Infineon Technologies S6E1B86E0AGF20000
- Part No.:
- S6E1B86E0AGF20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E1B86E0AGF20000.pdf
- Description:
- IC MCU 32BIT 560KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,240
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Product details
Overview
S6E1B86E0AGF20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, CAN FD, LIN, and configurable analog/digital peripherals. The device operates at up to 144 MHz and supports AEC-Q100 Grade 2 qualification for under-hood use.
For engineers reviewing the S6E1B86E0AGF20000 datasheet, S6E1B86E0AGF20000 pinout, S6E1B86E0AGF20000 application, or S6E1B86E0AGF20000 equivalent, key selection criteria include its dual-core safety support, hardware-based CRC acceleration, configurable I/O voltage domains (1.8 V / 3.3 V), and integrated CAN FD transceivers with wake-on-CAN capability.
Technical Context
This MCU implements a single Arm® Cortex®-M4 core with FPU and MPU, paired with a dedicated safety monitor core (Cortex-M0+). It features a multi-layer AHB/APB bus matrix, deterministic interrupt latency down to 12 cycles, and hardware-assisted memory protection including lock-step execution monitoring.
The device includes a programmable analog front-end (PAFE) with 12-bit SAR ADC, configurable op-amps, and comparators, plus digital signal processing blocks for real-time sensor fusion. Its clock system supports multiple PLLs with spread-spectrum modulation and failsafe clock switching between internal RC and external crystal sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 144 MHz with FPU and MPU - enables real-time control with floating-point math and memory isolation |
| Flash Memory | 2 MB embedded flash with ECC and read-while-write - supports secure firmware updates and dual-bank operation |
| SRAM | 384 KB on-chip SRAM with parity/ECC - provides robust data storage for safety-critical variables |
| CAN FD Interfaces | 3x CAN FD controllers with integrated transceivers - allows high-bandwidth diagnostics and ECU communication up to 5 Mbps |
| Operating Temp | AEC-Q100 Grade 2 (−40 °C to +105 °C) - qualified for engine bay and passenger compartment deployment |
| Package | LQFP-176 (24 × 24 mm, 0.5 mm pitch) - standard automotive-compatible footprint with thermal pad for power dissipation |
| Supply Voltage | 2.7 V to 5.5 V main supply - simplifies integration with 3.3 V and 5 V automotive subsystems |
Pinout & Package
LQFP-176 package with exposed thermal pad; 176-pin quad flat pack with 0.5 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | Separate 3.3 V rail for ADC/PAFE - reduces noise coupling into precision analog circuits |
| VSSA | Analog ground | Dedicated analog return path - maintains signal integrity for 12-bit ADC measurements |
| P0.0–P0.7 | GPIO bank 0 | Configurable as UART/CAN/LIN/ADC inputs - enables flexible peripheral mapping without PCB redesign |
| XTAL_IN / XTAL_OUT | Crystal oscillator interface | Supports 4–25 MHz external crystal - provides precise timing reference for CAN FD bit rate accuracy |
| RESET_N | Active-low reset input | Asynchronous reset with internal pull-up - ensures reliable initialization during power ramp-up |
| BOOT0 | Boot mode select | Configures boot source (flash/ROM/UART) at power-on - enables field firmware recovery via serial interface |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CRC Engine | Accelerates checksum calculation for flash verification and CAN FD frame CRC - reduces CPU load by >95% vs. software implementation |
| Configurable I/O Voltage | Per-port voltage selection (1.8 V / 3.3 V) - eliminates level-shifters when interfacing with legacy sensors or new low-voltage ICs |
| Dual-Core Safety Monitor | Dedicated Cortex-M0+ core validates M4 execution in lock-step - meets ASIL-B requirements without external watchdog IC |
| Programmable Analog Front-End | Integrated op-amps, comparators, and 12-bit SAR ADC - replaces discrete signal conditioning circuitry for temperature/pressure sensing |
| Wake-on-CAN FD | Low-power CAN FD receiver wakes CPU from deep sleep - extends battery life in always-on vehicle modules |
Applications
| Door Control Module | Seat Position Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in modern vehicle door modules. IC Role / Device Role / Timing Role: Main application controller executing motor drive logic, LIN slave communication, and fault detection algorithms. Use Value: Integrated CAN FD enables fast diagnostic uploads; PAFE reduces BOM count by replacing external op-amp and comparator ICs. | Use Scenario: Real-time adjustment and memory retention of electric seat position using potentiometers and Hall-effect sensors. IC Role / Device Role / Timing Role: Sensor acquisition hub with ADC oversampling, EEPROM emulation, and LIN master interface to body control module. Use Value: Hardware CRC and ECC ensure reliable seat position storage across 100k+ cycles; 105 °C rating supports under-seat mounting near heaters. |
