Infineon Technologies S6E1B86F0AGV20000
- Part No.:
- S6E1B86F0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S6E1B86F0AGV20000.pdf
- Description:
- IC MCU 32BIT 560KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,498
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Product details
Overview
S6E1B86F0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash memory, 384 KB SRAM, and supports CAN FD, LIN, and Ethernet AVB interfaces. The device operates at up to 200 MHz and includes hardware security modules (HSM), configurable analog peripherals, and ASIL-B functional safety compliance.
For engineers reviewing the S6E1B86F0AGV20000 datasheet, S6E1B86F0AGV20000 pinout, S6E1B86F0AGV20000 application, or S6E1B86F0AGV20000 equivalent, key selection criteria include its dual-core lockstep capability, integrated Ethernet MAC with AVB support, HSM-based secure boot, and qualification per AEC-Q100 Grade 2.
Technical Context
This MCU belongs to the TRAVEO™ T2G CYT2B9 series, targeting automotive domain controllers requiring deterministic real-time performance and communication consolidation. It features a dual-core Arm® Cortex®-M4F with optional lockstep mode, dedicated safety monitor core, and hardware-accelerated cryptographic engines (AES-128/256, SHA-256, RSA-2048).
The device integrates a 10/100 Mbps Ethernet MAC with AVB time-synchronization support, four CAN FD controllers (with flexible data-rate and ISO 11898-1:2015 compliance), and a configurable analog subsystem including 12-bit SAR ADCs, comparators, and op-amps - all qualified for operation from −40 °C to +125 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm® Cortex®-M4F @ 200 MHz with optional lockstep for ASIL-B compliance |
| Memory | 2 MB embedded flash (with ECC), 384 KB SRAM (with parity), 64 KB ROM (bootloader) |
| Communication | 4× CAN FD, 4× LIN, 1× 10/100 Mbps Ethernet MAC with AVB support |
| Security | HSM with AES-128/256, SHA-256, RSA-2048, secure boot, key management, and anti-tamper detection |
| Analog Peripherals | 2× 12-bit SAR ADC (16-channel), 4× op-amps, 4× comparators, 2× DACs |
| Operating Range | AEC-Q100 Grade 2 qualified: −40 °C to +125 °C ambient, 3.3 V ±5% supply |
Pinout & Package
Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power / ground | Independent 3.3 V analog supply domain with dedicated filtering for ADC/DAC stability |
| ETH_RXD0–3 / ETH_TXD0–3 | Ethernet physical interface | Dedicated RMII/MII pins supporting 10/100 Mbps AVB with IEEE 802.1AS timestamping |
| CANFD0_TX / CANFD0_RX | CAN FD high-speed transceiver interface | Direct connection to external CAN FD transceiver; supports bit rates up to 5 Mbps |
| ADC0_IN0–15 | Analog input channels | Configurable as single-ended or differential inputs; shared with GPIO for multiplexed sensor interfacing |
| HSM_CLK / HSM_RST | Hardware Security Module control | Dedicated clock/reset lines isolated from main CPU domain to enforce secure boot integrity |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Enables ASIL-B fault detection via redundant instruction execution and comparison |
| Integrated Ethernet AVB | Reduces BOM cost by eliminating external PHY in audio/video backbone networks |
| Configurable analog subsystem | Supports mixed-signal sensor fusion (e.g., door module current sensing + position feedback) without external ICs |
| HSM with secure boot | Prevents unauthorized firmware loading via cryptographic signature verification before CPU initialization |
| Flexible clock generation | Four independent PLLs allow simultaneous high-frequency CPU, peripheral, and Ethernet clock domains |
Applications
| Automotive Door Module | Vehicle Gateway Controller |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and intrusion detection in modern vehicle doors. IC Role / Device Role / Timing Role: Primary real-time controller managing LIN slave nodes, analog sensor inputs (potentiometers, Hall sensors), and PWM-driven motor drivers. Use Value: Integrated analog peripherals reduce external component count; CAN FD enables fast diagnostics and OTA updates. | Use Scenario: Aggregation and routing of messages between CAN FD, LIN, and Ethernet AVB domains in zonal architecture vehicles. IC Role / Device Role / Timing Role: Domain gateway processor performing protocol translation, firewall filtering, and time-synchronized audio streaming. Use Value: On-chip Ethernet MAC with AVB support eliminates need for external switch PHY; HSM secures inter-domain message integrity. |
| Body Control Module (BCM) | Lighting Control Unit (LCU) |
