industry standards.
7.What is the process for return or replacement of S6E1B84FHAGV20000?
All S6E1B84FHAGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B84FHAGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B84FHAGV20000 part is unused and in its original packaging.
Return procedure for S6E1B84FHAGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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