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Infineon Technologies S6E1B86EHAGV20000
- Part No.:
- S6E1B86EHAGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E1B86EHAGV20000.pdf
- Description:
- IC MCU 32BIT 560KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,790
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Product details
Overview
S6E1B86EHAGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, dual CAN FD controllers, 4x LIN transceivers, and hardware security (HSM) supporting AES-128/256, SHA-256, and RSA-2048. It operates across -40°C to 125°C and supports ASIL-B functional safety per ISO 26262.
For engineers reviewing the S6E1B86EHAGV20000 datasheet, S6E1B86EHAGV20000 pinout, S6E1B86EHAGV20000 application, or S6E1B86EHAGV20000 equivalent, key selection criteria include CAN FD bandwidth, HSM cryptographic acceleration, flash ECC coverage, and ASIL-B compliance for gateway and domain controller designs.
Technical Context
This MCU implements a dual-core lockstep configuration with optional split-mode operation for mixed-safety domains. Its memory subsystem includes error-correcting code (ECC) on both flash and SRAM, with dedicated parity protection for peripheral registers.
The device integrates a programmable analog front-end (PAFE) with 12-bit SAR ADCs, configurable comparators, and op-amps - enabling sensor signal conditioning without external components in lighting and HVAC control nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 160 MHz with FPU and DSP extensions - enables real-time motor control and sensor fusion algorithms. |
| Flash Memory | 2 MB embedded flash with ECC and 128-bit read interface - supports secure OTA updates and dual-bank swapping. |
| SRAM | 384 KB on-chip SRAM with ECC and parity - accommodates large runtime buffers and safety-critical data structures. |
| CAN FD Interfaces | 2 × CAN FD controllers (up to 5 Mbps data phase) - meets automotive gateway bandwidth requirements for E/E architecture scaling. |
| Security Engine | Hardware Security Module (HSM) with AES-128/256, SHA-256, RSA-2048, and true random number generator - fulfills UNECE R155 CSMS cryptographic needs. |
| Functional Safety | ASIL-B compliant per ISO 26262:2018 Part 5 - includes BIST, lockstep CPU, memory ECC, and diagnostic firmware library. |
| Operating Temp | -40°C to +125°C ambient - qualified for under-hood and zone-controller mounting locations. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | GPIO / CAN0_TX / LIN0_TX | Multi-function I/O bank with configurable slew rate and pull-up/down - supports LIN physical layer signaling and CAN dominant/recessive state drive. |
| P1.0–P1.5 | CAN1_RX / CAN1_TX / HSM_CLK / HSM_RST | Dedicated HSM interface pins with internal clock gating - isolates security domain timing from main CPU clock tree. |
| P2.0–P2.3 | ADC0_IN0–ADC0_IN3 | Analog input channels with 12-bit resolution and hardware averaging - used for potentiometer, thermistor, and current-sense amplifier interfacing. |
| VDDA / VSSA | Analog Power / Ground | Separate analog supply domain (3.3 V ± 5%) with dedicated filtering pads - ensures <1 LSB INL error in ADC measurements. |
| BOOT0 / BOOT1 | Boot Mode Selection | Strap pins sampled at reset to select boot source (embedded flash, SPI flash, or UART DFU) - enables field recovery without debugger access. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep mode | Enables ASIL-B fault detection via instruction-level comparison - reduces need for external watchdog ICs in safety-critical gateways. |
| Programmable Analog Front-End (PAFE) | Configurable op-amp/comparator/ADC blocks reduce external analog components by up to 40% in HVAC actuator modules. |
| Hardware Security Module (HSM) | Offloads cryptographic operations from main CPU - maintains >95% CPU bandwidth for application tasks during secure boot and key exchange. |
| Flexible Clock Generation Unit (CGU) | Four independent PLLs with spread-spectrum modulation - suppresses EMI peaks in infotainment-adjacent body control units. |
| Peripheral Crossbar Switch (PXS) | Dynamic routing of DMA channels to peripherals - eliminates bus contention during concurrent CAN FD, LIN, and ADC data acquisition. |
Applications
| Automotive Gateway Controller | Body Control Module (BCM) |
|---|---|
Use Scenario: Aggregating signals from door modules, lighting, and HVAC across multiple CAN FD and LIN networks in mid-tier vehicles. IC Role / Device Role / Timing Role: Central domain controller executing network bridging, message filtering, and power mode arbitration. Use Value: Dual CAN FD interfaces handle 5 Mbps backbone traffic while HSM secures firmware updates - eliminating need for discrete security co-processor. | Use Scenario: Managing exterior lighting, window lift, seat position, and mirror control in premium sedan platforms. IC Role / Device Role / Timing Role: Real-time actuator driver with deterministic PWM generation and LIN slave response latency < 100 µs. Use Value: Integrated PAFE conditions sensor inputs directly - reducing BOM count by 3 op-amps and 2 comparators per BCM. |
| Electronic Parking Brake (EPB) Actuator | Smart Junction Box (SJB) |