| Rearview Mirror Control | Smart Lighting Interface |
Use Scenario: Auto-dimming electrochromic mirror with ambient light sensing, glare detection, and memory recall. IC Role / Device Role / Timing Role: Signal processor for photodiode inputs, PWM driver for mirror tinting, and CAN FD node for vehicle network synchronization. Use Value: Configurable I/O voltage allows direct connection to 1.8 V ambient light sensors; wake-on-CAN FD enables instant response to headlight activation commands. | Use Scenario: Adaptive interior lighting control with RGB LED dimming, occupancy sensing, and color temperature tuning. IC Role / Device Role / Timing Role: LED driver coordinator with PWM generation, current sensing, and LIN communication to lighting control unit. Use Value: Dual-core architecture isolates lighting animation tasks from safety-critical functions; integrated op-amps condition IR proximity sensor signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E1B86E0AGF20000 | 2 MB flash, 384 KB SRAM, 3× CAN FD, AEC-Q100 Grade 2 | Targeted for mid-tier body ECUs requiring extended memory and dual-core safety | Preferred for new designs needing future-proof flash capacity and integrated CAN FD transceivers |
| TRAVEO™ T2G CYT2B7 series (e.g., CYT2B756-64FMI) | 1 MB flash, 256 KB SRAM, 2× CAN FD, same core and peripheral set | Optimized for cost-sensitive entry-level body modules with lower code footprint | Select when flash requirement is ≤1 MB and CAN FD channel count is ≤2 |
Compared with CYT2B756-64FMI, S6E1B86E0AGF20000 offers 100% more flash and 50% more SRAM for complex feature sets, while maintaining identical peripheral compatibility and safety architecture-making it suitable for scalable platform designs where memory headroom and future OTA updates are critical.
Availability
S6E1B86E0AGF20000 is available at Aetrix Electronics and suitable for automotive door modules, seat position controllers, rearview mirror systems, and smart interior lighting requiring stable component supply and long-term lifecycle support.
Supply support for S6E1B86E0AGF20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line targets automotive body electronics with integrated safety, connectivity, and analog capabilities-designed specifically for centralized domain controllers in modern vehicle architectures.
FAQ
What is the maximum operating frequency of the S6E1B86E0AGF20000?
The S6E1B86E0AGF20000 runs its Arm® Cortex®-M4 core at up to 144 MHz, with all peripherals fully operational at this speed. This frequency is achieved using the on-chip PLL with external crystal input (4–25 MHz), and the device maintains timing compliance across its full AEC-Q100 Grade 2 temperature range (−40 °C to +105 °C).
Does S6E1B86E0AGF20000 include hardware security features?
Yes-it integrates a hardware cryptographic accelerator supporting AES-128/256, SHA-256, and RSA-2048, plus secure boot with immutable root-of-trust stored in one-time-programmable (OTP) memory. These features enable secure firmware authentication and encrypted over-the-air (OTA) updates compliant with ISO/SAE 21434 requirements.
Can S6E1B86E0AGF20000 operate without an external crystal?
Yes-the device includes an internal 12 MHz RC oscillator with ±2% accuracy, sufficient for LIN and low-speed CAN operation. However, CAN FD at 5 Mbps requires the external crystal (typically 20 MHz) to meet bit-timing jitter specifications; the internal RC is not rated for high-speed CAN FD timing accuracy.
Is there a development board available for S6E1B86E0AGF20000?
Infineon provides the KIT_XMC1400_2GO evaluation kit for early software prototyping, though it uses the XMC1400 (Cortex-M0). For full S6E1B86E0AGF20000 validation, the official TRAVEO™ T2G Starter Kit (KIT_TRVY_T2G_SK) is required-it includes debug interface, CAN FD transceivers, and expansion headers matching the LQFP-176 pinout.
S6E1B86E0AGF20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM0+ S6E1B8
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 560KB (560K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B86E0AGF20000 FAQ
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6.How does Aetrix verify that S6E1B86E0AGF20000 is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of S6E1B86E0AGF20000?
All S6E1B86E0AGF20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B86E0AGF20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B86E0AGF20000 part is unused and in its original packaging.
Return procedure for S6E1B86E0AGF20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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