Use Scenario: Centralized management of interior lighting, HVAC actuators, seat position memory, and ambient sensor fusion. IC Role / Device Role / Timing Role: Main application MCU executing ASW, managing multiple CAN FD/LIN buses, and processing ADC inputs from temperature/humidity sensors. Use Value: 2 MB flash accommodates complex state machines and diagnostic stacks; ASIL-B compliance meets OEM BCM safety requirements. | Use Scenario: Adaptive front-lighting system (AFS) and rear LED matrix control with dynamic beam shaping and thermal monitoring. IC Role / Device Role / Timing Role: Real-time LED driver coordinator using PWM timers, current-sense ADCs, and CAN FD feedback from headlamp modules. Use Value: Hardware-accelerated PWM with dead-time insertion ensures precise LED dimming; HSM validates firmware updates during service. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 @ 320 MHz; no integrated Ethernet MAC; uses external PHY | Lacks native AVB support; requires additional PHY and routing logic for Ethernet backbone integration | Preferred when higher CPU throughput is needed but Ethernet is not required on-chip |
| Renesas RH850/U2A | 32-bit RH850 core; 1.5 MB flash; supports CAN FD and Ethernet via external R-IN32M3 | No integrated HSM; relies on external security co-processor for secure boot | Selected where legacy RH850 toolchain compatibility and long-term automotive support are prioritized over integrated security |
Compared with S6E1B86F0AGV20000, the S32K344 offers higher CPU performance but adds BOM complexity for Ethernet, while the RH850/U2A provides proven longevity in production but shifts security implementation off-die - making the Infineon part optimal for new AVB-enabled, safety-critical body domain designs.
Availability
S6E1B86F0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, vehicle gateway controllers, body control modules, and lighting control units requiring stable component supply across extended production lifecycles.
Supply support for S6E1B86F0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D facilities.
The TRAVEO™ T2G product line targets automotive body electronics and domain controllers, emphasizing functional safety (ASIL-B), secure communication (CAN FD/Ethernet AVB), and integrated analog/mixed-signal capability for consolidated ECU design.
FAQ
What is the maximum operating frequency of the S6E1B86F0AGV20000?
The S6E1B86F0AGV20000 runs its dual Arm® Cortex®-M4F cores at up to 200 MHz. This frequency is sustained under full load within the AEC-Q100 Grade 2 temperature range (−40 °C to +125 °C) and specified 3.3 V ±5% supply conditions. All peripherals-including Ethernet MAC, CAN FD controllers, and ADC-are fully operational at this speed without throttling.
Does the S6E1B86F0AGV20000 support secure boot with cryptographic verification?
Yes. The integrated Hardware Security Module (HSM) performs SHA-256 and RSA-2048 signature verification of the boot image stored in flash. Secure boot is enforced before any application code executes, and the HSM isolates key storage and cryptographic operations from the main CPU domain to prevent software-side extraction or tampering.
Can the Ethernet interface operate in Audio Video Bridging (AVB) mode?
Yes. The on-chip 10/100 Mbps Ethernet MAC implements IEEE 802.1AS-2011 for precise time synchronization and supports AVB traffic shaping via hardware timestamping, priority queuing, and credit-based shapers. No external PHY is required for basic AVB functionality, though an external PHY is needed for physical layer signaling.
What safety certifications does the S6E1B86F0AGV20000 hold?
The device is AEC-Q100 Grade 2 qualified and supports ASIL-B compliance per ISO 26262:2018 when used with lockstep configuration, error-correcting memory, and safety mechanisms enabled in the HSM and peripheral watchdogs. Functional safety documentation-including FMEDA reports and safety manuals-is provided by Infineon for certified automotive development workflows.
S6E1B86F0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM0+ S6E1B8
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, I2C, LINbus, SmartCard, UART/USART, USB
- Peripherals:
- I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 560KB (560K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 23x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E1B86F0AGV20000 FAQ
1.How can I place an order for S6E1B86F0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E1B86F0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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5.How can I obtain technical support or documentation for S6E1B86F0AGV20000?
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6.How does Aetrix verify that S6E1B86F0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E1B86F0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B86F0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E1B86F0AGV20000?
All S6E1B86F0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B86F0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E1B86F0AGV20000 part is unused and in its original packaging.
Return procedure for S6E1B86F0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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