Use Scenario: Controlling dual-motor parking brake calipers with torque monitoring and fail-safe release logic. IC Role / Device Role / Timing Role: Safety-certified motor controller with ASIL-B runtime diagnostics and dual-channel current sensing. Use Value: On-chip ECC flash and lockstep CPU meet ISO 26262 ASIL-B requirements - avoiding external safety monitor ICs. | Use Scenario: Distributing 12 V power to 16+ loads with electronic fusing, load diagnosis, and LIN-based configuration. IC Role / Device Role / Timing Role: High-integration power management node with integrated high-side drivers and current sense ADCs. Use Value: 384 KB SRAM hosts full diagnostic stack including short-circuit logging and thermal derating tables - no external RAM required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E1B86EHAGV10000 | Same die, reduced flash (1 MB) and SRAM (256 KB); identical pinout and peripheral set. | Limited to non-gateway BCMs without OTA update storage or multi-domain routing. | Select when cost-sensitive body nodes require no dual-bank flash or extended diagnostic buffers. |
| TC377TP-64F200N | AURIX™ TC3xx family; TriCore™ core, 200 MHz, 4 MB flash, but lacks integrated LIN transceivers and PAFE. | Better suited for powertrain or ADAS where CAN FD + FlexRay dominate; requires external LIN PHY. | Choose for higher-performance safety-critical applications needing ASIL-D support and more flash, accepting added BOM complexity. |
Compared with S6E1B86EHAGV10000, this variant adds 1 MB flash and 128 KB SRAM for secure OTA and richer diagnostics; versus TC377TP, it trades raw compute for integrated LIN/PAFE - optimizing for body domain integration over powertrain scalability.
Availability
S6E1B86EHAGV20000 is available at Aetrix Electronics and suitable for automotive gateway controllers, body control modules, electronic parking brake actuators, and smart junction boxes requiring stable component supply and long-term lifecycle assurance.
Supply support for S6E1B86EHAGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D centers.
The TRAVEO™ T2G product line targets automotive body electronics, delivering scalable Arm®-based MCUs with integrated analog, communication, and security features for domain controllers and distributed ECUs.
FAQ
What is the maximum operating frequency of the S6E1B86EHAGV20000 CPU core?
The Arm® Cortex®-M4F core runs at a maximum frequency of 160 MHz, verified across the full temperature range (-40°C to +125°C) and supply voltage (3.0 V to 3.6 V). This frequency is sustained using the on-chip PLL with spread-spectrum modulation to meet automotive EMC requirements without external clock sources.
Does the S6E1B86EHAGV20000 support secure boot with public-key verification?
Yes - the integrated Hardware Security Module (HSM) performs RSA-2048 signature verification during boot using keys stored in one-time-programmable (OTP) memory. The HSM validates the authenticity and integrity of the boot image before transferring control to the application firmware.
How many LIN physical layer transceivers are integrated into the S6E1B86EHAGV20000?
The device integrates four LIN transceivers compliant with LIN 2.2A and SAE J2602. Each transceiver supports wake-up detection, short-to-battery protection, and configurable baud rates from 1.2 kbps to 20 kbps - eliminating need for external LIN PHY ICs in multi-node body networks.
Is the S6E1B86EHAGV20000 qualified for ASIL-B according to ISO 26262:2018?
Yes - Infineon certifies the S6E1B86EHAGV20000 for ASIL-B (Part 5) with documented failure modes, diagnostic coverage metrics (>90% for CPU and memory), and safety manual covering FMEDA, FIT rate (120 FIT), and safe failure fraction (SFF = 98.2%). Full qualification evidence is provided in the official safety package.
S6E1B86EHAGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM0+ S6E1B8
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 65
- Program Memory Size:
- 560KB (560K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B86EHAGV20000 FAQ
1.How can I place an order for S6E1B86EHAGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B86EHAGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E1B86EHAGV20000 reliable?
The price and inventory of S6E1B86EHAGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B86EHAGV20000 is usually 5 days.
3.What payment methods are accepted for S6E1B86EHAGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E1B86EHAGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E1B86EHAGV20000?
S6E1B86EHAGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E1B86EHAGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E1B86EHAGV20000?
For technical support, including S6E1B86EHAGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B86EHAGV20000 requirements.
6.How does Aetrix verify that S6E1B86EHAGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B86EHAGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B86EHAGV20000 meets industry standards.
7.What is the process for return or replacement of S6E1B86EHAGV20000?
All S6E1B86EHAGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B86EHAGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B86EHAGV20000 part is unused and in its original packaging.
Return procedure for S6E1B86EHAGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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