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Infineon Technologies S6E1B86E0AGV20000

Part No.:
S6E1B86E0AGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixS6E1B86E0AGV20000.pdf
Description:
IC MCU 32BIT 560KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,835

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Product details

Overview

S6E1B86E0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash memory, 384 KB SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates at up to 144 MHz, includes hardware encryption (AES-128/256, SHA-256), and meets AEC-Q100 Grade 2 requirements for operation from −40 °C to +105 °C.

For engineers reviewing the S6E1B86E0AGV20000 datasheet, S6E1B86E0AGV20000 pinout, S6E1B86E0AGV20000 application, or S6E1B86E0AGV20000 equivalent, key selection criteria include its dual-bank flash with SWAP support for safe OTA updates, configurable safety monitor (CSM) for ASIL-B compliance, and integrated analog front-end with 12-bit SAR ADC (up to 24 channels) and comparators.

Technical Context

This MCU implements a dual-core lockstep configuration option for functional safety, with optional ECC on both flash and SRAM. Its peripheral set includes a programmable high-resolution PWM (HRPWM) module with 150 ps resolution, a dedicated CAN FD controller supporting ISO 11898-1:2015, and a flexible serial communication unit (SCU) enabling simultaneous UART/LIN/CAN FD operation on shared pins.

The device uses Infineon's proprietary TRAVEO™ T2G architecture with tightly coupled memory subsystems, including 64 KB instruction TCM and 32 KB data TCM. Boot ROM supports secure boot with public-key verification (RSA-2048), and the debug interface complies with ARM CoreSight™ standards while supporting SWD and JTAG with secure debug authentication.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M4 @ up to 144 MHz with FPU and MPU
Flash Memory2 MB dual-bank flash with SWAP for atomic firmware updates
SRAM384 KB total: 256 KB general-purpose + 128 KB TCM (64 KB ITCM + 64 KB DTCM)
Operating Temp−40 °C to +105 °C (AEC-Q100 Grade 2 qualified)
SecurityHardware AES-128/256, SHA-256, RSA-2048, secure boot ROM, debug authentication
Analog Peripherals12-bit SAR ADC (24 channels, 1.2 MSPS), 4x comparators, 2x DACs (12-bit)
Communication3× CAN FD, 6× UART/LIN, 4× SPI, 4× I²C, USB 2.0 FS

Pinout & Package

Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0.0–P0.31General-purpose I/O with alternate functionsConfigurable as GPIO, UART, SPI, CAN, PWM, ADC input, or comparator input
VDDA/VSSAAnalog power supply/groundIndependent 3.3 V analog domain with dedicated filtering for ADC/DAC stability
XTAL1/XTAL2External crystal oscillator terminalsSupports 1–25 MHz crystals for precise clock generation; internal PLL achieves 144 MHz system clock
TCK/TMS/TDO/TDIJTAG/SWD debug interfaceARM CoreSight™-compliant debug port with secure authentication capability
VDDIO_1/VDDIO_2I/O power domainsDual 1.8–3.6 V I/O banks enable mixed-voltage interfacing (e.g., 1.8 V sensor + 3.3 V CAN transceiver)

Key Features

FeatureDesign Value
Dual-bank flash with SWAPEnables zero-downtime firmware updates via atomic bank switching without external memory
Configurable Safety Monitor (CSM)Hardware watchdog with independent clock source and configurable timeout for ASIL-B diagnostic coverage
High-resolution PWM (HRPWM)150 ps resolution with dead-time insertion and fault protection for motor control timing precision
Secure Boot ROMImmutable boot code verifying RSA-2048 signatures before executing user firmware
Flexible Serial Communication Unit (SCU)Time-shared pin mapping allows concurrent UART, LIN, and CAN FD on overlapping pins with automatic protocol detection

Applications

Door Control ModuleSeat Control Unit

Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch sensors in automotive door modules.

IC Role / Device Role / Timing Role: Main application MCU managing real-time motor control, LIN communication to body ECU, and secure diagnostics.

Use Value: Integrated HRPWM and LIN PHY reduce BOM count; dual-bank flash enables field-upgradable window calibration profiles.

Use Scenario: Position memory, heating control, and massage actuation in premium automotive seating systems.

IC Role / Device Role / Timing Role: Safety-aware controller coordinating multi-axis motor sequencing, temperature monitoring, and CAN FD status reporting.

Use Value: CSM and ECC RAM ensure ASIL-B compliance for seat position retention; 12-bit ADC resolves thermistor-based heater feedback with ±0.5 °C accuracy.

Rearview Mirror ControlLighting Control Module

Use Scenario: Auto-dimming electrochromic mirror with glare sensing, fold/unfold actuation, and compass integration.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating ambient light, vehicle speed, and gyro data to drive mirror voltage control loop.

Use Value: Hardware crypto accelerates secure OTA updates for glare algorithm improvements; 24-channel ADC samples multiple photodiodes simultaneously.

Use Scenario: Adaptive LED headlight beam shaping using matrix LED drivers and camera-based object detection.

IC Role / Device Role / Timing Role: Coordination MCU translating camera ROI commands into PWM dimming patterns across 16+ LED strings.

Use Value: 150 ps HRPWM resolution enables fine-grained current control per LED segment; CAN FD ensures sub-50 µs latency for dynamic beam cutoff.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S6E1B86E0AGV10000Same die, reduced flash (1 MB) and SRAM (256 KB); no SWAP supportLimited to single-image boot; unsuitable for OTA-capable modulesSelect when cost-sensitive designs omit field updates and require smaller memory footprint
TC377TP-64F200NAURIX™ TC3xx family; TriCore™ core, 200 MHz, 4 MB flash, safety-focused architectureHigher ASIL-D readiness, more complex safety certification path, larger package (LQFP-176 same but higher pin count variants)Prefer for chassis/safety-critical functions requiring full ISO 26262 toolchain support

Compared with S6E1B86E0AGV10000, this part adds OTA resilience via dual-bank flash; versus TC377TP, it trades ASIL-D infrastructure for lower cost and simpler tooling-ideal for non-safety-critical body nodes where CAN FD bandwidth and secure boot suffice.

Availability

S6E1B86E0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, seat control units, rearview mirror systems, and adaptive lighting control requiring stable component supply and long-term lifecycle assurance.

Supply support for S6E1B86E0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing operations.

The TRAVEO™ T2G product line targets automotive body electronics, delivering scalable Arm®-based MCUs with integrated analog peripherals, functional safety features, and automotive-grade reliability for centralized control modules.

FAQ

What is the maximum operating frequency of the S6E1B86E0AGV20000?

The S6E1B86E0AGV20000 runs its Arm® Cortex®-M4 core at up to 144 MHz, achieved via an internal PLL fed by either the internal RC oscillator or an external crystal (1–25 MHz). This frequency is fully supported across the entire specified temperature range (−40 °C to +105 °C) and voltage range (2.7–5.5 V).

Does this MCU support secure over-the-air (OTA) firmware updates?

Yes-it features dual-bank flash memory with hardware-supported SWAP functionality, enabling atomic firmware updates without runtime interruption. Combined with secure boot ROM verifying RSA-2048 signatures and hardware AES encryption, it provides end-to-end integrity and confidentiality for OTA deployments in automotive environments.

Which communication protocols does the S6E1B86E0AGV20000 natively support?

The MCU integrates three CAN FD controllers compliant with ISO 11898-1:2015, six UART/LIN channels, four SPI interfaces, four I²C buses, and USB 2.0 Full-Speed. Its Flexible Serial Communication Unit (SCU) allows time-multiplexed use of shared pins across UART, LIN, and CAN FD protocols without external logic.

Is the S6E1B86E0AGV20000 qualified for automotive use?

Yes-the device is AEC-Q100 qualified to Grade 2 (−40 °C to +105 °C), includes built-in ECC on flash and SRAM, a configurable safety monitor (CSM), and hardware cryptographic accelerators aligned with ISO 26262 ASIL-B requirements for automotive body electronics applications.

S6E1B86E0AGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
80-LQFP
Series:
FM0+ S6E1B8
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SmartCard, UART/USART, USB
Peripherals:
I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
560KB (560K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E1B86E0AGV20000 FAQ

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Please submit a Request for Quotation (RFQ) for S6E1B86E0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S6E1B86E0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B86E0AGV20000 is usually 5 days.

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5.How can I obtain technical support or documentation for S6E1B86E0AGV20000?

For technical support, including S6E1B86E0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B86E0AGV20000 requirements.

6.How does Aetrix verify that S6E1B86E0AGV20000 is sourced from the original manufacturer or authorized distributors?

All S6E1B86E0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B86E0AGV20000 meets industry standards.

7.What is the process for return or replacement of S6E1B86E0AGV20000?

All S6E1B86E0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B86E0AGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E1B86E0AGV20000 part is unused and in its original packaging.

Return procedure for S6E1B86E0AGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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